FR2780534B1 - PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD - Google Patents
PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHODInfo
- Publication number
- FR2780534B1 FR2780534B1 FR9808060A FR9808060A FR2780534B1 FR 2780534 B1 FR2780534 B1 FR 2780534B1 FR 9808060 A FR9808060 A FR 9808060A FR 9808060 A FR9808060 A FR 9808060A FR 2780534 B1 FR2780534 B1 FR 2780534B1
- Authority
- FR
- France
- Prior art keywords
- portable objects
- electronic components
- producing
- objects
- portable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808060A FR2780534B1 (en) | 1998-06-25 | 1998-06-25 | PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9808060A FR2780534B1 (en) | 1998-06-25 | 1998-06-25 | PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2780534A1 FR2780534A1 (en) | 1999-12-31 |
FR2780534B1 true FR2780534B1 (en) | 2002-08-16 |
Family
ID=9527850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9808060A Expired - Fee Related FR2780534B1 (en) | 1998-06-25 | 1998-06-25 | PROCESS FOR PRODUCING PORTABLE OBJECTS WITH ELECTRONIC COMPONENTS AND PORTABLE OBJECTS AS OBTAINED BY SAID METHOD |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2780534B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101111855B (en) * | 2005-02-01 | 2012-04-18 | 纳格雷德股份有限公司 | Method for applying an electronic assembly to a substrate and a device for applying said assembly |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10124770C1 (en) * | 2001-05-21 | 2002-10-17 | Infineon Technologies Ag | Process for contacting an electrical component, especially a semiconductor component, to a substrate comprises applying a connecting unit between the electrical component |
FI119401B (en) * | 2001-12-21 | 2008-10-31 | Upm Raflatac Oy | Smart label web and process for its manufacture |
DE10304777B4 (en) * | 2003-02-05 | 2006-11-23 | Infineon Technologies Ag | Method for producing a chip using a heat and pressure process using a thermoplastic material and apparatus for carrying out the method |
US8119458B2 (en) | 2005-02-01 | 2012-02-21 | Nagraid S.A. | Placement method of an electronic module on a substrate |
JP2006332094A (en) | 2005-05-23 | 2006-12-07 | Seiko Epson Corp | Process for producing electronic substrate, process for manufacturing semiconductor device and process for manufacturing electronic apparatus |
DE102014114982B4 (en) * | 2014-10-15 | 2023-01-26 | Infineon Technologies Ag | Method of forming a chip package |
DE102016012755A1 (en) * | 2016-10-25 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Method and device for producing a card body with a chip and card body with a chip |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2701139B1 (en) * | 1993-02-01 | 1995-04-21 | Solaic Sa | Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted. |
ZA941671B (en) * | 1993-03-11 | 1994-10-12 | Csir | Attaching an electronic circuit to a substrate. |
DE19533983C2 (en) * | 1995-09-14 | 1997-09-25 | Wendisch Karl Heinz | Chip card with antenna winding |
DE19617621C2 (en) * | 1996-05-02 | 1998-04-09 | Kiefel Gmbh Paul | Process for the production of a laminate, use of flexible material in the production of a laminate and laminate produced according to the mentioned process |
JPH09309284A (en) * | 1996-05-22 | 1997-12-02 | Hitachi Chem Co Ltd | Manufacture of ic card |
FR2753305B1 (en) * | 1996-09-12 | 1998-11-06 | Schlumberger Ind Sa | METHOD FOR MANUFACTURING AN ASSEMBLY OF ELECTRONIC MODULES FOR NON-CONTACT MEMORY CARDS |
-
1998
- 1998-06-25 FR FR9808060A patent/FR2780534B1/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101111855B (en) * | 2005-02-01 | 2012-04-18 | 纳格雷德股份有限公司 | Method for applying an electronic assembly to a substrate and a device for applying said assembly |
Also Published As
Publication number | Publication date |
---|---|
FR2780534A1 (en) | 1999-12-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |