FR2819794B1 - CONTROLLED CLOSING BOX FOR THE PACKAGING OF WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS - Google Patents

CONTROLLED CLOSING BOX FOR THE PACKAGING OF WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS

Info

Publication number
FR2819794B1
FR2819794B1 FR0100828A FR0100828A FR2819794B1 FR 2819794 B1 FR2819794 B1 FR 2819794B1 FR 0100828 A FR0100828 A FR 0100828A FR 0100828 A FR0100828 A FR 0100828A FR 2819794 B1 FR2819794 B1 FR 2819794B1
Authority
FR
France
Prior art keywords
wafers
packaging
manufacture
integrated circuits
closing box
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0100828A
Other languages
French (fr)
Other versions
FR2819794A1 (en
Inventor
Hocine Gourini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EXCEL SERVICES EMBALLAGES SA
Original Assignee
EXCEL SERVICES EMBALLAGES SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EXCEL SERVICES EMBALLAGES SA filed Critical EXCEL SERVICES EMBALLAGES SA
Priority to FR0100828A priority Critical patent/FR2819794B1/en
Priority to IT2002TO000056A priority patent/ITTO20020056A1/en
Publication of FR2819794A1 publication Critical patent/FR2819794A1/en
Application granted granted Critical
Publication of FR2819794B1 publication Critical patent/FR2819794B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
FR0100828A 2001-01-22 2001-01-22 CONTROLLED CLOSING BOX FOR THE PACKAGING OF WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS Expired - Fee Related FR2819794B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR0100828A FR2819794B1 (en) 2001-01-22 2001-01-22 CONTROLLED CLOSING BOX FOR THE PACKAGING OF WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS
IT2002TO000056A ITTO20020056A1 (en) 2001-01-22 2002-01-21 CONTROLLED CLOSING CONTAINER FOR THE CONDITIONING OF SLICES INTENDED FOR THE MANUFACTURE OF INTEGRATED CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0100828A FR2819794B1 (en) 2001-01-22 2001-01-22 CONTROLLED CLOSING BOX FOR THE PACKAGING OF WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS

Publications (2)

Publication Number Publication Date
FR2819794A1 FR2819794A1 (en) 2002-07-26
FR2819794B1 true FR2819794B1 (en) 2003-09-05

Family

ID=8859097

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0100828A Expired - Fee Related FR2819794B1 (en) 2001-01-22 2001-01-22 CONTROLLED CLOSING BOX FOR THE PACKAGING OF WAFERS FOR THE MANUFACTURE OF INTEGRATED CIRCUITS

Country Status (2)

Country Link
FR (1) FR2819794B1 (en)
IT (1) ITTO20020056A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6988620B2 (en) 2002-09-06 2006-01-24 E.Pak International, Inc. Container with an adjustable inside dimension that restricts movement of items within the container
FR2850638B1 (en) * 2003-02-03 2006-09-29 Excel Services Emballages Sa DETACHABLE ELECTRONIC LABEL BOX FOR PACKAGING PLATES FOR MANUFACTURING INTEGRATED CIRCUITS
EP3806138B1 (en) * 2019-10-09 2022-11-30 Infineon Technologies AG Transport system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5303823A (en) * 1992-07-17 1994-04-19 Minnesota Mining And Manufacturing Company Reusable, two-piece storage container
US5816410A (en) * 1994-07-15 1998-10-06 Fluoroware, Inc. Wafer cushions for wafer shipper
JPH09129719A (en) * 1995-08-30 1997-05-16 Achilles Corp Semiconductor wafer housing structure and semiconductor wafer housing and take-out method

Also Published As

Publication number Publication date
ITTO20020056A0 (en) 2002-01-21
ITTO20020056A1 (en) 2003-07-21
FR2819794A1 (en) 2002-07-26

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110930