FR2726124B1 - - Google Patents
Info
- Publication number
- FR2726124B1 FR2726124B1 FR9412591A FR9412591A FR2726124B1 FR 2726124 B1 FR2726124 B1 FR 2726124B1 FR 9412591 A FR9412591 A FR 9412591A FR 9412591 A FR9412591 A FR 9412591A FR 2726124 B1 FR2726124 B1 FR 2726124B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F42—AMMUNITION; BLASTING
- F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
- F42B3/00—Blasting cartridges, i.e. case and explosive
- F42B3/10—Initiators therefor
- F42B3/12—Bridge initiators
- F42B3/13—Bridge initiators with semiconductive bridge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Air Bags (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9412591A FR2726124A1 (fr) | 1994-10-21 | 1994-10-21 | Boitier pour dispositif a semiconducteur |
| PCT/EP1995/004121 WO1996012926A1 (en) | 1994-10-21 | 1995-10-20 | Semiconductor device packages |
| EP95937808A EP0756693A1 (en) | 1994-10-21 | 1995-10-20 | Semiconductor device packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9412591A FR2726124A1 (fr) | 1994-10-21 | 1994-10-21 | Boitier pour dispositif a semiconducteur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2726124A1 FR2726124A1 (fr) | 1996-04-26 |
| FR2726124B1 true FR2726124B1 (fi) | 1997-02-21 |
Family
ID=9468080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9412591A Granted FR2726124A1 (fr) | 1994-10-21 | 1994-10-21 | Boitier pour dispositif a semiconducteur |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0756693A1 (fi) |
| FR (1) | FR2726124A1 (fi) |
| WO (1) | WO1996012926A1 (fi) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999002937A1 (de) * | 1997-07-09 | 1999-01-21 | Siemens Aktiengesellschaft | Anzünder |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3117179A (en) * | 1959-07-24 | 1964-01-07 | Clevite Corp | Transistor capsule and header therefor |
| GB960186A (en) * | 1961-10-19 | 1964-06-10 | Bendix Corp | Electrically triggered squib |
| US3292537A (en) * | 1965-06-15 | 1966-12-20 | Jr Frank A Goss | Multi-signal explosive detonator |
| DE3537820A1 (de) * | 1985-10-24 | 1987-04-30 | Dynamit Nobel Ag | Elektronischer zuender |
| JP2704752B2 (ja) * | 1989-03-28 | 1998-01-26 | 本田技研工業株式会社 | 乗員保護装置の着火回路 |
| US5029529A (en) * | 1989-09-25 | 1991-07-09 | Olin Corporation | Semiconductor bridge (SCB) packaging system |
| JP3484517B2 (ja) * | 1993-02-26 | 2004-01-06 | エヌ・ケイ・エヌ・エム・リミテッド | 改良された半導体ブリッジ起爆装置 |
| FR2720493B1 (fr) * | 1994-05-31 | 1996-07-19 | Giat Ind Sa | Initiateur pyrotechnique. |
-
1994
- 1994-10-21 FR FR9412591A patent/FR2726124A1/fr active Granted
-
1995
- 1995-10-20 EP EP95937808A patent/EP0756693A1/en not_active Withdrawn
- 1995-10-20 WO PCT/EP1995/004121 patent/WO1996012926A1/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0756693A1 (en) | 1997-02-05 |
| FR2726124A1 (fr) | 1996-04-26 |
| WO1996012926A1 (en) | 1996-05-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |