FR2871292B1 - METHOD FOR DEPOSITING HIGH DIELECTRIC CONSTANT FILM USING TETRAKIS (EHTYLAMINO) SILANE - Google Patents
METHOD FOR DEPOSITING HIGH DIELECTRIC CONSTANT FILM USING TETRAKIS (EHTYLAMINO) SILANEInfo
- Publication number
- FR2871292B1 FR2871292B1 FR0451101A FR0451101A FR2871292B1 FR 2871292 B1 FR2871292 B1 FR 2871292B1 FR 0451101 A FR0451101 A FR 0451101A FR 0451101 A FR0451101 A FR 0451101A FR 2871292 B1 FR2871292 B1 FR 2871292B1
- Authority
- FR
- France
- Prior art keywords
- ehtylamino
- tetrakis
- silane
- dielectric constant
- high dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0451101A FR2871292B1 (en) | 2004-06-03 | 2004-06-03 | METHOD FOR DEPOSITING HIGH DIELECTRIC CONSTANT FILM USING TETRAKIS (EHTYLAMINO) SILANE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0451101A FR2871292B1 (en) | 2004-06-03 | 2004-06-03 | METHOD FOR DEPOSITING HIGH DIELECTRIC CONSTANT FILM USING TETRAKIS (EHTYLAMINO) SILANE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2871292A1 FR2871292A1 (en) | 2005-12-09 |
FR2871292B1 true FR2871292B1 (en) | 2006-07-28 |
Family
ID=34946055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0451101A Expired - Fee Related FR2871292B1 (en) | 2004-06-03 | 2004-06-03 | METHOD FOR DEPOSITING HIGH DIELECTRIC CONSTANT FILM USING TETRAKIS (EHTYLAMINO) SILANE |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2871292B1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10689405B2 (en) | 2017-11-30 | 2020-06-23 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Titanium-containing film forming compositions for vapor deposition of titanium-containing films |
US10584039B2 (en) | 2017-11-30 | 2020-03-10 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Titanium-containing film forming compositions for vapor deposition of titanium-containing films |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003166060A (en) * | 2001-11-30 | 2003-06-13 | L'air Liquide Sa Pour L'etude & L'exploitation Des Procede S Georges Claude | Method for manufacturing silicon nitride film, silicon oxynitride film, or silicon oxide film by cvd method |
US20030111678A1 (en) * | 2001-12-14 | 2003-06-19 | Luigi Colombo | CVD deposition of M-SION gate dielectrics |
US7199023B2 (en) * | 2002-08-28 | 2007-04-03 | Micron Technology, Inc. | Atomic layer deposited HfSiON dielectric films wherein each precursor is independendently pulsed |
-
2004
- 2004-06-03 FR FR0451101A patent/FR2871292B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2871292A1 (en) | 2005-12-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100226 |