FR2729253B1 - - Google Patents
Info
- Publication number
- FR2729253B1 FR2729253B1 FR9500264A FR9500264A FR2729253B1 FR 2729253 B1 FR2729253 B1 FR 2729253B1 FR 9500264 A FR9500264 A FR 9500264A FR 9500264 A FR9500264 A FR 9500264A FR 2729253 B1 FR2729253 B1 FR 2729253B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9500264A FR2729253A1 (fr) | 1995-01-11 | 1995-01-11 | Module capteur a boitier et procede de fabrication d'un tel module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9500264A FR2729253A1 (fr) | 1995-01-11 | 1995-01-11 | Module capteur a boitier et procede de fabrication d'un tel module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2729253A1 FR2729253A1 (fr) | 1996-07-12 |
| FR2729253B1 true FR2729253B1 (https=) | 1997-03-07 |
Family
ID=9475036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9500264A Granted FR2729253A1 (fr) | 1995-01-11 | 1995-01-11 | Module capteur a boitier et procede de fabrication d'un tel module |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2729253A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19745311C1 (de) * | 1997-10-14 | 1999-07-01 | Telefunken Microelectron | Piezoelektrischer Biegesensor-Beschleunigungsaufnehmer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0623780B2 (ja) * | 1989-09-21 | 1994-03-30 | 日本電装株式会社 | 半導体加速度センサの製造方法 |
| FR2694403B1 (fr) * | 1992-07-31 | 1994-10-07 | Sagem | Accéléromètre pendulaire électrostatique à électrode de test et procédé de fabrication d'un tel accéléromètre. |
| DE9314084U1 (de) * | 1993-09-17 | 1994-01-05 | Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen | Anordnung zum Befestigen eines mikromechanischen Sensors auf einem Träger durch Kleben |
| FR2710810B1 (fr) * | 1993-09-29 | 1995-12-01 | Sagem | Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier. |
-
1995
- 1995-01-11 FR FR9500264A patent/FR2729253A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2729253A1 (fr) | 1996-07-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |