FR2818803A1 - ASSEMBLY FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT - Google Patents
ASSEMBLY FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT Download PDFInfo
- Publication number
- FR2818803A1 FR2818803A1 FR0017060A FR0017060A FR2818803A1 FR 2818803 A1 FR2818803 A1 FR 2818803A1 FR 0017060 A FR0017060 A FR 0017060A FR 0017060 A FR0017060 A FR 0017060A FR 2818803 A1 FR2818803 A1 FR 2818803A1
- Authority
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- Prior art keywords
- integrated circuit
- assembly
- support
- electrical conductors
- assembly according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 36
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 4
- 230000003197 catalytic effect Effects 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 abstract 1
- 241000239290 Araneae Species 0.000 description 9
- 239000000758 substrate Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241000784726 Lycaena thetis Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0101—Neon [Ne]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
<Desc/Clms Page number 1> <Desc / Clms Page number 1>
La présente invention concerne un ensemble de montage d'un circuit intégré sur un support. The present invention relates to an assembly for mounting an integrated circuit on a support.
Plus particulièrement, l'invention se rapporte à un ensemble de montage d'un tel circuit sur un support comprenant une structure de conducteurs électriques prévue pour la connexion de bornes d'entrée-sortie du circuit intégré et s'applique plus particulièrement à la technologie de montage sur bande appe- lée communément dans l'état de la technique, technologie TAB (Tape-Automated Bonding). More particularly, the invention relates to an assembly assembly for such a circuit on a support comprising a structure of electrical conductors provided for the connection of input-output terminals of the integrated circuit and applies more particularly to technology. tape mounting commonly known in the art, TAB (Tape-Automated Bonding) technology.
Les circuits intégrés sont actuellement formés à partir de fines plaquettes de matériau semi-conducteur. Ces plaquettes sont par exemple carrées et les plus grandes ont environ 15 mm de côté. Elles sont pourvues d'un grand nombre de bornes d'entrée-sortie, de l'ordre de 500 par exemple. Integrated circuits are currently formed from thin wafers of semiconductor material. These plates are for example square and the largest are about 15 mm in side. They are provided with a large number of input-output terminals, of the order of 500 for example.
Selon la technologie TAB mentionnée précédemment, chaque circuit intégré est monté sur un support constitué d'un substrat isolant porteur d'une structure métallique conductrice comportant des conducteurs électriques, cette structure étant généralement appelée araignée dans la technique. Les bornes d'entrée-sortie du circuit intégré sont raccordées, par une opération dite de soudage de connexion intérieure ILB (Inner Lead Bonding), à des zones de contact respectives de conducteurs de cette araignée. According to the TAB technology mentioned above, each integrated circuit is mounted on a support consisting of an insulating substrate carrying a conductive metallic structure comprising electrical conductors, this structure generally being called a spider in the art. The input-output terminals of the integrated circuit are connected, by a so-called internal connection welding operation ILB (Inner Lead Bonding), to respective contact zones of conductors of this spider.
Le substrat peut se présenter sous différentes formes. Il peut par exemple avoir la forme d'une bande souple de type film cinématographique, pourvue de perforations latérales pour son déplacement et son positionnement et porteur de circuits intégrés disposés suivant sa longueur. Une autre forme courante de ce substrat consiste en un cadre porteur d'un ou plusieurs circuits intégrés. The substrate can be in different forms. It may for example have the form of a flexible strip of cinematographic film type, provided with lateral perforations for its movement and its positioning and carrying integrated circuits arranged along its length. Another common form of this substrate consists of a frame carrying one or more integrated circuits.
Un support TAB classique est généralement constitué d'une araignée, c'est-à-dire d'une structure de conducteurs électriques, collée sur un substrat. Ce support se compose donc de trois couches, à savoir l'araignée, un adhésif, et le substrat. A conventional TAB support generally consists of a spider, that is to say a structure of electrical conductors, bonded to a substrate. This support therefore consists of three layers, namely the spider, an adhesive, and the substrate.
De façon classique, l'araignée est formée à partir d'une feuille de cuivre dorée ayant une épaisseur d'environ 17 à 70 um, la colle est une colle acrylique ou époxy étalée sur une épaisseur d'environ 25 um et le substrat est constitué d'un matériau organique souple et électriquement isolant dont l'épaisseur minimale est d'environ 50 um et couramment de l'ordre de 100 um. Conventionally, the spider is formed from a golden copper sheet having a thickness of approximately 17 to 70 μm, the adhesive is an acrylic or epoxy adhesive spread over a thickness of approximately 25 μm and the substrate is made of a flexible and electrically insulating organic material whose minimum thickness is approximately 50 μm and commonly of the order of 100 μm.
<Desc/Clms Page number 2> <Desc / Clms Page number 2>
La fabrication du support consiste alors de manière classique à coller la feuille de cuivre dorée sur le substrat et à graver cette feuille de cuivre pour former l'araignée. The manufacture of the support then conventionally consists of sticking the golden copper sheet on the substrate and etching this copper sheet to form the spider.
Comme cela a été indiqué précédemment, les conducteurs de cette araignée doivent être raccordés aux bornes d'entrée-sortie du circuit intégré. As indicated above, the conductors of this spider must be connected to the input-output terminals of the integrated circuit.
Différentes techniques de raccordement peuvent être envisagées, comme par exemple la technique ILB mentionnée précédemment. Different connection techniques can be envisaged, such as for example the ILB technique mentioned above.
Ces bornes d'entrée-sortie des circuits intégrés sont en général matérialisées par des plages de contact en aluminium de qualité électronique. These input-output terminals of integrated circuits are generally materialized by electronic quality aluminum contact pads.
Pour de plus amples détails concernant cette technique, on pourra par exemple se reporter au document FR-A-2 749 974 au nom de la Demanderesse. For further details concerning this technique, reference may for example be made to document FR-A-2,749,974 in the name of the Applicant.
Cependant, les ensembles de montage connus dans l'état de la technique présentent un certain nombre d'inconvénients au niveau de ce raccordement entre les conducteurs de l'araignée et les plages de contact du circuit intégré. However, the mounting assemblies known in the prior art have a certain number of drawbacks at the level of this connection between the conductors of the spider and the contact pads of the integrated circuit.
En effet, il a été constaté l'apparition de composés intermétalliques pendant l'opération de raccordement, entre les conducteurs en cuivre de l'araignée et les plages de contact en aluminium du circuit intégré. Ceci se traduit par des problèmes au niveau de la qualité de la jonction tant du point de vue électrique que du point de vue thermique. Indeed, it was noted the appearance of intermetallic compounds during the connection operation, between the copper conductors of the spider and the aluminum contact pads of the integrated circuit. This results in problems with the quality of the junction both from the electrical point of view and from the thermal point of view.
De plus, il a également été constaté que l'utilisation de cuivre pour réaliser ces conducteurs se traduit par des perturbations au niveau de certaines mesures sous rayonnement et induit des modifications de diffusion au niveau des plages de contact du circuit intégré. In addition, it has also been observed that the use of copper to produce these conductors results in disturbances in certain measurements under radiation and induces diffusion modifications in the contact pads of the integrated circuit.
Le but de l'invention est donc de résoudre ces problèmes. The object of the invention is therefore to solve these problems.
A cet effet, l'invention a pour objet un ensemble de montage d'un circuit intégré sur un support comprenant une structure de conducteurs électriques prévue pour la connexion de bornes d'entrée/sortie du circuit intégré, caractérisé en ce que la structure de conducteurs électriques est en aluminium de qualité électronique. To this end, the subject of the invention is an assembly assembly of an integrated circuit on a support comprising a structure of electrical conductors provided for the connection of input / output terminals of the integrated circuit, characterized in that the structure of electrical conductors is electronic grade aluminum.
Selon une autre caractéristique, les conducteurs électriques de la structure sont raccordés aux bornes d'entrée/sortie du circuit intégré par un procédé de soudage par thermosonie. According to another characteristic, the electrical conductors of the structure are connected to the input / output terminals of the integrated circuit by a heat-welding process.
<Desc/Clms Page number 3> <Desc / Clms Page number 3>
Selon une autre caractéristique, la structure de conducteurs présente une épaisseur comprise entre 10 et 70 um. According to another characteristic, the conductor structure has a thickness of between 10 and 70 μm.
Selon une autre caractéristique, la structure de conducteurs est formée par gravure d'une feuille d'aluminium. According to another characteristic, the conductor structure is formed by etching an aluminum sheet.
Selon une autre caractéristique, l'ensemble circuit intégré-structure de conducteurs électriques est connecté sur un support à circuit imprimé par un procédé de soudage par thermosonie. According to another characteristic, the integrated circuit-structure of electrical conductors assembly is connected to a printed circuit support by a heat-welding process.
Selon une autre caractéristique, le support à circuit imprimé est en matière organique ou céramique. According to another characteristic, the printed circuit support is made of organic or ceramic material.
Selon une autre caractéristique, la finition du circuit imprimé est en or électrolytique ou catalytique. According to another characteristic, the finish of the printed circuit is in electrolytic or catalytic gold.
L'invention sera mieux comprise à la lecture de la description qui va suivre, donnée uniquement à titre d'exemple et faite en se référant au dessin annexé, qui représente une vue en coupe illustrant le raccordement d'un conducteur d'une structure de conducteurs à une plage de contact d'un circuit intégré. The invention will be better understood on reading the description which follows, given solely by way of example and made with reference to the appended drawing, which represents a sectional view illustrating the connection of a conductor of a structure of conductors at a contact area of an integrated circuit.
On reconnaît en effet sur cette figure, une portion d'un circuit intégré désigné par la référence générale 1 et plus particulièrement une plage de contact 2 formant borne d'entrée/sortie de celui-ci. Sur une face active de ce circuit, est disposée une couche de passivation 3 munie d'un trou désigné par la référence générale 4, permettant le raccordement d'un conducteur 5 et plus particulièrement par exemple d'une extrémité 6 de celui-ci, à cette plage de contact 2 du circuit intégré. We recognize in this figure, a portion of an integrated circuit designated by the general reference 1 and more particularly a contact pad 2 forming an input / output terminal thereof. On a active face of this circuit, there is a passivation layer 3 provided with a hole designated by the general reference 4, allowing the connection of a conductor 5 and more particularly for example of an end 6 thereof, to this contact pad 2 of the integrated circuit.
Ce conducteur 5 fait partie d'une structure de conducteurs prévue pour la connexion des bornes d'entrée/sortie du circuit intégré. This conductor 5 is part of a structure of conductors provided for the connection of the input / output terminals of the integrated circuit.
Cette structure de conducteurs électriques est par exemple associée à un substrat de type classique. This structure of electrical conductors is for example associated with a substrate of the conventional type.
Le montage du circuit intégré est par exemple mis en oeuvre par une technique d'assemblage TAB telle que décrite précédemment. The assembly of the integrated circuit is for example implemented by a TAB assembly technique as described above.
Comme cela a été indiqué précédemment, la plage de contact formant borne d'entrée/sortie du circuit intégré, peut par exemple être en aluminium de qualité électronique. As indicated above, the contact pad forming the input / output terminal of the integrated circuit, may for example be made of electronic quality aluminum.
Selon l'invention, la structure de conducteurs électriques est également en aluminium de qualité électronique et les conducteurs électriques de cette According to the invention, the structure of electrical conductors is also made of electronic grade aluminum and the electrical conductors of this
<Desc/Clms Page number 4><Desc / Clms Page number 4>
structure peuvent être raccordés aux bornes d'entrée/sortie du circuit intégré par un procédé de soudage par thermosonie de type classique. structure can be connected to the input / output terminals of the integrated circuit by a conventional type thermosonic welding process.
Dans l'exemple décrit, le conducteur est raccordé directement à la plage de contact du circuit, son extrémité étant montée en porte-à-faux de façon classique. In the example described, the conductor is connected directly to the contact pad of the circuit, its end being mounted in cantilever in a conventional manner.
Selon cet exemple, il n'est donc pas nécessaire d'utiliser de boules de soudure entre ces plages et ces conducteurs, cette technique étant également connue dans l'état de la technique sous le nom de soudage sans boule (Bumpless). According to this example, it is therefore not necessary to use solder balls between these areas and these conductors, this technique being also known in the state of the art under the name of soldering without a ball (Bumpless).
Avantageusement, la structure de conducteurs présente une épaisseur comprise entre 10 et 70 um et peut par exemple être formée par gravure classique d'une feuille d'aluminium. Advantageously, the conductor structure has a thickness of between 10 and 70 μm and can for example be formed by conventional etching of an aluminum sheet.
On conçoit alors que la réalisation de la structure de conducteurs en aluminium de qualité électronique présente un certain nombre d'avantages par rapport à l'état de la technique. It will therefore be understood that the production of the structure of conductors made of electronic quality aluminum has a certain number of advantages over the state of the art.
En effet, cette solution permet de supprimer tout risque d'apparition de composés intermétalliques au niveau du raccordement entre la structure de conducteurs et les plages de contact du circuit intégré, ce qui permet d'améliorer la stabilité thermique de cette connexion et la qualité électrique de celle-ci. Indeed, this solution eliminates any risk of the appearance of intermetallic compounds at the connection between the conductor structure and the contact pads of the integrated circuit, which improves the thermal stability of this connection and the electrical quality. of it.
L'utilisation d'aluminium permet également de ne pas modifier les mesures sous rayonnement et de connecter l'ensemble du montage circuit intégréstructure de conducteurs, sur un support à circuit imprimé en matière organique ou céramique, dont la finition est en or électrolytique ou en or catalytique (électroless), en utilisant également un procédé de soudage par thermosonie de type classique. The use of aluminum also makes it possible not to modify the measurements under radiation and to connect the entire assembly of the integrated circuit, structure of conductors, on a printed circuit support in organic or ceramic material, the finish of which is in electrolytic gold or or catalytic (electroless), also using a conventional type thermosonic welding process.
Enfin, un tel ensemble de montage est compatible avec les procédés d'assemblage classiques, tels que par exemple le procédé ILB décrit précédemment. Finally, such an assembly assembly is compatible with conventional assembly methods, such as for example the ILB method described above.
Claims (7)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0017060A FR2818803A1 (en) | 2000-12-26 | 2000-12-26 | ASSEMBLY FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT |
| PCT/FR2001/004169 WO2002052633A2 (en) | 2000-12-26 | 2001-12-21 | Assembly for mounting an integrated circuit on a support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0017060A FR2818803A1 (en) | 2000-12-26 | 2000-12-26 | ASSEMBLY FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2818803A1 true FR2818803A1 (en) | 2002-06-28 |
Family
ID=8858226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0017060A Pending FR2818803A1 (en) | 2000-12-26 | 2000-12-26 | ASSEMBLY FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR2818803A1 (en) |
| WO (1) | WO2002052633A2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3698075A (en) * | 1969-11-05 | 1972-10-17 | Motorola Inc | Ultrasonic metallic sheet-frame bonding |
| US3793714A (en) * | 1971-05-27 | 1974-02-26 | Texas Instruments Inc | Integrated circuit assembly using etched metal patterns of flexible insulating film |
| EP0130498A1 (en) * | 1983-06-30 | 1985-01-09 | International Business Machines Corporation | Highly integrated universal tape bonding of semiconductor chips |
| FR2749974A1 (en) * | 1996-06-13 | 1997-12-19 | Bull Sa | METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT AND RESULTANT SUPPORT |
-
2000
- 2000-12-26 FR FR0017060A patent/FR2818803A1/en active Pending
-
2001
- 2001-12-21 WO PCT/FR2001/004169 patent/WO2002052633A2/en not_active Application Discontinuation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3698075A (en) * | 1969-11-05 | 1972-10-17 | Motorola Inc | Ultrasonic metallic sheet-frame bonding |
| US3793714A (en) * | 1971-05-27 | 1974-02-26 | Texas Instruments Inc | Integrated circuit assembly using etched metal patterns of flexible insulating film |
| EP0130498A1 (en) * | 1983-06-30 | 1985-01-09 | International Business Machines Corporation | Highly integrated universal tape bonding of semiconductor chips |
| FR2749974A1 (en) * | 1996-06-13 | 1997-12-19 | Bull Sa | METHOD FOR MOUNTING AN INTEGRATED CIRCUIT ON A SUPPORT AND RESULTANT SUPPORT |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2002052633A3 (en) | 2002-11-21 |
| WO2002052633A2 (en) | 2002-07-04 |
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