FR2812428B1 - Procede de fabrication d'un micromodule de carte a puce et carte a puce incluant un tel micromodule - Google Patents

Procede de fabrication d'un micromodule de carte a puce et carte a puce incluant un tel micromodule

Info

Publication number
FR2812428B1
FR2812428B1 FR0009797A FR0009797A FR2812428B1 FR 2812428 B1 FR2812428 B1 FR 2812428B1 FR 0009797 A FR0009797 A FR 0009797A FR 0009797 A FR0009797 A FR 0009797A FR 2812428 B1 FR2812428 B1 FR 2812428B1
Authority
FR
France
Prior art keywords
micromodule
chip card
manufacturing
card including
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0009797A
Other languages
English (en)
Other versions
FR2812428A1 (fr
Inventor
Pierre Brangier
Lucile Dossetto
Henri Boccia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR0009797A priority Critical patent/FR2812428B1/fr
Priority to AU2001278541A priority patent/AU2001278541A1/en
Priority to PCT/FR2001/002355 priority patent/WO2002009032A1/fr
Publication of FR2812428A1 publication Critical patent/FR2812428A1/fr
Application granted granted Critical
Publication of FR2812428B1 publication Critical patent/FR2812428B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR0009797A 2000-07-26 2000-07-26 Procede de fabrication d'un micromodule de carte a puce et carte a puce incluant un tel micromodule Expired - Fee Related FR2812428B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0009797A FR2812428B1 (fr) 2000-07-26 2000-07-26 Procede de fabrication d'un micromodule de carte a puce et carte a puce incluant un tel micromodule
AU2001278541A AU2001278541A1 (en) 2000-07-26 2001-07-19 Micromodule with on-line thermoformed film
PCT/FR2001/002355 WO2002009032A1 (fr) 2000-07-26 2001-07-19 Micromodule a film thermo forme en ligne

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0009797A FR2812428B1 (fr) 2000-07-26 2000-07-26 Procede de fabrication d'un micromodule de carte a puce et carte a puce incluant un tel micromodule

Publications (2)

Publication Number Publication Date
FR2812428A1 FR2812428A1 (fr) 2002-02-01
FR2812428B1 true FR2812428B1 (fr) 2004-01-30

Family

ID=8852933

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0009797A Expired - Fee Related FR2812428B1 (fr) 2000-07-26 2000-07-26 Procede de fabrication d'un micromodule de carte a puce et carte a puce incluant un tel micromodule

Country Status (3)

Country Link
AU (1) AU2001278541A1 (fr)
FR (1) FR2812428B1 (fr)
WO (1) WO2002009032A1 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0688050A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
DE19601203A1 (de) * 1996-01-15 1997-03-20 Siemens Ag Datenträgerkarte und Verfahren zu deren Herstellung
DE19753619A1 (de) * 1997-10-29 1999-05-06 Meto International Gmbh Identifizierungselement und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
AU2001278541A1 (en) 2002-02-05
WO2002009032A1 (fr) 2002-01-31
FR2812428A1 (fr) 2002-02-01

Similar Documents

Publication Publication Date Title
FR2798209B1 (fr) Procede de fabrication de cartes a puce
DE69635724D1 (de) Kontaktlose Chipkarte und Herstellungsverfahren
FR2803675B1 (fr) Carte a puce avec capteur d'empreintes digitales
FR2809867B1 (fr) Substrat fragilise et procede de fabrication d'un tel substrat
FR2732794B1 (fr) Lecteur de carte a puce
FR2793021B1 (fr) Capteur de temperature et procede de fabrication d'un tel capteur
FR2765010B1 (fr) Micromodule electronique, notamment pour carte a puce
FR2741191B1 (fr) Procede de fabrication d'un micromodule, notamment pour cartes a puces
FR2761498B1 (fr) Module electronique et son procede de fabrication et carte a puce comportant un tel module
FR2805331B1 (fr) Element multicanal et procede de fabrication d'un tel element
FR2808359B1 (fr) Carte a puce multi-applicatives
FR2776796B1 (fr) Procede de fabrication de cartes a puce
FR2800909B1 (fr) Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
FR2800911B1 (fr) Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
FR2749687B1 (fr) Carte a memoire et procede de fabrication d'une telle carte
FR2781298B1 (fr) Procede de fabrication d'une carte a puce electronique et carte a puce electronique
FR2737323B1 (fr) Lecteur de carte a puce
FR2800910B1 (fr) Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
DE69602942D1 (de) Chipkartenleser
FR2793331B1 (fr) Procede de fabrication d'une carte a microcircuit
FR2735599B1 (fr) Dispositif lecteur de carte a puce
FR2776448B1 (fr) Terminal de telecommunication lecteur de carte a puce
FR2764414B1 (fr) Procede de fabrication de carte a puce sans contact
FR2798036B1 (fr) Module electronique et procede de fabrication d'un tel module
FR2812428B1 (fr) Procede de fabrication d'un micromodule de carte a puce et carte a puce incluant un tel micromodule

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20100331