FR2729253B1 - - Google Patents

Info

Publication number
FR2729253B1
FR2729253B1 FR9500264A FR9500264A FR2729253B1 FR 2729253 B1 FR2729253 B1 FR 2729253B1 FR 9500264 A FR9500264 A FR 9500264A FR 9500264 A FR9500264 A FR 9500264A FR 2729253 B1 FR2729253 B1 FR 2729253B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9500264A
Other languages
French (fr)
Other versions
FR2729253A1 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to FR9500264A priority Critical patent/FR2729253A1/fr
Publication of FR2729253A1 publication Critical patent/FR2729253A1/fr
Application granted granted Critical
Publication of FR2729253B1 publication Critical patent/FR2729253B1/fr
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
FR9500264A 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module Granted FR2729253A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9500264A FR2729253A1 (fr) 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9500264A FR2729253A1 (fr) 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module

Publications (2)

Publication Number Publication Date
FR2729253A1 FR2729253A1 (fr) 1996-07-12
FR2729253B1 true FR2729253B1 (en:Method) 1997-03-07

Family

ID=9475036

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9500264A Granted FR2729253A1 (fr) 1995-01-11 1995-01-11 Module capteur a boitier et procede de fabrication d'un tel module

Country Status (1)

Country Link
FR (1) FR2729253A1 (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19745311C1 (de) * 1997-10-14 1999-07-01 Telefunken Microelectron Piezoelektrischer Biegesensor-Beschleunigungsaufnehmer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623780B2 (ja) * 1989-09-21 1994-03-30 日本電装株式会社 半導体加速度センサの製造方法
FR2694403B1 (fr) * 1992-07-31 1994-10-07 Sagem Accéléromètre pendulaire électrostatique à électrode de test et procédé de fabrication d'un tel accéléromètre.
DE9314084U1 (de) * 1993-09-17 1994-01-05 Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen Anordnung zum Befestigen eines mikromechanischen Sensors auf einem Träger durch Kleben
FR2710810B1 (fr) * 1993-09-29 1995-12-01 Sagem Boîtier étanche de micro-composant et procédé d'encapsulation dans un tel boîtier.

Also Published As

Publication number Publication date
FR2729253A1 (fr) 1996-07-12

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Legal Events

Date Code Title Description
ST Notification of lapse