FR2853136B3 - Boitier incorpore pour dispositif a semi-conducteur - Google Patents
Boitier incorpore pour dispositif a semi-conducteurInfo
- Publication number
- FR2853136B3 FR2853136B3 FR0350060A FR0350060A FR2853136B3 FR 2853136 B3 FR2853136 B3 FR 2853136B3 FR 0350060 A FR0350060 A FR 0350060A FR 0350060 A FR0350060 A FR 0350060A FR 2853136 B3 FR2853136 B3 FR 2853136B3
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- incorporated
- case
- incorporated case
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01038—Strontium [Sr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0350060A FR2853136B3 (fr) | 2003-03-25 | 2003-03-25 | Boitier incorpore pour dispositif a semi-conducteur |
KR20-2003-0026632U KR200337834Y1 (ko) | 2003-03-25 | 2003-08-19 | 임베디드 반도체 패키지 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0350060A FR2853136B3 (fr) | 2003-03-25 | 2003-03-25 | Boitier incorpore pour dispositif a semi-conducteur |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2853136A3 FR2853136A3 (fr) | 2004-10-01 |
FR2853136B3 true FR2853136B3 (fr) | 2005-02-11 |
Family
ID=32947395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0350060A Expired - Lifetime FR2853136B3 (fr) | 2003-03-25 | 2003-03-25 | Boitier incorpore pour dispositif a semi-conducteur |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR200337834Y1 (fr) |
FR (1) | FR2853136B3 (fr) |
-
2003
- 2003-03-25 FR FR0350060A patent/FR2853136B3/fr not_active Expired - Lifetime
- 2003-08-19 KR KR20-2003-0026632U patent/KR200337834Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR200337834Y1 (ko) | 2004-01-13 |
FR2853136A3 (fr) | 2004-10-01 |
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