FR2812126B1 - Enrobage pour circuit electronique, pastille et coque de protection utilisant un tel enrobage et procede de fabrication d'une telle pastille - Google Patents
Enrobage pour circuit electronique, pastille et coque de protection utilisant un tel enrobage et procede de fabrication d'une telle pastilleInfo
- Publication number
- FR2812126B1 FR2812126B1 FR0009457A FR0009457A FR2812126B1 FR 2812126 B1 FR2812126 B1 FR 2812126B1 FR 0009457 A FR0009457 A FR 0009457A FR 0009457 A FR0009457 A FR 0009457A FR 2812126 B1 FR2812126 B1 FR 2812126B1
- Authority
- FR
- France
- Prior art keywords
- pellet
- coating
- manufacturing
- electronic circuit
- protective shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/685—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks by laminating inserts between two plastic films or plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0009457A FR2812126B1 (fr) | 2000-07-19 | 2000-07-19 | Enrobage pour circuit electronique, pastille et coque de protection utilisant un tel enrobage et procede de fabrication d'une telle pastille |
PCT/FR2001/002263 WO2002007082A1 (fr) | 2000-07-19 | 2001-07-12 | Enrobage pour circuit electronique, pastille et coque de protection utilisant un tel enrobage et procede de fabrication d'une telle pastille |
AU2001276439A AU2001276439A1 (en) | 2000-07-19 | 2001-07-12 | Coating for electronic circuit, protective pellet and shell using same and method for making such a pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0009457A FR2812126B1 (fr) | 2000-07-19 | 2000-07-19 | Enrobage pour circuit electronique, pastille et coque de protection utilisant un tel enrobage et procede de fabrication d'une telle pastille |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2812126A1 FR2812126A1 (fr) | 2002-01-25 |
FR2812126B1 true FR2812126B1 (fr) | 2003-08-22 |
Family
ID=8852677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0009457A Expired - Fee Related FR2812126B1 (fr) | 2000-07-19 | 2000-07-19 | Enrobage pour circuit electronique, pastille et coque de protection utilisant un tel enrobage et procede de fabrication d'une telle pastille |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001276439A1 (fr) |
FR (1) | FR2812126B1 (fr) |
WO (1) | WO2002007082A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2854098B1 (fr) | 2003-04-23 | 2007-04-06 | Daniel Andre Gastel | Produit lamine avec organe d'identification electronique et dispositif d'identification et de suivi de ces produits |
US8101014B2 (en) | 2004-11-10 | 2012-01-24 | Chemetall Gmbh | Process for coating metallic surfaces with a multicomponent aqueous composition |
CN108829995B (zh) * | 2018-06-25 | 2022-06-14 | 上海华力集成电路制造有限公司 | 集成电路电感器件类型识别辅助层及电感器件类型识别方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2739587B1 (fr) * | 1995-10-09 | 1997-11-07 | Bourgogne Grasset | Jeton de jeu |
FR2769110B1 (fr) * | 1997-09-26 | 1999-12-03 | Gemplus Card Int | Procede de fabrication d'un module ou etiquette electronique, module ou etiquette obtenue et support comportant un tel module ou etiquette |
-
2000
- 2000-07-19 FR FR0009457A patent/FR2812126B1/fr not_active Expired - Fee Related
-
2001
- 2001-07-12 AU AU2001276439A patent/AU2001276439A1/en not_active Abandoned
- 2001-07-12 WO PCT/FR2001/002263 patent/WO2002007082A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2812126A1 (fr) | 2002-01-25 |
WO2002007082A1 (fr) | 2002-01-24 |
AU2001276439A1 (en) | 2002-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CJ | Change in legal form | ||
CD | Change of name or company name | ||
ST | Notification of lapse |
Effective date: 20100331 |