FR2823375B1 - Circuit integre avec poches d'air et procede de fabrication correspondant - Google Patents

Circuit integre avec poches d'air et procede de fabrication correspondant

Info

Publication number
FR2823375B1
FR2823375B1 FR0104820A FR0104820A FR2823375B1 FR 2823375 B1 FR2823375 B1 FR 2823375B1 FR 0104820 A FR0104820 A FR 0104820A FR 0104820 A FR0104820 A FR 0104820A FR 2823375 B1 FR2823375 B1 FR 2823375B1
Authority
FR
France
Prior art keywords
integrated circuit
air pockets
corresponding manufacturing
manufacturing
pockets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0104820A
Other languages
English (en)
Other versions
FR2823375A1 (fr
Inventor
Vincent Arnal
Joaquim Torres
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Priority to FR0104820A priority Critical patent/FR2823375B1/fr
Publication of FR2823375A1 publication Critical patent/FR2823375A1/fr
Application granted granted Critical
Publication of FR2823375B1 publication Critical patent/FR2823375B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5221—Crossover interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/764—Air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/7682—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing the dielectric comprising air gaps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR0104820A 2001-04-09 2001-04-09 Circuit integre avec poches d'air et procede de fabrication correspondant Expired - Fee Related FR2823375B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0104820A FR2823375B1 (fr) 2001-04-09 2001-04-09 Circuit integre avec poches d'air et procede de fabrication correspondant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0104820A FR2823375B1 (fr) 2001-04-09 2001-04-09 Circuit integre avec poches d'air et procede de fabrication correspondant

Publications (2)

Publication Number Publication Date
FR2823375A1 FR2823375A1 (fr) 2002-10-11
FR2823375B1 true FR2823375B1 (fr) 2004-07-09

Family

ID=8862124

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0104820A Expired - Fee Related FR2823375B1 (fr) 2001-04-09 2001-04-09 Circuit integre avec poches d'air et procede de fabrication correspondant

Country Status (1)

Country Link
FR (1) FR2823375B1 (fr)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074713B2 (ja) * 1990-09-18 2000-08-07 日本電気株式会社 半導体装置の製造方法
DE4441898C1 (de) * 1994-11-24 1996-04-04 Siemens Ag Verfahren zur Herstellung eines Halbleiterbauelementes
US6057224A (en) * 1996-03-29 2000-05-02 Vlsi Technology, Inc. Methods for making semiconductor devices having air dielectric interconnect structures
JP2962272B2 (ja) * 1997-04-18 1999-10-12 日本電気株式会社 半導体装置の製造方法
FR2784230B1 (fr) * 1998-10-05 2000-12-29 St Microelectronics Sa Procede de realisation d'un isolement inter et/ou intra-metallique par air dans un circuit integre et circuit integre obtenu

Also Published As

Publication number Publication date
FR2823375A1 (fr) 2002-10-11

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20081231