FR2801424B1 - Imageur et procede de scellement d'imageur - Google Patents

Imageur et procede de scellement d'imageur

Info

Publication number
FR2801424B1
FR2801424B1 FR0014093A FR0014093A FR2801424B1 FR 2801424 B1 FR2801424 B1 FR 2801424B1 FR 0014093 A FR0014093 A FR 0014093A FR 0014093 A FR0014093 A FR 0014093A FR 2801424 B1 FR2801424 B1 FR 2801424B1
Authority
FR
France
Prior art keywords
imageur
imager
sealing method
sealing
imageur sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0014093A
Other languages
English (en)
Other versions
FR2801424A1 (fr
Inventor
Ching Yeu Wei
Michael Clement Dejule
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2801424A1 publication Critical patent/FR2801424A1/fr
Application granted granted Critical
Publication of FR2801424B1 publication Critical patent/FR2801424B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02322—Optical elements or arrangements associated with the device comprising luminescent members, e.g. fluorescent sheets upon the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/30—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
    • A61B6/50—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment specially adapted for specific body parts; specially adapted for specific clinical applications
    • A61B6/502—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment specially adapted for specific body parts; specially adapted for specific clinical applications for diagnosis of breast, i.e. mammography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/32—Transforming X-rays

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
FR0014093A 1999-11-04 2000-11-03 Imageur et procede de scellement d'imageur Expired - Fee Related FR2801424B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/433,754 US6350990B1 (en) 1999-11-04 1999-11-04 End cap and sealing method for imager

Publications (2)

Publication Number Publication Date
FR2801424A1 FR2801424A1 (fr) 2001-05-25
FR2801424B1 true FR2801424B1 (fr) 2005-09-09

Family

ID=23721419

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0014093A Expired - Fee Related FR2801424B1 (fr) 1999-11-04 2000-11-03 Imageur et procede de scellement d'imageur

Country Status (4)

Country Link
US (1) US6350990B1 (fr)
JP (1) JP4691239B2 (fr)
DE (1) DE10053417A1 (fr)
FR (1) FR2801424B1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001051950A1 (fr) * 2000-01-11 2001-07-19 Hamamatsu Photonics K.K. Capteur d'image rayons x
US6657201B2 (en) * 2001-06-29 2003-12-02 General Electric Company Cover plate having spacer lip with hermetic barrier for radiation imager and method of manufacturing same
US6642524B2 (en) * 2002-01-09 2003-11-04 Ge Medical Systems Global Technology Company, Llc Scintillator sealing for solid state X-ray detector
US7473903B2 (en) * 2003-02-12 2009-01-06 General Electric Company Method and apparatus for deposited hermetic cover for digital X-ray panel
JP4834412B2 (ja) * 2006-02-03 2011-12-14 富士フイルム株式会社 固体撮像装置およびこれを用いた電子内視鏡
JP5197468B2 (ja) * 2009-03-31 2013-05-15 富士フイルム株式会社 放射線検出装置
JP2012168128A (ja) * 2011-02-16 2012-09-06 Canon Inc 放射線検出装置及び放射線撮像システム

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259884A (ja) * 1985-09-11 1987-03-16 Oyo Koken Kogyo Kk シンチレ−シヨン検出器
JPH0216080U (fr) * 1988-07-15 1990-02-01
US5179284A (en) * 1991-08-21 1993-01-12 General Electric Company Solid state radiation imager having a reflective and protective coating
US5132539A (en) * 1991-08-29 1992-07-21 General Electric Company Planar X-ray imager having a moisture-resistant sealing structure
US5389775A (en) 1993-12-03 1995-02-14 General Electric Company Imager assembly with multiple common electrode contacts
US5641984A (en) * 1994-08-19 1997-06-24 General Electric Company Hermetically sealed radiation imager
JPH08238233A (ja) * 1995-03-06 1996-09-17 Toshiba Corp Ｘ線撮影装置
JP3880094B2 (ja) * 1996-02-22 2007-02-14 キヤノン株式会社 放射線検出装置及びその製造方法
JPH09257944A (ja) * 1996-03-27 1997-10-03 Canon Inc 放射線検出器
US5874738A (en) * 1996-07-16 1999-02-23 Saint-Gobain Industrial Ceramics, Inc. Scintillation crystal modules and methods of making the same
JPH1093061A (ja) * 1996-09-11 1998-04-10 Toshiba Corp 画像検出装置、アレイ基板および画像検出装置の製造方法
KR100514547B1 (ko) * 1997-02-14 2005-12-14 하마마츠 포토닉스 가부시키가이샤 방사선검출소자및그제조방법
EP0908743B1 (fr) * 1997-10-01 2006-07-05 Siemens Aktiengesellschaft Détecteur de rayonnement X
US6172371B1 (en) * 1998-06-15 2001-01-09 General Electric Company Robust cover plate for radiation imager
JP3430040B2 (ja) * 1998-11-19 2003-07-28 シャープ株式会社 二次元画像検出器およびその製造方法

Also Published As

Publication number Publication date
DE10053417A1 (de) 2001-05-10
FR2801424A1 (fr) 2001-05-25
JP2001208853A (ja) 2001-08-03
US6350990B1 (en) 2002-02-26
JP4691239B2 (ja) 2011-06-01

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20140731