FR2853136B3 - Boitier incorpore pour dispositif a semi-conducteur - Google Patents

Boitier incorpore pour dispositif a semi-conducteur

Info

Publication number
FR2853136B3
FR2853136B3 FR0350060A FR0350060A FR2853136B3 FR 2853136 B3 FR2853136 B3 FR 2853136B3 FR 0350060 A FR0350060 A FR 0350060A FR 0350060 A FR0350060 A FR 0350060A FR 2853136 B3 FR2853136 B3 FR 2853136B3
Authority
FR
France
Prior art keywords
semiconductor device
incorporated
case
incorporated case
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0350060A
Other languages
English (en)
Other versions
FR2853136A3 (fr
Inventor
Charng Geng Sheen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Actron Technology Corp
Original Assignee
Actron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Actron Technology Corp filed Critical Actron Technology Corp
Priority to FR0350060A priority Critical patent/FR2853136B3/fr
Priority to KR20-2003-0026632U priority patent/KR200337834Y1/ko
Publication of FR2853136A3 publication Critical patent/FR2853136A3/fr
Application granted granted Critical
Publication of FR2853136B3 publication Critical patent/FR2853136B3/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/24Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01038Strontium [Sr]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01057Lanthanum [La]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1203Rectifying Diode
    • H01L2924/12032Schottky diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR0350060A 2003-03-25 2003-03-25 Boitier incorpore pour dispositif a semi-conducteur Expired - Lifetime FR2853136B3 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0350060A FR2853136B3 (fr) 2003-03-25 2003-03-25 Boitier incorpore pour dispositif a semi-conducteur
KR20-2003-0026632U KR200337834Y1 (ko) 2003-03-25 2003-08-19 임베디드 반도체 패키지 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0350060A FR2853136B3 (fr) 2003-03-25 2003-03-25 Boitier incorpore pour dispositif a semi-conducteur

Publications (2)

Publication Number Publication Date
FR2853136A3 FR2853136A3 (fr) 2004-10-01
FR2853136B3 true FR2853136B3 (fr) 2005-02-11

Family

ID=32947395

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0350060A Expired - Lifetime FR2853136B3 (fr) 2003-03-25 2003-03-25 Boitier incorpore pour dispositif a semi-conducteur

Country Status (2)

Country Link
KR (1) KR200337834Y1 (fr)
FR (1) FR2853136B3 (fr)

Also Published As

Publication number Publication date
KR200337834Y1 (ko) 2004-01-13
FR2853136A3 (fr) 2004-10-01

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