FR2816528B3 - PROCESS FOR SELECTIVE ETCHING OF COPPER AND SIDE CLEANING AND CIRCUMFERENCE OF A SUBSTRATE - Google Patents

PROCESS FOR SELECTIVE ETCHING OF COPPER AND SIDE CLEANING AND CIRCUMFERENCE OF A SUBSTRATE

Info

Publication number
FR2816528B3
FR2816528B3 FR0014628A FR0014628A FR2816528B3 FR 2816528 B3 FR2816528 B3 FR 2816528B3 FR 0014628 A FR0014628 A FR 0014628A FR 0014628 A FR0014628 A FR 0014628A FR 2816528 B3 FR2816528 B3 FR 2816528B3
Authority
FR
France
Prior art keywords
circumference
copper
substrate
selective etching
side cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0014628A
Other languages
French (fr)
Other versions
FR2816528A1 (en
Inventor
Lionel Girardie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR0014628A priority Critical patent/FR2816528B3/en
Publication of FR2816528A1 publication Critical patent/FR2816528A1/en
Application granted granted Critical
Publication of FR2816528B3 publication Critical patent/FR2816528B3/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
FR0014628A 2000-11-14 2000-11-14 PROCESS FOR SELECTIVE ETCHING OF COPPER AND SIDE CLEANING AND CIRCUMFERENCE OF A SUBSTRATE Expired - Fee Related FR2816528B3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0014628A FR2816528B3 (en) 2000-11-14 2000-11-14 PROCESS FOR SELECTIVE ETCHING OF COPPER AND SIDE CLEANING AND CIRCUMFERENCE OF A SUBSTRATE

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0014628A FR2816528B3 (en) 2000-11-14 2000-11-14 PROCESS FOR SELECTIVE ETCHING OF COPPER AND SIDE CLEANING AND CIRCUMFERENCE OF A SUBSTRATE

Publications (2)

Publication Number Publication Date
FR2816528A1 FR2816528A1 (en) 2002-05-17
FR2816528B3 true FR2816528B3 (en) 2003-04-04

Family

ID=8856422

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0014628A Expired - Fee Related FR2816528B3 (en) 2000-11-14 2000-11-14 PROCESS FOR SELECTIVE ETCHING OF COPPER AND SIDE CLEANING AND CIRCUMFERENCE OF A SUBSTRATE

Country Status (1)

Country Link
FR (1) FR2816528B3 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050084939A (en) * 2002-11-05 2005-08-29 메르크 파텐트 게엠베하 Semiconductor surface treatment and mixture used therein
US20070084793A1 (en) * 2005-10-18 2007-04-19 Nigel Wenden Method and apparatus for producing ultra-high purity water
WO2008098593A1 (en) * 2007-02-15 2008-08-21 Basf Se Titanium etchant composition

Also Published As

Publication number Publication date
FR2816528A1 (en) 2002-05-17

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Legal Events

Date Code Title Description
ST Notification of lapse