FR2758654B1 - Procede de realisation d'un detecteur de rayonnement a ecran plat et detecteur obtenu par ce procede - Google Patents

Procede de realisation d'un detecteur de rayonnement a ecran plat et detecteur obtenu par ce procede

Info

Publication number
FR2758654B1
FR2758654B1 FR9700592A FR9700592A FR2758654B1 FR 2758654 B1 FR2758654 B1 FR 2758654B1 FR 9700592 A FR9700592 A FR 9700592A FR 9700592 A FR9700592 A FR 9700592A FR 2758654 B1 FR2758654 B1 FR 2758654B1
Authority
FR
France
Prior art keywords
detector
making
flat screen
screen radiation
radiation detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9700592A
Other languages
English (en)
Other versions
FR2758654A1 (fr
Inventor
Jean Michailos
Jean Paul Guilloud
Jean Pierre Moy
Vincent Spinnler
Gerard Vieux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Electron Devices SA
Original Assignee
Thomson Tubes Electroniques
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson Tubes Electroniques filed Critical Thomson Tubes Electroniques
Priority to FR9700592A priority Critical patent/FR2758654B1/fr
Publication of FR2758654A1 publication Critical patent/FR2758654A1/fr
Application granted granted Critical
Publication of FR2758654B1 publication Critical patent/FR2758654B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14665—Imagers using a photoconductor layer
    • H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3026—Video wall, i.e. stackable semiconductor matrix display modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/41—Extracting pixel data from a plurality of image sensors simultaneously picking up an image, e.g. for increasing the field of view by combining the outputs of a plurality of sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR9700592A 1997-01-21 1997-01-21 Procede de realisation d'un detecteur de rayonnement a ecran plat et detecteur obtenu par ce procede Expired - Fee Related FR2758654B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9700592A FR2758654B1 (fr) 1997-01-21 1997-01-21 Procede de realisation d'un detecteur de rayonnement a ecran plat et detecteur obtenu par ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9700592A FR2758654B1 (fr) 1997-01-21 1997-01-21 Procede de realisation d'un detecteur de rayonnement a ecran plat et detecteur obtenu par ce procede

Publications (2)

Publication Number Publication Date
FR2758654A1 FR2758654A1 (fr) 1998-07-24
FR2758654B1 true FR2758654B1 (fr) 1999-04-09

Family

ID=9502820

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9700592A Expired - Fee Related FR2758654B1 (fr) 1997-01-21 1997-01-21 Procede de realisation d'un detecteur de rayonnement a ecran plat et detecteur obtenu par ce procede

Country Status (1)

Country Link
FR (1) FR2758654B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10107920B2 (en) 2014-12-10 2018-10-23 Siemens Aktiengesellschaft Sensor board for a detector module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2782388B1 (fr) * 1998-08-11 2000-11-03 Trixell Sas Detecteur de rayonnement a l'etat solide a duree de vie accrue
JP2000131444A (ja) * 1998-10-28 2000-05-12 Canon Inc 放射線検出装置、放射線検出システム、及び放射線検出装置の製造方法
US6455855B1 (en) 2000-04-20 2002-09-24 Ge Medical Systems Global Technology Company Llc Sealed detector for a medical imaging device and a method of manufacturing the same
FR2848677B1 (fr) * 2002-12-17 2005-04-15 Trixell Sas Detecteur de rayonnement x a l'etat solide
FR2916575B1 (fr) * 2007-05-23 2009-09-18 Trixell Sas Soc Par Actions Si Procede de realisation d'un detecteur de rayonnement

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2471610A1 (fr) * 1979-12-14 1981-06-19 Thomson Csf Module de scintillateurs pour la detection de rayons x ou gamma, son procede de realisation, et dispositif detecteur incorporant de tels modules
US5153438A (en) * 1990-10-01 1992-10-06 General Electric Company Method of forming an x-ray imaging array and the array
US5132539A (en) * 1991-08-29 1992-07-21 General Electric Company Planar X-ray imager having a moisture-resistant sealing structure
US5381014B1 (en) * 1993-12-29 1997-06-10 Du Pont Large area x-ray imager and method of fabrication

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10107920B2 (en) 2014-12-10 2018-10-23 Siemens Aktiengesellschaft Sensor board for a detector module
CN105700006B (zh) * 2014-12-10 2019-06-14 西门子股份公司 用于检测器模块的传感器板

Also Published As

Publication number Publication date
FR2758654A1 (fr) 1998-07-24

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Effective date: 20140930