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FR2835654A1 - Optical semiconductor case with coupled lens port, comprises integrated circuit chip with optical sensor inside the case and facing the lens - Google Patents

Optical semiconductor case with coupled lens port, comprises integrated circuit chip with optical sensor inside the case and facing the lens Download PDF

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Publication number
FR2835654A1
FR2835654A1 FR0201425A FR0201425A FR2835654A1 FR 2835654 A1 FR2835654 A1 FR 2835654A1 FR 0201425 A FR0201425 A FR 0201425A FR 0201425 A FR0201425 A FR 0201425A FR 2835654 A1 FR2835654 A1 FR 2835654A1
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FR
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Patent type
Prior art keywords
case
lens
optical
port
part
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR0201425A
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French (fr)
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FR2835654B1 (en )
Inventor
Remi Brechignac
Julien Vittu
Olivier Franiatte
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STMicroelectronics SA
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STMicroelectronics SA
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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0203Containers; Encapsulations, e.g. encapsulation of photodiodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H01L31/02325Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

The optical semiconductor device (1) comprises a case (2) containing an integrated circuit chip (3) with an optical sensor (6) on its front face, at least one lens port (14) linked to the case (2) and having a passage (19) wherein an optical lens (20) is installed so to face the optical sensor, and a platform (4) of a grid (5) with legs (7) for electrical connection. The case and the lens port comprise complementary coupling parts (17,18), in particular projections (17) fitting openings (18), which allow the positioning of the case and the lens port with the support surfaces (10,16), the front of the case and the rear of the lens port, against one another. The coupling by the complementary parts (17,18) is in the direction of optical axis of the sensor, and the support surfaces are perpendicular to the optical axis. The support surfaces (10,16) are bonded one to the other by an adhesive layer (21). The case (2) comprises an encapsulation body (9) of a transparent material for housing the integrated circuit chip (3). In the second embodiment, the complementary coupling parts include a peripheral projecting part of the lens port and an inclined side of the case engaged in the peripheral part. In the third embodiment, the case comprises a support plate, a ring part, a pane fastened on the ring part, and the complementary coupling parts are laid out in the ring part exterior to the pane.

Description

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Boîtier semi-conducteur optique à porte-lentille accouplé Optical semiconductor package to lens holder coupled
La présente invention concerne le domaine des boîtiers semiconducteurs optiques renfermant une puce de circuits intégrés présentant sur une face avant un capteur optique. The present invention relates to the field of optical semiconductor packages containing a integrated circuit chip having on a front face an optical sensor.

Il est connu de fixer et de relier électriquement des boîtiers semi-conducteurs optiques sur des plaques de circuits imprimés et de rajouter des porte-lentilles en forme de cavaliers passant au-dessus et à distance des boîtiers semi-conducteurs, ces cavaliers présentant des pattes traversant les plaques de circuits imprimés et étant collées à ces dernières. It is known to fix and electrically connecting the optical semiconductor packages on printed circuit boards and add jumper-shaped lenses door passing over and spaced from the semiconductor packages, these jumpers having legs passing through the printed circuit boards and being glued to the latter. Ces porte-lentilles présentent des passages situés en face des capteurs optiques des boîtiers semi-conducteurs et dans lesquels sont installées des lentilles optiques. These lens holders have openings situated opposite the optical sensors and semiconductor packages in which are installed optical lenses.

Compte tenu des tolérances mécaniques notamment de fabrication, il est particulièrement difficile d'obtenir un positionnement correct des lentilles par rapport aux capteurs optiques des boîtiers semi-conducteurs, dans les différentes directions et en orientation. In view of mechanical tolerances including manufacturing, it is particularly difficult to obtain a correct positioning of the lenses relative to the optical sensors of the semiconductor packages in the different directions and in orientation.

Le but de la présente invention est de proposer un dispositif semi-conducteur optique permettant pour le moins de réduire les difficultés de positionnement des lentilles par rapport aux capteurs optiques de boîtiers semi-conducteurs. The object of the present invention is to provide an optical semiconductor device at least to reduce the lens positioning difficulties with respect to the optical sensors of semiconductor packages.

Le dispositif semi-conducteur optique selon l'invention comprend un boîtier renfermant une puce de circuits intégrés présentant sur une face avant un capteur optique, et comprend en outre un porte-lentille rapporté sur ledit boîtier et présentant un passage dans lequel est installeé une lentille optique disposée en face dudit capteur, ledit boîtier et ledit porte-lentille comprenant des parties complémentaires d'accouplement permettant le positionnement de l'un par rapport à l'autre et des surfaces d'appui de l'un sur l'autre. The optical semiconductor device according to the invention comprises a housing enclosing an integrated circuit chip having on a front face an optical sensor, and further comprises a lens holder attached to said housing and having a passage in which is installed a lens optics arranged in front of said sensor, said housing and said lens holder comprising complementary coupling portions for the positioning relative to each other and bearing surfaces of one over the other.

Selon l'invention, lesdites parties complémentaires According to the invention, said complementary portions

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d'accouplement s'accouplent de préférence dans la direction de l'axe optique dudit capteur et des surfaces d'appui en vis-à-vis. coupling mate preferably in the direction of the optical axis of said sensor and support surfaces vis-à-vis.

Selon l'invention, lesdites surfaces d'appui dudit boîtier et dudit porte-lentille sont de préférence collées l'une sur l'autre. According to the invention, said bearing surfaces of said housing and said lens holder are preferably glued to one another.

Selon l'invention, lesdites surfaces d'appui s'étendent de préférence perpendiculairement à la direction de l'axe optique dudit capteur. According to the invention, said bearing surfaces preferably extend perpendicularly to the direction of the optical axis of said sensor.

Selon une exécution préférée de l'invention, lesdites parties complémentaires d'accouplement comprennent respectivement des parties en saillie et des parties en creux rentrant les unes dans les autres. According to a preferred embodiment of the invention, said complementary coupling portions respectively include projecting portions and recessed portions returning into each other.

Selon l'invention, lesdites parties en saillie et lesdites parties en creux sont formées dans ou comprennent de préférence lesdites surfaces d'appui. According to the invention, said protruding portions and said recessed portions are formed in or preferably comprise said bearing surfaces.

Selon une variante de l'invention, lesdites parties complémentaires d'accouplement comprennent respectivement des doigts pénétrant dans des trous. According to a variant of the invention, said complementary coupling portions respectively comprise fingers extending into the holes.

Selon une autre variante de l'invention, lesdites parties complémentaires d'accouplement comprennent respectivement une partie périphérique en saillie et des flancs engagées dans cette partie périphérique. According to another variant of the invention, said complementary coupling portions respectively comprise a peripheral projecting portion and sidewalls engaged in this peripheral portion.

Selon l'invention, ladite partie périphérique en saillie est de préférence prévue sur ledit porte-lentille et est évasée et lesdits flancs sont de préférence prévus sur ledit boîtier et sont en appui sur cette partie périphérique en saillie. According to the invention, said peripheral projection is preferably provided on said lens holder and is flared and said sidewalls are preferably provided on said housing and are supported on this peripheral projection.

Selon une variante de l'invention, ledit boîtier peut avantageusement comprendre un corps d'encapsulation de ladite puce, en une matière transparente. According to a variant of the invention, the housing may advantageously comprise an encapsulation body of said chip, a transparent material.

Selon une autre variante de l'invention, ledit boîtier peut avantageusement comprendre une partie annulaire et une vitre fixée sur cette partie annulaire, lesdites parties d'accouplement dudit boîtier étant réalisées sur cette partie annulaire et extérieurement à la périphérie de cette vitre. According to another variant of the invention, said housing can advantageously comprise an annular portion and a window pane attached to this annular part, said mating portions of said housing being formed on said annular portion and outwardly to the periphery of the glass.

La présente invention sera mieux comprise à l'étude de boîtiers semi-conducteurs optiques décrits à titres d'exemples non limitatifs The present invention will be better understood from a study of optical semiconductor packages described by way of non-limiting examples

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et illustrés par le dessin sur lequel : - la figure 1 représente une coupe transversale d'un premier boîtier semi-conducteur optique selon l'invention ; and illustrated by the drawing in which: - Figure 1 shows a cross section of a first optical semiconductor package according to the invention;

Figure img00030001

- la figure 2 représente une vue de dessus partiellement arrachée, du boîtier semi-conducteur optique de la figure 1 ; - Figure 2 shows a top view partially broken away, of the optical semiconductor package of Figure 1; - la figure 3 représente une variante de réalisation du boîtier semi-conducteur optique de la figure 1 ; - Figure 3 shows an alternative embodiment of the optical semiconductor package of Figure 1; - et la figure 4 représente une coupe transversale d'un autre boîtier semi-conducteur optique selon la présente invention. - and Figure 4 shows a cross section of another optical semiconductor package according to the present invention.

En se reportant aux figures 1 et 2, on peut voir qu'on a représenté un dispositif semi-conducteur optique 1 comprenant un boîtier semi-conducteur 2 qui, de façon connue en soi, comprend une puce de circuits intégrés 3 dont la face arrière est portée par une plate-forme 4 d'une grille 5 et dont la face avant présente un capteur optique 6, la grille 5 présentant en outre des pattes de connexion électrique 7 reliées à la puce 3 par des fils de connexion électrique 8. Referring to Figures 1 and 2, it can be seen that shows an optical semiconductor device 1 comprising a semiconductor package 2 which, in known manner, comprises an integrated circuit chip 3, the rear face is carried by a platform 4 of a grid 5 and the front face has an optical sensor 6, the grid 5 further having electrical connection pins 7 connected to the chip 3 by electric connection 8 son.

Le boîtier 2 comprend en outre, de façon connue en soi, un corps d'encapsulation 9 en une matière transparente injectée, dans lequel la puce 3 est noyée, les parties d'extrémité des pattes 7 dépassant à l'extérieur de ce corps 9. The housing 2 further comprises, in a known way, an encapsulation body 9 in an injected transparent material, wherein the chip 3 is embedded, the end portions of the legs 7 extending outwardly of the body 9 .

Le corps 9, de forme générale parallélipipédique, présente une face avant 10 et une face arrière 11 sensiblement parallèles et des flancs latéraux 12 et 13 inclinés et situés respectivement du côté des faces 10 et 11 et formant un V dont la pointe est tournée vers l'extérieur. The body 9, of parallelepipedal general shape, has a front face 10 and a rear face 11 substantially parallel lateral sides 12 and 13 inclined and located on the side respectively of the faces 10 and 11 and forming a V whose tip is directed towards the 'outside.

Le dispositif semi-conducteur 1 comprend en outre un portelentille 14 constitué par une plaque 15 placée à plat sur la face avant 10 du boîtier 2 et dont la périphérie correspond sensiblement à la périphérie de cette face 10. The semiconductor device 1 further comprises a portelentille 14 constituted by a plate 15 placed flat on the front face 10 of the housing 2 and whose periphery corresponds substantially to the periphery of the face 10.

La face arrière 16 du porte-lentille 14 présente des doigts cylindriques d'accouplement 17 en saillie vers l'arrière et engagés dans des trous borgnes d'accouplement 18 ménagés dans le corps 9 du boîtier 2. The rear face 16 of the lens holder 14 has cylindrical coupling fingers 17 projecting rearwardly and engaging in mating blind holes 18 formed in the body 9 of the housing 2.

La plaque 15 constituant le porte-lentille 14 présente, dans sa partie centrale, un passage traversant 19 dans lequel est montée une The plate 15 constituting the lens holder 14 has, in its central part, a through passage 19 in which is mounted a

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lentille optique 20 de telle sorte que l'axe optique de cette lentille 20 corresponde à l'axe optique du capteur optique 6 de la puce 3. optical lens 20 such that the optical axis of the lens 20 matches the optical axis of the optical sensor 6 of the chip 3.

Les doigts 17 et les trous correspondants 18, qui sont formés par exemple à mi-distance entre le passage central 19 du portelentille 14 et la périphérie de la face 10 du corps 9, sont répartis périphériquement. The fingers 17 and the corresponding holes 18, which are formed, for example midway between the central passage 19 of portelentille 14 and the periphery of the face 10 of the body 9 are distributed peripherally. Dans un exemple, on peut avantageusement prévoir quatre doigts 17 et les trous correspondant 18. In one example, provision may advantageously be four fingers 17 and the corresponding holes 18.

Pour fixer le porte-lentille sur le boîtier 2, une couche de colle 21 est interposée entre la face avant 10 du boîtier 2 et la face arrière 16 de la plaque 15. For fixing the lens holder on the housing 2, an adhesive layer 21 is interposed between the front face 10 of the housing 2 and the rear face 16 of the plate 15.

Pour fabriquer le dispositif semi-conducteur optique 1, on peut procéder de la manière suivante. To manufacture the optical semiconductor device 1, one can proceed as follows.

On fabrique un boîtier semi-conducteur optique 2 par exemple en injectant la matière devant constituer le corps 9 dans un moule d'injection présentant dans sa cavité des parties en saillie localisées aux endroits des trous borgnes 18 à réaliser et on fabrique le portelentille 14 par exemple en une matière thermoplastique dans un moule d'injection dont la cavité présente des trous pour la réalisation des doigts 17 à fabriquer. Is fabricated an optical semiconductor package 2, for example by injecting the material to form the body 9 in an injection mold cavity having in its projecting parts located at the locations of blind holes 18 to be produced and is produced by the portelentille 14 example of a thermoplastic material in an injection mold whose cavity has holes for the realization of the fingers 17 to be manufactured.

On dépose une couche de colle sur la périphérie de la face avant 10 du boîtier 2 et/ou sur la face arrière 16 du porte-lentille 14. Depositing a layer of adhesive on the periphery of the front face 10 of the housing 2 and / or the rear face 16 of the lens holder 14.

On installe le porte-lentille 14 sur le boîtier 2 en engageant les doigts 17 dans les trous borgnes 18 complémentaires, qui s'accouplent dans la direction de l'axe optique du capteur 6 et des surfaces d'appui 10 et 16 en vis-à-vis, et on les maintient jusqu'à ce que la couche de colle 21 soit prise. Installing the lens holder 14 on the housing 2 by engaging the pins 17 into the blind holes 18 complementary, which mate in the direction of the optical axis of sensor 6 and the bearing surfaces 10 and 16 vis à-vis, and maintained until the adhesive layer 21 is made.

La lentille optique 20 peut soit être montée dans une position déterminée dans le passage 19 du porte-lentille 14, soit être installée dans ce passage 19 par l'intermédiaire d'une bague, cette bague étant de préférence vissée dans le passage 19 de façon à régler la distance entre la lentille 20 et le capteur optique 6 de la puce 3. La lentille 20 ou cette bague munie de cette lentille peuvent être montées soit avant soit après l'assemblage de ce du porte-lentille 14 sur le boîtier 2. The optical lens 20 can either be mounted in a fixed position in the passage 19 of the lens holder 14 or be mounted in this passage 19 via a ring, this ring preferably being screwed into the passage 19 so adjusting the distance between the lens 20 and the optical sensor 6 of the chip 3. the lens 20 or the ring provided with the lens can be mounted either before or after the assembly of this the lens holder 14 on the housing 2.

Grace aux doigts 17 et aux trous 18 d'accouplement, le positionnement du porte-lentille 14 sur le boîtier 2, et en Thanks to fingers 17 and with holes 18 coupling, the positioning of the lens holder 14 on the housing 2, and

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conséquence celui de la lentille optique 20 par rapport au capteur optique 6 de la puce 3, peuvent être facilités et assurés avec précision. accordingly that of the optical lens 20 relative to the optical sensor 6 of the chip 3, can be facilitated and assured accurately.

En se reportant à la figure 3, on peut voir qu'on a représenté un dispositif semi-conducteur optique 22 qui constitue une variante de réalisation de celui décrit en référence aux figures 1 et 2. Referring to Figure 3, it can be seen that shows an optical semiconductor device 22 which is a variant of that described with reference to Figures 1 and 2.

Son boîtier semi-conducteur optique 24 se différencie du boîtier semi-conducteur 2 des figures 1 et 2 uniquement par le fait que sa face frontale 25 ne comprend plus les trous borgnes 18 de l'exemple précédent. The optical semiconductor package 24 differs from the semiconductor package 2 of Figures 1 and 2 only in that its end face 25 no longer comprises the blind holes 18 of the previous example.

Son porte-lentille 26 se différencie du porte-lentille 14 du dispositif semi-conducteur optique 1 uniquement par le fait que sa face arrière 27 ne comprend plus les doigts 17 mais présente un rebord ou épaulement périphérique arrière 28 de positionnement, incliné de façon à venir s'ajuster sur le flanc incliné 29 du boîtier 24 adjacent à sa face frontale 25. Une couche de colle 28a interposée entre l'épaulement 28 et le flanc incliné 29 permet de fixer le portelentille 26 sur le boîtier 24. Its lens holder 26 differs from the lens holder 14 of the optical semiconductor device 1 only in that its rear face 27 no longer includes the fingers 17 but has a flange or shoulder back device 28 positioning, inclined so as to protested adjust on the inclined flank 29 of housing 24 adjacent its end face 25. An adhesive layer 28a interposed between the shoulder 28 and the inclined side 29 allows to fix the portelentille 26 of the housing 24.

Ayant fabriqué le boîtier semi-conducteur optique 24 et le porte-lentille 26, on dépose une couche de colle sur la périphérie de la face frontale 25 du boîtier 24 et/ou sur le flanc incliné 29 de ce dernier et/ou sur la face arrière 27 du porte-lentille 26 et/ou sur la face intérieure de son rebord périphérique 28 et on accouple le portelentille 26 au le boîtier 24 dans la direction de l'axe optique du capteur optique 6 de la puce 3 et on les maintient jusqu'à ce que la couche de colle 28a soit prise. Having manufactured the optical semiconductor package 24 and the lens holder 26, depositing a layer of adhesive on the periphery of the end face 25 of the housing 24 and / or on the inclined flank 29 of the latter and / or on the face back 27 of portelentille 26 and / or on the inner face of its peripheral rim 28 and couples the portelentille 26 to the housing 24 in the direction of the optical axis of the optical sensor 6 of the chip 3 and maintained until such time as the adhesive layer 28a is taken.

En se reportant à la figure 4, on peut voir qu'on a représenté un dispositif semi-conducteur optique 30 qui comprend, comme dans les exemples précédents, un boîtier semi-conducteur optique 31 et un porte-lentille 32 qui lui est accouplé. Referring to Figure 4, it can be seen that shows an optical semiconductor device 30 which comprises, as in the preceding examples, an optical semiconductor package 31 and a lens holder 32 which is coupled thereto.

Dans cet exemple, le boîtier semi-conducteur optique 31 comprend une plaque support et de connexion électrique 33, une bague 34 carrée collée sur une face frontale de la plaque 33 et une vitre 35 dont la périphérie est en appui et collée sur le bord intérieur d'extrémité de la bague 34, de telle sorte qu'une cavité 36 est In this example, the optical semiconductor package 31 comprises a support plate and electrical connection 33, a ring 34 square glued on a front face of the plate 33 and a glass 35 whose periphery is supported and bonded on the inner edge end of the ring 34, so that a cavity 36 is

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déterminée entre la plaque 33 et la vitre 35 et périphériquement par la bague 34. determined between the plate 33 and 35 and peripherally by glass collar 34.

Une puce de circuits intégrés 37 est disposée dans la cavité 36, sa face arrière étant par exemple collée sur la plaque 33 et sa face avant présentant un capteur optique 38. Des fils de connexion électrique 39 permettent de relier électriquement la puce 37 et la plaque 33 dans la cavité 36. An integrated circuit chip 37 is disposed in the cavity 36, its rear face being for example glued to the plate 33 and its front face having an optical sensor 38. The electrical connection 39 son it possible to electrically connect the chip 37 and the plate 33 in the cavity 36.

Le porte-lentille 32 est comparable au porte-lentille 14 décrit précédemment en référence aux figures 1 et 2. Sa face arrière 40 présente des doigts en saillie vers l'arrière 41 qui sont engagés dans des trous borgnes 42 prévus dans la face frontale 43 de la bague 34 du boîtier semi-conducteur optique 31, entre le bord périphérique de la vitre 35 et son bord périphérique. The lens holder 32 is comparable to the lens holder 14 described above with reference to Figures 1 and 2. The rear face 40 has projecting rearwardly fingers 41 which are engaged in blind holes 42 provided in the front face 43 of the ring 34 of the optical semiconductor package 31, between the peripheral edge of the glass 35 and its peripheral edge.

Comme dans l'exemple décrit en référence aux figures 1 et 2, ayant fabriqué le boîtier semi-conducteur optique 31 en prévoyant les trous borgnes 42 et ayant fabriqué le porte-lentille 32 en prévoyant les doigts 41 correspondant, on dépose une couche de colle sur la face frontale 43 de la bague 34 du boîtier semi-conducteur optique 31 et/ou sur la face arrière 40 du porte outil 32, on accouple le portelentille 32 au boîtier semi-conducteur optique 31 en engageant les doigts 41 dans les trous borgnes 42 de positionnement, dans le sens de l'axe optique du capteur optique 38 et on maintient l'appui jusqu'à ce que la couche de colle 43 soit prise. As in the example described with reference to Figures 1 and 2 having made the optical semiconductor package 31, by providing the blind holes 42 and having manufactured the lens holder 32 by providing the corresponding fingers 41, is deposited a layer of adhesive on the front face 43 of the ring 34 of the optical semiconductor package 31 and / or the rear face 40 of the tool holder 32, it couples the portelentille 32 to the optical semiconductor package 31 by engaging fingers 41 into the blind holes 42 positioning in the direction of the optical axis of the optical sensor 38 and maintains the support until the adhesive layer 43 is made.

La présente invention ne se limite pas aux exemples ci-dessus décrits. The present invention is not limited to the examples described above. Bien des variantes de réalisation sont possibles sans sortir du cadre défini par les revendications annexées. Many variants are possible within the scope defined by the appended claims.

Claims (11)

    REVENDICATIONS
  1. 1. Dispositif semi-conducteur optique comprenant un boîtier renfermant une puce de circuits intégrés présentant sur une face avant un capteur optique, caractérisé par le fait qu'il comprend en outre un porte-lentille (14,26, 32) rapporté sur ledit boîtier (2,24, 31) et présentant un passage (19) dans lequel est installée une lentille optique (20) disposée en face dudit capteur optique (6), ledit boîtier et ledit porte-lentille comprenant des parties complémentaires d'accouplement (17,18 ; 28,29 ; 41,42) permettant le positionnement de l'un par rapport à l'autre et des surfaces d'appui de l'un sur l'autre (10,16 ; 25,27 ; 40,43). 1. An optical semiconductor device comprising a housing enclosing an integrated circuit chip having on a front face an optical sensor, characterized in that it further comprises a lens holder (14,26, 32) attached to said housing (2,24, 31) and having a passage (19) in which is installed an optical lens (20) disposed in front of said optical sensor (6), said housing and said lens holder comprising complementary coupling portions (17 , 18; 28,29; 41,42) for positioning relative to each other and bearing surfaces of one over the other (10,16; 25,27; 40,43 ).
  2. 2. Dispositif selon la revendication 1, caractérisé par le fait que lesdites parties complémentaires d'accouplement (17,18 ; 28, 29 ; 41,42) s'accouplent dans la direction de l'axe optique dudit capteur et des surfaces d'appui en vis-à-vis. 2. Device according to Claim 1, characterized in that said complementary coupling portions (17,18; 28, 29; 41,42) mate in the direction of the optical axis of said sensor and surfaces support vis-à-vis.
  3. 3. Dispositif selon l'une des revendications 1 et 2, caractérisé par le fait que lesdites surfaces d'appui (10,16 ; 25,27 ; 40,43) dudit boîtier et dudit porte-lentille sont collées l'une sur l'autre. 3. Device according to one of Claims 1 and 2, characterized in that said bearing surfaces (10,16; 25,27; 40,43) of said housing and said lens holder are bonded on 'other.
  4. 4. Dispositif selon l'une quelconque des revendications précédentes, caractérisé par le fait que lesdites surfaces d'appui (10, 4. Device according to any one of the preceding claims, characterized in that said bearing surfaces (10,
    16 ; 16; 25,27 ; 25.27; 40,43) s'étendent perpendiculairement à la direction de l'axe optique dudit capteur. 40,43) extend perpendicularly to the direction of the optical axis of said sensor.
  5. 5. Dispositif selon l'une quelconque des revendications précédentes, caractérisé par le fait que lesdites parties complémentaires d'accouplement (17,18 ; 28,29 ; 41,42) comprennent respectivement des parties en saillie et des parties en creux rentrant les unes dans les autres. 5. Device according to any one of the preceding claims, characterized in that said complementary coupling portions (17,18; 28,29; 41,42) respectively include projecting portions and recessed portions returning each in the other.
  6. 6. Dispositif selon l'une quelconque des revendications précédentes, caractérisé par le fait que lesdites parties en saillie et lesdites parties en creux (17,18 ; 28,29 ; 41,42) sont formées dans ou comprennent lesdites surfaces d'appui. 6. Device according to any one of the preceding claims, characterized in that said projecting parts and said recessed portions (17,18; 28,29; 41,42) are formed in or comprise said bearing surfaces.
  7. 7. Dispositif selon l'une quelconque des revendications 7. Device according to any one of claims
    <Desc/Clms Page number 8> <Desc / CRUD Page number 8>
    précédentes, caractérisé par le fait que lesdites parties complémentaires d'accouplement comprennent respectivement des doigts (17,41) pénétrant dans des trous (18,42). preceding, characterized in that said complementary coupling portions comprise fingers respectively (17,41) extending into holes (18,42).
  8. 8. Dispositif selon l'une quelconque des revendications précédentes, caractérisé par le fait que lesdites parties complémentaires d'accouplement comprennent respectivement une partie périphérique en saillie (28) et des flancs (29) engagés dans cette partie périphérique. 8. Device according to any one of the preceding claims, characterized in that said complementary coupling portions respectively comprise a peripheral projection (28) and sidewalls (29) engaged in said peripheral portion.
  9. 9. Dispositif selon la revendication 8, caractérisé par le fait que ladite partie périphérique en saillie est prévue sur ledit portelentille et est évasée et lesdits flancs sont prévus sur ledit boîtier et sont en appui sur cette partie périphérique en saillie. 9. Device according to claim 8, characterized in that said peripheral projection is provided on said portelentille and is flared and said sidewalls are provided on said housing and are supported on this peripheral projection.
  10. 10. Dispositif selon l'une quelconque des revendications précédentes, caractérisé par le fait que ledit boîtier comprend un corps d'encapsulation (9) de ladite puce (3), en une matière transparente. 10. Device according to any one of the preceding claims, characterized in that said housing includes an encapsulating body (9) of said chip (3), of a transparent material.
  11. 11. Dispositif selon l'une quelconque des revendications 1 à 9, caractérisé par le fait que ledit boîtier comprend une partie annulaire (34 et une vitre (35) fixée sur cette partie annulaire, lesdites parties d'accouplement (41,42) dudit boîtier étant réalisées sur cette partie annulaire et extérieurement à la périphérie de cette vitre. 11. Device according to any one of claims 1 to 9, characterized in that said housing includes an annular portion (34 and a window (35) fixed to said annular portion, said engaging portions (41,42) of said housing being formed on said annular portion and outwardly to the periphery of the glass.
FR0201425A 2002-02-06 2002-02-06 Housing a semiconductor optical lens holder mates Expired - Fee Related FR2835654B1 (en)

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