FR2749794B1 - DEVICE FOR DIVIDING A PLATE OF SEMICONDUCTOR MATERIAL - Google Patents

DEVICE FOR DIVIDING A PLATE OF SEMICONDUCTOR MATERIAL

Info

Publication number
FR2749794B1
FR2749794B1 FR9607473A FR9607473A FR2749794B1 FR 2749794 B1 FR2749794 B1 FR 2749794B1 FR 9607473 A FR9607473 A FR 9607473A FR 9607473 A FR9607473 A FR 9607473A FR 2749794 B1 FR2749794 B1 FR 2749794B1
Authority
FR
France
Prior art keywords
dividing
plate
semiconductor material
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9607473A
Other languages
French (fr)
Other versions
FR2749794A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR9607473A priority Critical patent/FR2749794B1/en
Publication of FR2749794A1 publication Critical patent/FR2749794A1/en
Application granted granted Critical
Publication of FR2749794B1 publication Critical patent/FR2749794B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • H01S5/0202—Cleaving

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Sampling And Sample Adjustment (AREA)
FR9607473A 1996-06-13 1996-06-13 DEVICE FOR DIVIDING A PLATE OF SEMICONDUCTOR MATERIAL Expired - Fee Related FR2749794B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9607473A FR2749794B1 (en) 1996-06-13 1996-06-13 DEVICE FOR DIVIDING A PLATE OF SEMICONDUCTOR MATERIAL

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9607473A FR2749794B1 (en) 1996-06-13 1996-06-13 DEVICE FOR DIVIDING A PLATE OF SEMICONDUCTOR MATERIAL

Publications (2)

Publication Number Publication Date
FR2749794A1 FR2749794A1 (en) 1997-12-19
FR2749794B1 true FR2749794B1 (en) 1998-07-31

Family

ID=9493100

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9607473A Expired - Fee Related FR2749794B1 (en) 1996-06-13 1996-06-13 DEVICE FOR DIVIDING A PLATE OF SEMICONDUCTOR MATERIAL

Country Status (1)

Country Link
FR (1) FR2749794B1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL124199A (en) * 1998-04-23 2001-03-19 Sela Semiconductor Enginering Apparatus for cleaving crystals
EP0975008A1 (en) * 1998-07-20 2000-01-26 Alphasem AG Method and device for treating a flat workpiece, in particular a semiconductor wafer
JP2008544516A (en) * 2005-06-16 2008-12-04 エヌエックスピー ビー ヴィ Means for stretching foil of foil carrier, mechanism for peeling die piece from wafer, and die piece peeling method
DE102006015142B4 (en) * 2006-03-31 2014-02-20 Asys Automatisierungssysteme Gmbh Device for breaking semiconductor wafers
DE102006015141A1 (en) * 2006-03-31 2007-10-04 Dyntest Technologies Gmbh Semiconductor wafer breaking device for e.g. integrated circuit chip, has wedge arranged at lower side of wafer premarked in starting area of break line, and arranged opposite to wafer plane such that pressure is exerted at wedge sides
CN113927766B (en) * 2021-11-01 2024-05-14 青岛高测科技股份有限公司 Silicon rod cutting control method of silicon rod cutting system and silicon rod cutting system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650530A (en) * 1979-10-01 1981-05-07 Hitachi Ltd Method for removing adhesive component parts from adhesive sheet
JPS6282008A (en) * 1985-10-04 1987-04-15 三菱電機株式会社 Breaking device for semiconductor wafer
EP0363548B1 (en) * 1988-10-10 1994-03-23 International Business Machines Corporation Method of breaking a plate-like workpiece such as a semi-conductor wafer, and device for breaking said workpiece sandwiched between two foils
JPH0353546A (en) * 1989-07-21 1991-03-07 Mitsubishi Electric Corp Method and apparatus for manufacturing semiconductor device
DE4029973A1 (en) * 1990-09-21 1992-03-26 Siemens Ag Sawn or scored wafer breaking device - for sepg. individual chips, esp. led chips
JPH05226467A (en) * 1992-01-28 1993-09-03 Nec Corp Chip dividing method of semiconductor wafer

Also Published As

Publication number Publication date
FR2749794A1 (en) 1997-12-19

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Legal Events

Date Code Title Description
ST Notification of lapse