FR2769108B3 - Etiquette souple intelligente et procede de fabrication - Google Patents

Etiquette souple intelligente et procede de fabrication

Info

Publication number
FR2769108B3
FR2769108B3 FR9712444A FR9712444A FR2769108B3 FR 2769108 B3 FR2769108 B3 FR 2769108B3 FR 9712444 A FR9712444 A FR 9712444A FR 9712444 A FR9712444 A FR 9712444A FR 2769108 B3 FR2769108 B3 FR 2769108B3
Authority
FR
France
Prior art keywords
manufacturing
intelligent flexible
flexible label
label
intelligent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9712444A
Other languages
English (en)
Other versions
FR2769108A1 (fr
Inventor
Rene Paul Blanc
Isabelle Desoutter
Pierre Garnier
Philippe Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Priority to FR9712444A priority Critical patent/FR2769108B3/fr
Priority to FR9714582A priority patent/FR2769109B1/fr
Priority to PCT/FR1998/002051 priority patent/WO1999017252A1/fr
Priority to AT98946509T priority patent/ATE220468T1/de
Priority to CA002304844A priority patent/CA2304844A1/fr
Priority to ES98946509T priority patent/ES2180199T3/es
Priority to AU93533/98A priority patent/AU748452B2/en
Priority to CNB988116022A priority patent/CN1214345C/zh
Priority to DE69806515T priority patent/DE69806515T2/de
Priority to JP2000514242A priority patent/JP4692863B2/ja
Priority to EP98946509A priority patent/EP1060457B1/fr
Publication of FR2769108A1 publication Critical patent/FR2769108A1/fr
Application granted granted Critical
Publication of FR2769108B3 publication Critical patent/FR2769108B3/fr
Priority to US09/533,825 priority patent/US6437985B1/en
Priority to US10/161,781 priority patent/US20020148110A1/en
Anticipated expiration legal-status Critical
Priority to JP2009139678A priority patent/JP4618462B2/ja
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
FR9712444A 1997-09-26 1997-09-26 Etiquette souple intelligente et procede de fabrication Expired - Lifetime FR2769108B3 (fr)

Priority Applications (14)

Application Number Priority Date Filing Date Title
FR9712444A FR2769108B3 (fr) 1997-09-26 1997-09-26 Etiquette souple intelligente et procede de fabrication
FR9714582A FR2769109B1 (fr) 1997-09-26 1997-11-14 Dispositif electronique a puce jetable et procede de fabrication
JP2000514242A JP4692863B2 (ja) 1997-09-26 1998-09-23 使い捨てチップ電子装置及び製造方法
CA002304844A CA2304844A1 (fr) 1997-09-26 1998-09-23 Dispositif electronique a puce jetable et procede de fabrication
ES98946509T ES2180199T3 (es) 1997-09-26 1998-09-23 Dispositivo electronico con chip desechable y procedimiento de fabricacion.
AU93533/98A AU748452B2 (en) 1997-09-26 1998-09-23 Electronic device with disposable chip and method for making same
CNB988116022A CN1214345C (zh) 1997-09-26 1998-09-23 可任意使用的电子芯片装置和制造过程
DE69806515T DE69806515T2 (de) 1997-09-26 1998-09-23 Elektronische vorrichtung mit wegwerfchip und verfahren zu deren herstellung
PCT/FR1998/002051 WO1999017252A1 (fr) 1997-09-26 1998-09-23 Dispositif electronique a puce jetable et procede de fabrication
EP98946509A EP1060457B1 (fr) 1997-09-26 1998-09-23 Dispositif electronique a puce jetable et procede de fabrication
AT98946509T ATE220468T1 (de) 1997-09-26 1998-09-23 Elektronische vorrichtung mit wegwerfchip und verfahren zu deren herstellung
US09/533,825 US6437985B1 (en) 1997-09-26 2000-03-24 Disposable electronic chip device and process of manufacture
US10/161,781 US20020148110A1 (en) 1997-09-26 2002-06-05 Disposable electronic chip device and process of manufacture
JP2009139678A JP4618462B2 (ja) 1997-09-26 2009-06-10 使い捨てチップ電子装置及び製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9712444A FR2769108B3 (fr) 1997-09-26 1997-09-26 Etiquette souple intelligente et procede de fabrication

Publications (2)

Publication Number Publication Date
FR2769108A1 FR2769108A1 (fr) 1999-04-02
FR2769108B3 true FR2769108B3 (fr) 1999-11-12

Family

ID=9511882

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9712444A Expired - Lifetime FR2769108B3 (fr) 1997-09-26 1997-09-26 Etiquette souple intelligente et procede de fabrication

Country Status (1)

Country Link
FR (1) FR2769108B3 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
FR2802000B1 (fr) * 1999-12-01 2002-03-22 Gemplus Card Int Procede de realisation d'un circuit oscillant accorde et fabrication de dispositifs de radiocommunications de faibles dimensions comprenant un tel circuit
JP2002279384A (ja) * 2001-03-19 2002-09-27 Toshiba Corp 携帯可能電子媒体及びその製造方法
US20040238210A1 (en) * 2001-10-09 2004-12-02 Francois Droz Electronic module with protective bump

Also Published As

Publication number Publication date
FR2769108A1 (fr) 1999-04-02

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TP Transmission of property