FR2792113B1 - METHOD FOR PRODUCING AN INTEGRATED CIRCUIT COMPRISING A SIDE INSULATION TRENCH ATTACHED TO AN ACTIVE ZONE OF A TRANSISTOR, AND CORRESPONDING INTEGRATED CIRCUIT - Google Patents
METHOD FOR PRODUCING AN INTEGRATED CIRCUIT COMPRISING A SIDE INSULATION TRENCH ATTACHED TO AN ACTIVE ZONE OF A TRANSISTOR, AND CORRESPONDING INTEGRATED CIRCUITInfo
- Publication number
- FR2792113B1 FR2792113B1 FR9904269A FR9904269A FR2792113B1 FR 2792113 B1 FR2792113 B1 FR 2792113B1 FR 9904269 A FR9904269 A FR 9904269A FR 9904269 A FR9904269 A FR 9904269A FR 2792113 B1 FR2792113 B1 FR 2792113B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- transistor
- producing
- active zone
- side insulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9904269A FR2792113B1 (en) | 1999-04-06 | 1999-04-06 | METHOD FOR PRODUCING AN INTEGRATED CIRCUIT COMPRISING A SIDE INSULATION TRENCH ATTACHED TO AN ACTIVE ZONE OF A TRANSISTOR, AND CORRESPONDING INTEGRATED CIRCUIT |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9904269A FR2792113B1 (en) | 1999-04-06 | 1999-04-06 | METHOD FOR PRODUCING AN INTEGRATED CIRCUIT COMPRISING A SIDE INSULATION TRENCH ATTACHED TO AN ACTIVE ZONE OF A TRANSISTOR, AND CORRESPONDING INTEGRATED CIRCUIT |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2792113A1 FR2792113A1 (en) | 2000-10-13 |
FR2792113B1 true FR2792113B1 (en) | 2002-08-09 |
Family
ID=9544062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9904269A Expired - Lifetime FR2792113B1 (en) | 1999-04-06 | 1999-04-06 | METHOD FOR PRODUCING AN INTEGRATED CIRCUIT COMPRISING A SIDE INSULATION TRENCH ATTACHED TO AN ACTIVE ZONE OF A TRANSISTOR, AND CORRESPONDING INTEGRATED CIRCUIT |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2792113B1 (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07193121A (en) * | 1993-12-27 | 1995-07-28 | Toshiba Corp | Production of semiconductor device |
JPH0897276A (en) * | 1994-09-29 | 1996-04-12 | Toshiba Corp | Manufacture of semiconductor device |
KR100213196B1 (en) * | 1996-03-15 | 1999-08-02 | 윤종용 | Trench device separation |
US5712185A (en) * | 1996-04-23 | 1998-01-27 | United Microelectronics | Method for forming shallow trench isolation |
TW388100B (en) * | 1997-02-18 | 2000-04-21 | Hitachi Ulsi Eng Corp | Semiconductor deivce and process for producing the same |
US5731241A (en) * | 1997-05-15 | 1998-03-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-aligned sacrificial oxide for shallow trench isolation |
-
1999
- 1999-04-06 FR FR9904269A patent/FR2792113B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2792113A1 (en) | 2000-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TQ | Partial transmission of property | ||
PLFP | Fee payment |
Year of fee payment: 18 |
|
PLFP | Fee payment |
Year of fee payment: 19 |
|
PLFP | Fee payment |
Year of fee payment: 20 |