FR2727780B1 - Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques - Google Patents

Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques

Info

Publication number
FR2727780B1
FR2727780B1 FR9414463A FR9414463A FR2727780B1 FR 2727780 B1 FR2727780 B1 FR 2727780B1 FR 9414463 A FR9414463 A FR 9414463A FR 9414463 A FR9414463 A FR 9414463A FR 2727780 B1 FR2727780 B1 FR 2727780B1
Authority
FR
France
Prior art keywords
plant
strip
surface treatment
plastic material
material bearing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9414463A
Other languages
English (en)
Other versions
FR2727780A1 (fr
Inventor
Denis Vere
Benoit Thevenot
Michel Gouiller
Michel Gaumet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Priority to FR9414463A priority Critical patent/FR2727780B1/fr
Priority to PCT/FR1996/000062 priority patent/WO1997026109A1/fr
Publication of FR2727780A1 publication Critical patent/FR2727780A1/fr
Application granted granted Critical
Publication of FR2727780B1 publication Critical patent/FR2727780B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Laser Beam Processing (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
FR9414463A 1994-12-01 1994-12-01 Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques Expired - Fee Related FR2727780B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9414463A FR2727780B1 (fr) 1994-12-01 1994-12-01 Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques
PCT/FR1996/000062 WO1997026109A1 (fr) 1994-12-01 1996-01-15 Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9414463A FR2727780B1 (fr) 1994-12-01 1994-12-01 Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques
PCT/FR1996/000062 WO1997026109A1 (fr) 1994-12-01 1996-01-15 Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques

Publications (2)

Publication Number Publication Date
FR2727780A1 FR2727780A1 (fr) 1996-06-07
FR2727780B1 true FR2727780B1 (fr) 1997-01-10

Family

ID=26231580

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9414463A Expired - Fee Related FR2727780B1 (fr) 1994-12-01 1994-12-01 Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques

Country Status (2)

Country Link
FR (1) FR2727780B1 (fr)
WO (1) WO1997026109A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104438230A (zh) * 2014-11-17 2015-03-25 成都莱普科技有限公司 工业制品激光清洗系统及其控制方法
US10737303B2 (en) 2017-06-23 2020-08-11 Lockheed Martin Corporation Nutplate preparation laser system
CN107695040B (zh) * 2017-10-20 2021-01-15 大族激光科技产业集团股份有限公司 激光清洗系统及方法
US11097376B2 (en) * 2018-04-03 2021-08-24 Main-Type Trading Co., Ltd. Apparatus for treating a surface of a base material and a method for treating a surface of a base material
CN111151515B (zh) * 2020-01-10 2021-08-31 广东利元亨智能装备股份有限公司 激光清洗方法及装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2060455A (en) * 1979-10-20 1981-05-07 Metal Box Co Ltd Preparing thin metal sheet for welding
JPS6332957A (ja) * 1986-07-25 1988-02-12 Matsushita Electronics Corp 半導体装置の製造方法
FR2638993B1 (fr) * 1988-11-17 1991-02-01 Carnaud Sa Dispositif de decapage de deux bords de tole metallique a souder
FR2645680B1 (fr) * 1989-04-07 1994-04-29 Thomson Microelectronics Sa Sg Encapsulation de modules electroniques et procede de fabrication
FR2657803A1 (fr) * 1990-02-02 1991-08-09 Bertin & Cie Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres.
FR2692822B1 (fr) * 1992-06-25 1997-08-29 Bm Ind Source laser pour l'eradication photonique a ondes multiples.
FR2703618B1 (fr) * 1993-04-08 1995-06-09 France Etat Armement Dispositif de décapage au laser.

Also Published As

Publication number Publication date
FR2727780A1 (fr) 1996-06-07
WO1997026109A1 (fr) 1997-07-24

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Legal Events

Date Code Title Description
ST Notification of lapse