FR2835654B1 - OPTICAL SEMICONDUCTOR PACKAGE WITH COUPLED LENS HOLDER - Google Patents

OPTICAL SEMICONDUCTOR PACKAGE WITH COUPLED LENS HOLDER

Info

Publication number
FR2835654B1
FR2835654B1 FR0201425A FR0201425A FR2835654B1 FR 2835654 B1 FR2835654 B1 FR 2835654B1 FR 0201425 A FR0201425 A FR 0201425A FR 0201425 A FR0201425 A FR 0201425A FR 2835654 B1 FR2835654 B1 FR 2835654B1
Authority
FR
France
Prior art keywords
semiconductor package
lens holder
optical semiconductor
coupled lens
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0201425A
Other languages
French (fr)
Other versions
FR2835654A1 (en
Inventor
Remi Brechignac
Julien Vittu
Olivier Franiatte
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0201425A priority Critical patent/FR2835654B1/en
Publication of FR2835654A1 publication Critical patent/FR2835654A1/en
Application granted granted Critical
Publication of FR2835654B1 publication Critical patent/FR2835654B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
FR0201425A 2002-02-06 2002-02-06 OPTICAL SEMICONDUCTOR PACKAGE WITH COUPLED LENS HOLDER Expired - Fee Related FR2835654B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0201425A FR2835654B1 (en) 2002-02-06 2002-02-06 OPTICAL SEMICONDUCTOR PACKAGE WITH COUPLED LENS HOLDER

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0201425A FR2835654B1 (en) 2002-02-06 2002-02-06 OPTICAL SEMICONDUCTOR PACKAGE WITH COUPLED LENS HOLDER

Publications (2)

Publication Number Publication Date
FR2835654A1 FR2835654A1 (en) 2003-08-08
FR2835654B1 true FR2835654B1 (en) 2004-07-09

Family

ID=27619947

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0201425A Expired - Fee Related FR2835654B1 (en) 2002-02-06 2002-02-06 OPTICAL SEMICONDUCTOR PACKAGE WITH COUPLED LENS HOLDER

Country Status (1)

Country Link
FR (1) FR2835654B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7709776B2 (en) 2004-07-19 2010-05-04 Aptina Imaging Corporation Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

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US6934065B2 (en) 2003-09-18 2005-08-23 Micron Technology, Inc. Microelectronic devices and methods for packaging microelectronic devices
US7583862B2 (en) 2003-11-26 2009-09-01 Aptina Imaging Corporation Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7253397B2 (en) 2004-02-23 2007-08-07 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7253957B2 (en) 2004-05-13 2007-08-07 Micron Technology, Inc. Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
US8092734B2 (en) 2004-05-13 2012-01-10 Aptina Imaging Corporation Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
US20050275750A1 (en) 2004-06-09 2005-12-15 Salman Akram Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
US7498647B2 (en) 2004-06-10 2009-03-03 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7199439B2 (en) 2004-06-14 2007-04-03 Micron Technology, Inc. Microelectronic imagers and methods of packaging microelectronic imagers
US7262405B2 (en) 2004-06-14 2007-08-28 Micron Technology, Inc. Prefabricated housings for microelectronic imagers
US7294897B2 (en) 2004-06-29 2007-11-13 Micron Technology, Inc. Packaged microelectronic imagers and methods of packaging microelectronic imagers
US7416913B2 (en) 2004-07-16 2008-08-26 Micron Technology, Inc. Methods of manufacturing microelectronic imaging units with discrete standoffs
EP1619726A1 (en) * 2004-07-22 2006-01-25 St Microelectronics S.A. Package for optical semiconductor detector
EP1624493A3 (en) 2004-07-23 2006-09-13 Stmicroelectronics Sa Method of fabricating an optical module for semiconductor imaging device package
US7402453B2 (en) 2004-07-28 2008-07-22 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US7223626B2 (en) 2004-08-19 2007-05-29 Micron Technology, Inc. Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers
US7397066B2 (en) 2004-08-19 2008-07-08 Micron Technology, Inc. Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagers
US7429494B2 (en) 2004-08-24 2008-09-30 Micron Technology, Inc. Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers
US7115961B2 (en) 2004-08-24 2006-10-03 Micron Technology, Inc. Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
US7276393B2 (en) 2004-08-26 2007-10-02 Micron Technology, Inc. Microelectronic imaging units and methods of manufacturing microelectronic imaging units
US20070148807A1 (en) 2005-08-22 2007-06-28 Salman Akram Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers
US7511262B2 (en) 2004-08-30 2009-03-31 Micron Technology, Inc. Optical device and assembly for use with imaging dies, and wafer-label imager assembly
US7646075B2 (en) 2004-08-31 2010-01-12 Micron Technology, Inc. Microelectronic imagers having front side contacts
US7300857B2 (en) 2004-09-02 2007-11-27 Micron Technology, Inc. Through-wafer interconnects for photoimager and memory wafers
US7271482B2 (en) 2004-12-30 2007-09-18 Micron Technology, Inc. Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
US7303931B2 (en) 2005-02-10 2007-12-04 Micron Technology, Inc. Microfeature workpieces having microlenses and methods of forming microlenses on microfeature workpieces
US7190039B2 (en) 2005-02-18 2007-03-13 Micron Technology, Inc. Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagers
US7795134B2 (en) 2005-06-28 2010-09-14 Micron Technology, Inc. Conductive interconnect structures and formation methods using supercritical fluids
US7262134B2 (en) 2005-09-01 2007-08-28 Micron Technology, Inc. Microfeature workpieces and methods for forming interconnects in microfeature workpieces
US7288757B2 (en) 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
FR3061628A1 (en) 2017-01-03 2018-07-06 Stmicroelectronics (Grenoble 2) Sas METHOD FOR MANUFACTURING AN ENCAPSULATION HOOD FOR AN ELECTRONIC HOUSING AND ELECTRONIC HOUSING COMPRISING A HOOD
FR3061630B1 (en) 2017-01-03 2021-07-09 St Microelectronics Grenoble 2 METHOD OF MANUFACTURING A COVER FOR AN ELECTRONIC BOX AND ELECTRONIC BOX INCLUDING A COVER
FR3073120A1 (en) * 2017-11-02 2019-05-03 Stmicroelectronics (Grenoble 2) Sas ENCAPSULATION HOOD FOR ELECTRONIC HOUSING
EP3707750A4 (en) * 2017-11-07 2021-09-01 AMS Sensors Singapore Pte. Ltd. Optoelectronic modules having locking assemblies and methods for manufacturing the same

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Publication number Priority date Publication date Assignee Title
US4880974A (en) * 1988-10-14 1989-11-14 Wako Corporation Photoelectric sensor employing custom lens member
DE58909888C5 (en) * 1989-05-31 2017-03-02 Osram Gesellschaft mit beschränkter Haftung A method of manufacturing a surface mount opto-device and surface mount opto-device
JPH0453155A (en) * 1990-06-15 1992-02-20 Mitsubishi Electric Corp Semiconductor container
US5216805A (en) * 1990-12-12 1993-06-08 Eastman Kodak Company Method of manufacturing an optoelectronic device package
JPH09181287A (en) * 1995-10-24 1997-07-11 Sony Corp Light receiving device and manufacture thereof
US6037655A (en) * 1998-01-12 2000-03-14 Eastman Kodak Company Linear image sensor package assembly
DE19958229B4 (en) * 1998-12-09 2007-05-31 Fuji Electric Co., Ltd., Kawasaki Optical semiconductor sensor device
US6117193A (en) * 1999-10-20 2000-09-12 Amkor Technology, Inc. Optical sensor array mounting and alignment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7709776B2 (en) 2004-07-19 2010-05-04 Aptina Imaging Corporation Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers

Also Published As

Publication number Publication date
FR2835654A1 (en) 2003-08-08

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20071030