FR2771889A1 - High frequency chip mounting construction - Google Patents
High frequency chip mounting construction Download PDFInfo
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- FR2771889A1 FR2771889A1 FR9715008A FR9715008A FR2771889A1 FR 2771889 A1 FR2771889 A1 FR 2771889A1 FR 9715008 A FR9715008 A FR 9715008A FR 9715008 A FR9715008 A FR 9715008A FR 2771889 A1 FR2771889 A1 FR 2771889A1
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- printed circuit
- face
- conductors
- ground planes
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Condensed Matter Physics & Semiconductors (AREA)
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
La présente invention concerne un procédé de montage d'un boîtier hyperfréquence en surface, comportant une puce électronique, sur un circuit imprimé et un boîtier et un circuit imprimé conçus pour la mise en oeuvre de ce procédé. The present invention relates to a method of mounting a microwave box on the surface, comprising an electronic chip, on a printed circuit and a box and a printed circuit designed for the implementation of this method.
II est connu de monter directement une puce électronique, chip dans la littérature anglo-saxonne, sur un circuit imprimé d'accueil il est également connu de monter la puce sur un mini circuit imprimé pour former un boîtier hyperfréquence qui est ensuite monté en surface sur le circuit imprimé d'accueil. Dans les deux cas il est connu de réaliser les liaisons avec le circuit imprimé d'accueil par câblage filaire et de couvrir la puce ou le boîtier hyperfréquence avec un capot de protection. Mais la mise en oeuvre de telles techniques de montage, en quantité, est coûteuse car, pour des fréquences de fonctionnement élevées, elle exige, pour la réalisation du câblage, lors de l'équipement du circuit imprimé d'accueil, l'utilisation de matériel de microélectronique ; sans un tel matériel il n'est pratiquement pas possible, en utilisant ces techniques de montage, de travailler à des fréquences supérieures à 12 GHz. It is known to mount a microchip directly, chip in the Anglo-Saxon literature, on a host printed circuit it is also known to mount the chip on a mini printed circuit to form a microwave package which is then surface mounted on the home circuit board. In both cases, it is known to make the connections with the host printed circuit by wired wiring and to cover the chip or the microwave box with a protective cover. However, the implementation of such mounting techniques, in quantity, is expensive because, for high operating frequencies, it requires, for the realization of the wiring, when equipping the host printed circuit, the use of microelectronics equipment; without such equipment it is practically impossible, using these mounting techniques, to work at frequencies above 12 GHz.
Le but de la présente invention est d'éviter cet inconvénient. The object of the present invention is to avoid this drawback.
Ceci est obtenu par montage d'un mini circuit imprimé portant la puce sur un circuit imprimé d'accueil, où la face active du mini circuit imprimé portant la puce est soudée sur le circuit imprimé d'accueil et où des plans de masse répartis sur les deux circuits imprimés forment une sorte de cage constituant un blindage autour de la puce. This is obtained by mounting a mini printed circuit carrying the chip on a receiving printed circuit, where the active face of the mini printed circuit carrying the chip is soldered on the receiving printed circuit and where ground planes distributed on the two printed circuits form a sort of cage constituting a shield around the chip.
Selon l'invention il est proposé un procédé de montage d'un boitier hyperfréquence sur un circuit imprimé, caractérisé en ce qu'il consiste - à utiliser un boîtier hyperfréquence ayant deux faces parallèles dont une première face avec une puce électronique, des conducteurs connectés à la puce et des plans de masse intercalés entre les conducteurs et une seconde face constituée par un plan de masse connecté aux plans de masse de la première face réaliser un circuit imprimé ayant une première face avec, dans une zone dédiée au boîtier, des conducteurs et des plans de masse et une seconde face constituée par un plan de masse connecté aux plans de masse de la première face du circuit imprimé, les deux premières faces ayant d'une part leurs plans de masse et d'autre part leurs conducteurs qui, dans une position prédéterminée du boîtier sur le circuit imprimé, sont en contact biunivoque, - à placer le boîtier dans la position prédéterminée - et à connecter le boîtier au circuit imprimé par soudure des conducteurs et des plans de masse en contact biunivoque. According to the invention there is provided a method of mounting a microwave box on a printed circuit, characterized in that it consists of - using a microwave box having two parallel faces, one face of which with an electronic chip, connected conductors to the chip and ground planes interposed between the conductors and a second face constituted by a ground plane connected to the ground planes of the first face make a printed circuit having a first face with, in an area dedicated to the housing, conductors and ground planes and a second face constituted by a ground plane connected to the ground planes of the first face of the printed circuit, the first two faces having on the one hand their ground planes and on the other hand their conductors which, in a predetermined position of the housing on the printed circuit, are in one-to-one contact, - to place the housing in the predetermined position - and to con Connect the box to the printed circuit by soldering the conductors and ground planes in one-to-one contact.
Selon l'invention il est proposé un boîtier hyperfréquence, pour la mise en oeuvre d'un procédé de montage d'un boîtier sur un circuit imprimé, ce boîtier hyperfréquence comportant un mini circuit imprimé avec une première et une seconde face, la première face comportant une puce électronique et des conducteurs connectés à la puce et la seconde face étant constituée par un plan de masse, caractérisé en ce que la première face comporte des plans de masse, en ce que ces plans de masse sont intercalés entre les conducteurs et en ce que le mini circuit imprimé comporte des connexions entre les plans de masse de la première face et le plan de masse de la seconde face. According to the invention, a microwave box is proposed, for implementing a method of mounting a box on a printed circuit, this microwave box comprising a mini printed circuit with a first and a second face, the first face. comprising an electronic chip and conductors connected to the chip and the second face being constituted by a ground plane, characterized in that the first face comprises ground planes, in that these ground planes are interposed between the conductors and in that the mini printed circuit includes connections between the ground planes of the first face and the ground plane of the second face.
Selon l'invention il est proposé un circuit imprimé d'accueil de boîtier hyperfréquence, pour la mise en oeuvre d'un procédé de montage d'un boîtier sur un circuit imprimé, ce circuit imprimé d'accueil comportant une première et une seconde face, la première face comportant, dans une zone d'accueil, des conducteurs et la seconde face étant constituée par un plan de masse, caractérisé en ce que la première face comporte des plans de masse dans la zone d'accueil, en ce que ces plans de masse sont intercalés entre les conducteurs et en ce que le circuit imprimé d'accueil comporte des connexions entre les plans de masse de la première face et le plan de masse de la seconde face. According to the invention there is proposed a printed circuit for receiving a microwave housing, for implementing a method of mounting a housing on a printed circuit, this printed reception circuit comprising a first and a second face , the first face comprising, in a reception area, conductors and the second face being constituted by a ground plane, characterized in that the first face comprises ground planes in the reception zone, in that these ground planes are interposed between the conductors and in that the host printed circuit includes connections between the ground planes of the first face and the ground plane of the second face.
La présente invention sera mieux comprise et d'autres caractéristiques apparaîtront à l'aide de la description ci-après et des figures s'y rapportant qui représentent
- les figures 1 et 2, les vues de celle des faces de deux circuits imprimés qui porte, entre autres éléments, des conducteurs, la vue selon la figure 2 étant une vue partielle,
- la figure 3, une vue en coupe des circuits imprimés des figures 1 et 2, après qu'ils aient été réunis par soudure.The present invention will be better understood and other characteristics will appear from the following description and the figures relating thereto which represent
FIGS. 1 and 2, the views of that of the faces of two printed circuits which carries, among other elements, conductors, the view according to FIG. 2 being a partial view,
- Figure 3, a sectional view of the printed circuits of Figures 1 and 2, after they have been joined by soldering.
Sur les différentes figures les éléments correspondants sont désignés par les mêmes repères. In the various figures, the corresponding elements are designated by the same references.
Dans ce qui suit et dans les revendications quand il sera question d'un circuit imprimé dont un des deux côtés est entièrement métallisé et que ce côté sera soudé sur un support métallique, il sera considéré que le support métallique fait partie du circuit imprimé et en constitue le plan de masse. In what follows and in the claims when it is a question of a printed circuit of which one of the two sides is entirely metallized and that this side is soldered on a metallic support, it will be considered that the metallic support is part of the printed circuit and in constitutes the ground plan.
La figure i montre un boîtier hyperfréquence d'une puce électronique, P ; il est constitué par un mini circuit imprimé dont la figure 1 montre une face carrée, ABCD, avec des pistes conductrices L1 à L4, des plans de masse M1 à M4, intercalés entre les pistes, et la puce P associée à quatre éléments de découplage tels que E. La puce P est située sensiblement au milieu de la face ABCD ; des fils soudés à leurs extrémités assurent les liaisons entre les différents éléments de ce boîtier. Figure i shows a microwave package of an electronic chip, P; it consists of a mini printed circuit whose figure 1 shows a square face, ABCD, with conductive tracks L1 to L4, ground planes M1 to M4, inserted between the tracks, and the chip P associated with four decoupling elements such as E. The chip P is located substantially in the middle of the face ABCD; wires welded at their ends provide the connections between the various elements of this housing.
Les pistes L2, L4 sont connectés respectivement à deux accès hyperfréquence de la puce tandis que les pistes L1, L3 amènent des tensions de polarisation à la puce. Chacun des plans de masse M1 à M4 est percé de trous tels que Ha, Hb ; au total il y a quatorze trous répartis au voisinage de la périphérie du carré ABCD. Tracks L2, L4 are connected respectively to two microwave accesses of the chip while tracks L1, L3 bring bias voltages to the chip. Each of the ground planes M1 to M4 is pierced with holes such as Ha, Hb; in total there are fourteen holes distributed in the vicinity of the periphery of the square ABCD.
Le boîtier est représenté en coupe, dans un rectangle situé à la partie supérieure de la figure 3 ; le plan de coupe, de trace XX, est perpendiculaire au plan de la figure 1 et est parallèle aux pistes L2, L4 en leur milieu. La figure 3 comporte, de plus, un rectangle inférieur, accolé au rectangle du boîtier ; ce rectangle correspond à une vue en coupe d'un circuit imprimé sur lequel repose la face ABCD du boîtier ; le boîtier est dit monté en surface sur le circuit imprimé. The housing is shown in section, in a rectangle located at the upper part of Figure 3; the section plane, of track XX, is perpendicular to the plane of FIG. 1 and is parallel to the tracks L2, L4 in their middle. Figure 3 comprises, in addition, a lower rectangle, attached to the rectangle of the housing; this rectangle corresponds to a sectional view of a printed circuit on which the ABCD face of the housing rests; the housing is said to be surface mounted on the printed circuit.
Le mini circuit imprimé du boîtier comporte un substrat isolant 1 avec, d'un côté, la face représentée sur la figure i et, de l'autre côté, un plan de masse en trois couches successives : un dépôt métallique et de la soudure, 2, et un support mécanique en laiton, 3 ; pour la facilité du dessin le dépôt métallique sur le substrat 1 et la soudure entre ce dépôt et le support mécanique 3, ont été confondus sur le dessin de la figure 3. The mini printed circuit of the housing comprises an insulating substrate 1 with, on one side, the face shown in FIG. I and, on the other side, a ground plane in three successive layers: a metallic deposit and solder, 2, and a mechanical brass support, 3; for ease of drawing, the metal deposit on the substrate 1 and the weld between this deposit and the mechanical support 3 have been combined in the drawing in FIG. 3.
Le boîtier présente la particularité, par rapport à un boîtier classique où le support, 3, est une simple plaque en laiton à faces parallèles, de posséder un bossage ou tab 3b dans son support, du côté du substrat, au niveau d'un trou pratiqué dans le substrat pour souder la puce P sur le plan de masse. Habituellement, c'est-à-dire sans le bossage 3b, la puce P est soudée sur le plan de masse, directement sur le support 3 ; sa face opposée au plan de masse est à une distance donnée de la face du mini circuit imprimé qui porte les pistes L1 à L4. The housing has the particularity, compared to a conventional housing where the support, 3, is a simple brass plate with parallel faces, to have a boss or tab 3b in its support, on the side of the substrate, at the level of a hole used in the substrate to solder the P chip on the ground plane. Usually, that is to say without the boss 3b, the chip P is soldered on the ground plane, directly on the support 3; its face opposite to the ground plane is at a given distance from the face of the mini printed circuit which carries the tracks L1 to L4.
Quand, pour la protéger, de la résine est déposée sur la puce, il s'avère impossible de n'avoir que la fine couche de résine strictement nécessaire à la protection ; la résine, en modifiant alors fortement le milieu de propagation du côté des liaisons de la puce, perturbe le fonctionnement au delà de fréquences supérieures à 10 GHz. La présence du bossage 3b réduit fortement ladite distance donnée ; celle des faces du mini circuit imprimé qui porte les pistes L1 à L4 est alors utilisée comme niveau de référence pour la quantité de résine à déposer, ce qui permet de maîtriser l'épaisseur de résine sur la puce.When, to protect it, resin is deposited on the chip, it turns out to be impossible to have only the thin layer of resin strictly necessary for protection; the resin, while strongly modifying the propagation medium on the side of the links of the chip, disturbs the operation beyond frequencies above 10 GHz. The presence of the boss 3b greatly reduces said given distance; that of the faces of the mini printed circuit which carries the tracks L1 to L4 is then used as a reference level for the quantity of resin to be deposited, which makes it possible to control the thickness of resin on the chip.
La figure 3 montre, en pointillés, les trous Ha, Hb dont il a été question lors de la description de la figure 1 ; il s'agit, comme pour les douze autres trous percés dans les plans de masse M1 à M4, de trous à parois métallisées qui constituent des colonnes conductrices parallèles, entre le plan de masse 2, 3 et les plans de masse M1 à M4. FIG. 3 shows, in dotted lines, the holes Ha, Hb which have been mentioned during the description of FIG. 1; as for the other twelve holes drilled in the ground planes M1 to M4, these are holes with metallized walls which constitute parallel conductive columns, between the ground plane 2, 3 and the ground planes M1 to M4.
La figure 2 est une vue partielle d'un circuit imprimé d'accueil, dans sa partie dédiée au boîtier qui vient d'être décrit ci-avant à l'aide de la figure 1 et du rectangle de la partie supérieure de la figure 3. Le rectangle de la partie inférieure de la figure 3 correspond à une vue en coupe du circuit imprimé de la figure 2, dans un plan de coupe de trace
XX ; le plan de coupe est perpendiculaire au plan de la figure 2. Il est à noter que c'est volontairement que les traces de coupe portent la même référence sur les figures 1 et 2 ; c'est pour marquer le fait que, lorsque le boîtier est montée dans la position prédéterminée qu'il doit occuper sur le circuit imprimé, les deux plans de coupe sont confondus.Figure 2 is a partial view of a host printed circuit, in its part dedicated to the housing which has just been described above with the aid of Figure 1 and the rectangle of the upper part of Figure 3 The rectangle in the lower part of figure 3 corresponds to a sectional view of the printed circuit of figure 2, in a trace section plane
XX; the cutting plane is perpendicular to the plane of Figure 2. It should be noted that it is intentionally that the cutting traces bear the same reference in Figures 1 and 2; it is to mark the fact that, when the box is mounted in the predetermined position which it must occupy on the printed circuit, the two cutting planes are merged.
Le circuit imprimé, selon la figure 2 et selon la partie inférieure de la figure 3, comporte un substrat isolant 6 avec, d'un côté des pistes conductrices L1' à L4', et des plans de masse, MI' à M4', représentés sur la figure 2 et, de l'autre côté, un plan de masse en trois couches successives : un dépôt métallique et de la soudure, 7, et un support mécanique en laiton, 8 ; là aussi, pour la facilité du dessin, le dépôt métallique sur le substrat 6 et la soudure entre ce dépôt et le support mécanique 8, ont été confondus sur le dessin de la figure 3. The printed circuit, according to FIG. 2 and according to the lower part of FIG. 3, comprises an insulating substrate 6 with, on one side of the conductive tracks L1 'to L4', and ground planes, MI 'to M4', shown in Figure 2 and, on the other side, a ground plane in three successive layers: a metal deposit and solder, 7, and a mechanical support in brass, 8; here again, for ease of drawing, the metallic deposit on the substrate 6 and the weld between this deposit and the mechanical support 8, have been combined in the drawing of FIG. 3.
Les pistes L2', L4' sont des pistes hyperfréquence que le plan de coupe traverse longitudinalement en leur milieu et les pistes L1', L3' sont des pistes destinées à amener des tensions de polarisation. The tracks L2 ', L4' are microwave tracks which the section plane crosses longitudinally in their middle and the tracks L1 ', L3' are tracks intended to bring bias voltages.
Chacun des plans de masse Mi' à M4' est percé de trous tels que Ha', Hb'. Ces trous dont la paroi est métallisée assurent une liaison conductrice entre les plans de masse Ml' à M4' situés d'un côté du circuit imprimé et le plan de masse 7, 8 situé de l'autre côté du circuit imprimé. Each of the ground planes Mi 'to M4' is pierced with holes such as Ha ', Hb'. These holes, the wall of which is metallized, provide a conductive connection between the ground planes M1 'to M4' located on one side of the printed circuit and the ground plane 7, 8 located on the other side of the printed circuit.
Sur la figure 2 quatre points A', B', C', D' formant les sommets d'un carré, ont été repérés par des flèches ; ils correspondent aux positions exactes que doivent occuper respectivement les sommets
ABCD de la face du mini circuit imprimé représenté sur la figure 1, lors du montage du boîtier sur le circuit imprimé d'accueil ; c'est dans cette position du boîtier par rapport à son circuit imprimé d'accueil qu'est effectuée la coupe suivant la figure 3. Il est à remarquer, en comparant les figures i et 2, que les plans de masse et les orifices des trous métallisés situés dans le carré A'B'C'D' correspondent point pour point, dans une symétrie par rapport à un plan, aux plans de masse et aux orifices des trous métallisés situés dans le carré ABCD ; pour les pistes conductrices cette symétrie existe aussi mais vis-à-vis seulement d'une partie des pistes du carré ABCD car les pistes s'étendent moins loin à l'intérieure du carré A'B'C'D' qu'à l'intérieur du carré ABCD. Ainsi, quand les sommets ABCD du mini circuit imprimé sont respectivement au-dessus des points A'B'C'D', les pistes conductrices Li' a L4' et les plans de masse Ml' à M4' sont entièrement en regard des pistes et des plans de masse correspondants du boîtier ; de plus les quatorze trous métallisés du boîtier sont dans le prolongement des quatorze trous métallisés du circuit imprimé d'accueil.In Figure 2 four points A ', B', C ', D' forming the vertices of a square, have been identified by arrows; they correspond to the exact positions which the vertices must respectively occupy
ABCD of the face of the mini printed circuit shown in FIG. 1, during assembly of the box on the receiving printed circuit; it is in this position of the housing with respect to its receiving printed circuit that the cut is made according to FIG. 3. It should be noted, by comparing FIGS. metallized holes located in the square A'B'C'D 'correspond point for point, in a symmetry with respect to a plane, to the ground planes and to the orifices of the metallized holes located in the square ABCD; for the conductive tracks this symmetry also exists but vis-à-vis only a part of the tracks of the square ABCD because the tracks extend less inside the square A'B'C'D 'than at the inside the square ABCD. Thus, when the vertices ABCD of the mini printed circuit are respectively above the points A'B'C'D ', the conductive tracks Li' a L4 'and the ground planes Ml' to M4 'are entirely opposite the tracks and corresponding ground planes of the housing; in addition, the fourteen metallized holes in the housing are an extension of the fourteen metallized holes in the receiving printed circuit.
La connexion du boîtier sur son circuit d'accueil consiste, dans l'exemple décrit, à appliquer d'abord une fine couche de soudure sur les pistes et les plans de masse qui se trouvent en regard quand le carré
ABCD est au-dessus du carré A'B'C'D'; puis le boîtier est positionné sur le circuit d'accueil de telle manière que le carré ABCD soit exactement au-dessus du carré A'B'C'D' et que, par thermosoudure, les pistes en regard et les plans de masse en regard puissent être soudés. Sur la figure 3 I'apport de calorie assurant la thermosoudure a été symbolisé par une flèches Th ; quant à la couche de soudure qui relie les pistes L4 et L4' après thermosoudure, elle a été notée S sur la figure 3.The connection of the box to its receiving circuit consists, in the example described, of first applying a thin layer of solder on the tracks and the ground planes which are opposite when the square
ABCD is above the square A'B'C'D '; then the box is positioned on the reception circuit in such a way that the square ABCD is exactly above the square A'B'C'D 'and that, by heat sealing, the facing tracks and the facing ground planes can be welded. In Figure 3 the intake of calories ensuring heat sealing has been symbolized by an arrows Th; as for the solder layer which connects tracks L4 and L4 'after heat sealing, it has been denoted S in FIG. 3.
Ainsi monté sur le circuit imprimé d'accueil, le boîtier a sa puce qui est enfermée dans une sorte de cage, formant blindage, limitée vers le haut par le plan de masse 2, 3, vers le bas par le plan de masse 7, 8 et latéralement par les quatorze couples de trous métallisés du boîtier - par couple de trous métallisés il faut entendre les trous tels que
Ha et Ha' qui se trouvent dans le prolongement l'un de l'autre lors du montage du boîtier sur son circuit imprimé d'accueil, ainsi que l'épaisseur de soudure entre les trous tels que Ha et Ha'.Thus mounted on the receiving printed circuit, the box has its chip which is enclosed in a sort of cage, forming a shield, limited upwards by the ground plane 2, 3, downwards by the ground plane 7, 8 and laterally by the fourteen pairs of metallized holes in the housing - by pair of metallized holes is meant the holes such as
Ha and Ha 'which are in the extension of one another during the mounting of the box on its receiving printed circuit, as well as the thickness of solder between the holes such as Ha and Ha'.
Les figures 2 et 3 montrent que le circuit imprimé d'accueil est percé d'une cavité, K, de section ovale qui s'ouvre sous la puce P quand le boîtier est monté sur le circuit imprimé d'accueil. Les dimensions de cette cavité sont telles que, par rapport au même montage mais sans cavité, la distance de la puce P aux parois les plus proches du plan de masse 7, 8 est de l'ordre de cinq fois plus grande ; cette cavité a pour rôle d'éviter des perturbations dans le fonctionnement de la puce, dues au rayonnement à une trop grande proximité d'un plan métallique, en l'occurrence le plan de masse 7, 8. Figures 2 and 3 show that the receiving printed circuit is pierced with a cavity, K, of oval section which opens under the chip P when the housing is mounted on the receiving printed circuit. The dimensions of this cavity are such that, relative to the same assembly but without cavity, the distance from the chip P to the walls closest to the ground plane 7, 8 is of the order of five times greater; the role of this cavity is to avoid disturbances in the operation of the chip, due to radiation from too close a metallic plane, in this case the ground plane 7, 8.
La présente invention n'est pas limitée à l'exemple décrit, c'est ainsi, en particulier que la puce P peut être montée de façon classique, c'est-à-dire sur un plan de masse 2, 3 sans le bossage 3b ; la puce peut également ne pas être protégée par un dépôt de résine, étant donné que, après montage du boîtier sur son circuit imprimé d'accueil, la puce se trouve dans un espace quasiment clos dont l'étanchéité peut d'ailleurs être améliorée par un joint en un matériau isolant, par exemple une colle, disposé tout autour du boîtier, au niveau de la jonction boîtiercircuit imprimé d'accueil ; compte tenu des performances à atteindre, il est même possible, dans certains cas, de ne pas prévoir une cavité dans le circuit imprimé d'accueil, à l'aplomb de la puce. The present invention is not limited to the example described, thus, in particular that the chip P can be mounted in a conventional manner, that is to say on a ground plane 2, 3 without the boss 3b; the chip may also not be protected by a deposit of resin, since, after assembly of the housing on its receiving printed circuit, the chip is in an almost closed space whose sealing can moreover be improved by a seal made of an insulating material, for example an adhesive, placed all around the housing, at the junction of the housing printed circuit housing; taking into account the performance to be achieved, it is even possible, in certain cases, not to provide a cavity in the receiving printed circuit, directly above the chip.
De plus le boîtier peut être réalisé avec la puce placée sur le mini circuit imprimé selon un montage dit puce à bosse ou flip-chip dans la littérature anglo-saxonne ; mais ce montage où les plots de la puce sont directement en contact avec le mini circuit imprimé ne permet pas une bonne dissipation thermique car la puce n'est plus plaquée sur un plan de masse qui lui sert de radiateur. In addition, the box can be produced with the chip placed on the mini printed circuit according to a so-called humpback or flip-chip assembly in English literature; but this arrangement where the studs of the chip are directly in contact with the mini printed circuit does not allow good heat dissipation because the chip is no longer plated on a ground plane which serves as its radiator.
Une autre variante à l'exemple qui a été décrit pour, comme il a été dit, enfermer la puce dans une sorte de cage de Faraday, consiste à remplacer, dans le mini circuit, les trous métallisés par des métallisations effectuées sur la tranche du mini circuit imprimé, entre les bords extérieurs des plans de masse M1 à M4 et le plan de masse 2, 3. Another variant of the example which has been described for, as has been said, enclosing the chip in a sort of Faraday cage, consists in replacing, in the mini circuit, the metallized holes by metallizations carried out on the edge of the mini printed circuit, between the outer edges of the ground planes M1 to M4 and the ground plane 2, 3.
Claims (6)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9715008A FR2771889B1 (en) | 1997-11-28 | 1997-11-28 | SURFACE MOUNTING PROCESS OF A HYPERFREQUENCY BOX ON A PRINTED CIRCUIT AND BOX AND PRINTED CIRCUIT FOR IMPLEMENTING THE PROCESS |
FR9810016A FR2771890B1 (en) | 1997-11-28 | 1998-08-04 | METHOD FOR SURFACE MOUNTING OF A MICROWAVE PACKAGE ON A PRINTED CIRCUIT AND PACKAGE AND PRINTED CIRCUIT FOR IMPLEMENTING THE METHOD |
AU12468/99A AU1246899A (en) | 1997-11-28 | 1998-11-24 | Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
EP98955735A EP1036489B1 (en) | 1997-11-28 | 1998-11-24 | Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
CA002311800A CA2311800A1 (en) | 1997-11-28 | 1998-11-24 | Process for surface-mounting a microwave package on a printed circuit and package and printed circuit for the implementation of the process |
US09/554,595 US6560121B1 (en) | 1997-11-28 | 1998-11-24 | Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
DE69818703T DE69818703T2 (en) | 1997-11-28 | 1998-11-24 | METHOD FOR SURFACE MOUNTING OF A MICROWAVE HOUSING ON A PCB AND HOUSING AND PCB TO PERFORM THE METHOD |
PCT/FR1998/002515 WO1999029148A1 (en) | 1997-11-28 | 1998-11-24 | Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9715008A FR2771889B1 (en) | 1997-11-28 | 1997-11-28 | SURFACE MOUNTING PROCESS OF A HYPERFREQUENCY BOX ON A PRINTED CIRCUIT AND BOX AND PRINTED CIRCUIT FOR IMPLEMENTING THE PROCESS |
Publications (2)
Publication Number | Publication Date |
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FR2771889A1 true FR2771889A1 (en) | 1999-06-04 |
FR2771889B1 FR2771889B1 (en) | 2000-02-18 |
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FR9715008A Expired - Fee Related FR2771889B1 (en) | 1997-11-28 | 1997-11-28 | SURFACE MOUNTING PROCESS OF A HYPERFREQUENCY BOX ON A PRINTED CIRCUIT AND BOX AND PRINTED CIRCUIT FOR IMPLEMENTING THE PROCESS |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4543544A (en) * | 1984-01-04 | 1985-09-24 | Motorola, Inc. | LCC co-planar lead frame semiconductor IC package |
GB2286084A (en) * | 1994-01-28 | 1995-08-02 | Ibm | Electronic package with thermally conductive support |
EP0718905A1 (en) * | 1994-12-21 | 1996-06-26 | Industrial Technology Research Institute | Surface mountable microwave IC package |
WO1996027282A1 (en) * | 1995-03-02 | 1996-09-06 | Circuit Components Incorporated | A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
-
1997
- 1997-11-28 FR FR9715008A patent/FR2771889B1/en not_active Expired - Fee Related
Patent Citations (4)
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US4543544A (en) * | 1984-01-04 | 1985-09-24 | Motorola, Inc. | LCC co-planar lead frame semiconductor IC package |
GB2286084A (en) * | 1994-01-28 | 1995-08-02 | Ibm | Electronic package with thermally conductive support |
EP0718905A1 (en) * | 1994-12-21 | 1996-06-26 | Industrial Technology Research Institute | Surface mountable microwave IC package |
WO1996027282A1 (en) * | 1995-03-02 | 1996-09-06 | Circuit Components Incorporated | A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
Non-Patent Citations (1)
Title |
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F. SPEXARTH ET AL.: "Reliable GaAs microwave assembly using Silvar(TM) heat sink and carrier", INTERNATIONAL JOURNAL OF MICROCIRCUITS AND ELECTRONIC PACKAGING., vol. 18, no. 2, 1995, Reston, VA, US, pages 138 - 145, XP000522301 * |
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FR2771889B1 (en) | 2000-02-18 |
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