FR2823375B1 - Circuit integre avec poches d'air et procede de fabrication correspondant - Google Patents
Circuit integre avec poches d'air et procede de fabrication correspondantInfo
- Publication number
- FR2823375B1 FR2823375B1 FR0104820A FR0104820A FR2823375B1 FR 2823375 B1 FR2823375 B1 FR 2823375B1 FR 0104820 A FR0104820 A FR 0104820A FR 0104820 A FR0104820 A FR 0104820A FR 2823375 B1 FR2823375 B1 FR 2823375B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- air pockets
- corresponding manufacturing
- manufacturing
- pockets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5221—Crossover interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/764—Air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/7682—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing the dielectric comprising air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0104820A FR2823375B1 (fr) | 2001-04-09 | 2001-04-09 | Circuit integre avec poches d'air et procede de fabrication correspondant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0104820A FR2823375B1 (fr) | 2001-04-09 | 2001-04-09 | Circuit integre avec poches d'air et procede de fabrication correspondant |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2823375A1 FR2823375A1 (fr) | 2002-10-11 |
FR2823375B1 true FR2823375B1 (fr) | 2004-07-09 |
Family
ID=8862124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0104820A Expired - Fee Related FR2823375B1 (fr) | 2001-04-09 | 2001-04-09 | Circuit integre avec poches d'air et procede de fabrication correspondant |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2823375B1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3074713B2 (ja) * | 1990-09-18 | 2000-08-07 | 日本電気株式会社 | 半導体装置の製造方法 |
DE4441898C1 (de) * | 1994-11-24 | 1996-04-04 | Siemens Ag | Verfahren zur Herstellung eines Halbleiterbauelementes |
US6057224A (en) * | 1996-03-29 | 2000-05-02 | Vlsi Technology, Inc. | Methods for making semiconductor devices having air dielectric interconnect structures |
JP2962272B2 (ja) * | 1997-04-18 | 1999-10-12 | 日本電気株式会社 | 半導体装置の製造方法 |
FR2784230B1 (fr) * | 1998-10-05 | 2000-12-29 | St Microelectronics Sa | Procede de realisation d'un isolement inter et/ou intra-metallique par air dans un circuit integre et circuit integre obtenu |
-
2001
- 2001-04-09 FR FR0104820A patent/FR2823375B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2823375A1 (fr) | 2002-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20081231 |