FR2797203B1 - HEAD FOR DEPOSITING A SUBSTANCE ON A SUPPORT OF THE TYPE OF ELECTRONIC CIRCUIT SUPPORT AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES - Google Patents
HEAD FOR DEPOSITING A SUBSTANCE ON A SUPPORT OF THE TYPE OF ELECTRONIC CIRCUIT SUPPORT AND METHOD FOR MANUFACTURING ELECTRONIC DEVICESInfo
- Publication number
- FR2797203B1 FR2797203B1 FR9906728A FR9906728A FR2797203B1 FR 2797203 B1 FR2797203 B1 FR 2797203B1 FR 9906728 A FR9906728 A FR 9906728A FR 9906728 A FR9906728 A FR 9906728A FR 2797203 B1 FR2797203 B1 FR 2797203B1
- Authority
- FR
- France
- Prior art keywords
- support
- depositing
- substance
- head
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/25—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of a plurality of high density interconnect connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2405—Shape
- H01L2224/24051—Conformal with the semiconductor or solid-state device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9906728A FR2797203B1 (en) | 1999-05-27 | 1999-05-27 | HEAD FOR DEPOSITING A SUBSTANCE ON A SUPPORT OF THE TYPE OF ELECTRONIC CIRCUIT SUPPORT AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES |
AU44156/00A AU4415600A (en) | 1999-05-27 | 2000-05-11 | Head for depositing a substance on a support with an electronic circuit |
PCT/FR2000/001266 WO2000073986A1 (en) | 1999-05-27 | 2000-05-11 | Head for depositing a substance on a support with an electronic circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9906728A FR2797203B1 (en) | 1999-05-27 | 1999-05-27 | HEAD FOR DEPOSITING A SUBSTANCE ON A SUPPORT OF THE TYPE OF ELECTRONIC CIRCUIT SUPPORT AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2797203A1 FR2797203A1 (en) | 2001-02-09 |
FR2797203B1 true FR2797203B1 (en) | 2002-03-22 |
Family
ID=9546082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9906728A Expired - Fee Related FR2797203B1 (en) | 1999-05-27 | 1999-05-27 | HEAD FOR DEPOSITING A SUBSTANCE ON A SUPPORT OF THE TYPE OF ELECTRONIC CIRCUIT SUPPORT AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU4415600A (en) |
FR (1) | FR2797203B1 (en) |
WO (1) | WO2000073986A1 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5187123A (en) * | 1988-04-30 | 1993-02-16 | Matsushita Electric Industrial Co., Ltd. | Method for bonding a semiconductor device to a lead frame die pad using plural adhesive spots |
DE9315652U1 (en) * | 1993-10-15 | 1993-12-23 | Nordson Corp | Application head for applying adhesive to a substrate, in particular for gluing a chip to a card |
US5423889A (en) * | 1994-06-24 | 1995-06-13 | Harris Corporation | Process for manufacturing a multi-port adhesive dispensing tool |
US5681757A (en) * | 1996-04-29 | 1997-10-28 | Microfab Technologies, Inc. | Process for dispensing semiconductor die-bond adhesive using a printhead having a microjet array and the product produced by the process |
-
1999
- 1999-05-27 FR FR9906728A patent/FR2797203B1/en not_active Expired - Fee Related
-
2000
- 2000-05-11 AU AU44156/00A patent/AU4415600A/en not_active Abandoned
- 2000-05-11 WO PCT/FR2000/001266 patent/WO2000073986A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
FR2797203A1 (en) | 2001-02-09 |
AU4415600A (en) | 2000-12-18 |
WO2000073986A1 (en) | 2000-12-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2769440B1 (en) | METHOD FOR MANUFACTURING AN ELECTRONIC CHIP AND / OR ANTENNA DEVICE AND DEVICE OBTAINED BY THE METHOD | |
FR2791470B1 (en) | MONOLITHIC INTEGRATED CIRCUIT INCORPORATING AN INDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING SUCH AN INTEGRATED CIRCUIT | |
FR2691817B1 (en) | METHOD AND ELECTRONIC BOARD FOR THE DEVELOPMENT OF AN INTEGRATED CIRCUIT. | |
DE69008963T2 (en) | Electronic circuit substrate. | |
FR2662854B1 (en) | INSULATED CONNECTION HOLE STRUCTURE FOR SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD. | |
FR2699330B1 (en) | HIGH FREQUENCY INTEGRATED CIRCUIT BOX. | |
FR2747509B1 (en) | MOUNTING STRUCTURE FOR A SEMICONDUCTOR CIRCUIT | |
FR2689314B1 (en) | Integrated circuit comprising an interlayer insulating film and process for its production. | |
EP0417992A3 (en) | A stackable multilayer substrate for mounting integrated circuits | |
FR2781065B1 (en) | METHOD OF PLACING-ROUTING A GLOBAL CLOCK CIRCUIT ON AN INTEGRATED CIRCUIT, AND ASSOCIATED DEVICES | |
FR2696279B1 (en) | Method for allowing the mounting of a chip on a substrate and chip prepared according to the method. | |
FR2671232B1 (en) | LOAD FOR DIELECTRIC SUBSTRATE MICROPHONE LINE. | |
GB2264827B (en) | Oscillator circuit die on ceramic substrate | |
FR2589279B1 (en) | ELECTRONIC SEMICONDUCTOR DEVICE FOR PROTECTING INTEGRATED CIRCUITS FROM ELECTROSTATIC DISCHARGES AND METHOD FOR MANUFACTURING THE SAME | |
FR2589278B1 (en) | ELECTRONIC DEVICE FOR PROTECTING INTEGRATED CIRCUITS FROM ELECTROSTATIC CHARGES AND METHOD FOR MANUFACTURING THE SAME | |
FR2753305B1 (en) | METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR NON-CONTACT MEMORY CARDS | |
FR2792077B1 (en) | INSTALLATION AND METHOD FOR MICROSCOPIC OBSERVATION OF A SEMICONDUCTOR ELECTRONIC CIRCUIT | |
FR2797203B1 (en) | HEAD FOR DEPOSITING A SUBSTANCE ON A SUPPORT OF THE TYPE OF ELECTRONIC CIRCUIT SUPPORT AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES | |
FR2770028B1 (en) | METHOD FOR MANUFACTURING AN INTERCONNECTION STRUCTURE FOR AN INTEGRATED CIRCUIT DEVICE | |
FR2779255B1 (en) | METHOD FOR MANUFACTURING A PORTABLE ELECTRONIC DEVICE COMPRISING AT LEAST ONE INTEGRATED CIRCUIT CHIP | |
FR2781603B1 (en) | METHOD FOR FORMING CAPACITY ON AN INTEGRATED CIRCUIT | |
FR2742871B1 (en) | LOCATION OF DEFECTS IN A METAL LAYER OF A SEMICONDUCTOR CIRCUIT | |
FR2798036B1 (en) | ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SUCH A MODULE | |
FR2571920B1 (en) | ARRANGEMENT FOR MOUNTING AN ELECTRONIC DISPLAY | |
FR2756099B1 (en) | PROCESS FOR MANUFACTURING AN NPN MINIMUM SURFACE TRANSISTOR |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100129 |