FR2780534B1 - PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD - Google Patents

PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD

Info

Publication number
FR2780534B1
FR2780534B1 FR9808060A FR9808060A FR2780534B1 FR 2780534 B1 FR2780534 B1 FR 2780534B1 FR 9808060 A FR9808060 A FR 9808060A FR 9808060 A FR9808060 A FR 9808060A FR 2780534 B1 FR2780534 B1 FR 2780534B1
Authority
FR
France
Prior art keywords
portable objects
electronic components
producing
objects
portable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9808060A
Other languages
French (fr)
Other versions
FR2780534A1 (en
Inventor
Stephane Provost
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Priority to FR9808060A priority Critical patent/FR2780534B1/en
Publication of FR2780534A1 publication Critical patent/FR2780534A1/en
Application granted granted Critical
Publication of FR2780534B1 publication Critical patent/FR2780534B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR9808060A 1998-06-25 1998-06-25 PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD Expired - Fee Related FR2780534B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9808060A FR2780534B1 (en) 1998-06-25 1998-06-25 PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9808060A FR2780534B1 (en) 1998-06-25 1998-06-25 PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD

Publications (2)

Publication Number Publication Date
FR2780534A1 FR2780534A1 (en) 1999-12-31
FR2780534B1 true FR2780534B1 (en) 2002-08-16

Family

ID=9527850

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9808060A Expired - Fee Related FR2780534B1 (en) 1998-06-25 1998-06-25 PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD

Country Status (1)

Country Link
FR (1) FR2780534B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101111855B (en) * 2005-02-01 2012-04-18 纳格雷德股份有限公司 Method for applying an electronic assembly to a substrate and a device for applying said assembly

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10124770C1 (en) * 2001-05-21 2002-10-17 Infineon Technologies Ag Process for contacting an electrical component, especially a semiconductor component, to a substrate comprises applying a connecting unit between the electrical component
FI119401B (en) * 2001-12-21 2008-10-31 Upm Raflatac Oy Smart label web and process for its manufacture
DE10304777B4 (en) * 2003-02-05 2006-11-23 Infineon Technologies Ag Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method
US8119458B2 (en) 2005-02-01 2012-02-21 Nagraid S.A. Placement method of an electronic module on a substrate
JP2006332094A (en) 2005-05-23 2006-12-07 Seiko Epson Corp Process for producing electronic substrate, process for manufacturing semiconductor device and process for manufacturing electronic apparatus
DE102014114982B4 (en) * 2014-10-15 2023-01-26 Infineon Technologies Ag Method of forming a chip package
DE102016012755A1 (en) * 2016-10-25 2018-04-26 Mühlbauer Gmbh & Co. Kg Method and device for producing a card body with a chip and card body with a chip

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.
ZA941671B (en) * 1993-03-11 1994-10-12 Csir Attaching an electronic circuit to a substrate.
DE19533983C2 (en) * 1995-09-14 1997-09-25 Wendisch Karl Heinz Chip card with antenna winding
DE19617621C2 (en) * 1996-05-02 1998-04-09 Kiefel Gmbh Paul Process for the production of a laminate, use of flexible material in the production of a laminate and laminate produced according to the mentioned process
JPH09309284A (en) * 1996-05-22 1997-12-02 Hitachi Chem Co Ltd Manufacture of ic card
FR2753305B1 (en) * 1996-09-12 1998-11-06 Schlumberger Ind Sa METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR NON-CONTACT MEMORY CARDS

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101111855B (en) * 2005-02-01 2012-04-18 纳格雷德股份有限公司 Method for applying an electronic assembly to a substrate and a device for applying said assembly

Also Published As

Publication number Publication date
FR2780534A1 (en) 1999-12-31

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Legal Events

Date Code Title Description
ST Notification of lapse