FR2726124B1 - - Google Patents

Info

Publication number
FR2726124B1
FR2726124B1 FR9412591A FR9412591A FR2726124B1 FR 2726124 B1 FR2726124 B1 FR 2726124B1 FR 9412591 A FR9412591 A FR 9412591A FR 9412591 A FR9412591 A FR 9412591A FR 2726124 B1 FR2726124 B1 FR 2726124B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9412591A
Other languages
French (fr)
Other versions
FR2726124A1 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to FR9412591A priority Critical patent/FR2726124A1/fr
Priority to EP95937808A priority patent/EP0756693A1/en
Priority to PCT/EP1995/004121 priority patent/WO1996012926A1/en
Publication of FR2726124A1 publication Critical patent/FR2726124A1/fr
Application granted granted Critical
Publication of FR2726124B1 publication Critical patent/FR2726124B1/fr
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B3/00—Blasting cartridges, i.e. case and explosive
    • F42B3/10—Initiators therefor
    • F42B3/12—Bridge initiators
    • F42B3/13—Bridge initiators with semiconductive bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Air Bags (AREA)
FR9412591A 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur Granted FR2726124A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR9412591A FR2726124A1 (fr) 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur
EP95937808A EP0756693A1 (en) 1994-10-21 1995-10-20 Semiconductor device packages
PCT/EP1995/004121 WO1996012926A1 (en) 1994-10-21 1995-10-20 Semiconductor device packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9412591A FR2726124A1 (fr) 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur

Publications (2)

Publication Number Publication Date
FR2726124A1 FR2726124A1 (fr) 1996-04-26
FR2726124B1 true FR2726124B1 (enrdf_load_stackoverflow) 1997-02-21

Family

ID=9468080

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9412591A Granted FR2726124A1 (fr) 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur

Country Status (3)

Country Link
EP (1) EP0756693A1 (enrdf_load_stackoverflow)
FR (1) FR2726124A1 (enrdf_load_stackoverflow)
WO (1) WO1996012926A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999002937A1 (de) * 1997-07-09 1999-01-21 Siemens Aktiengesellschaft Anzünder

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3117179A (en) * 1959-07-24 1964-01-07 Clevite Corp Transistor capsule and header therefor
GB960186A (en) * 1961-10-19 1964-06-10 Bendix Corp Electrically triggered squib
US3292537A (en) * 1965-06-15 1966-12-20 Jr Frank A Goss Multi-signal explosive detonator
DE3537820A1 (de) * 1985-10-24 1987-04-30 Dynamit Nobel Ag Elektronischer zuender
JP2704752B2 (ja) * 1989-03-28 1998-01-26 本田技研工業株式会社 乗員保護装置の着火回路
US5029529A (en) * 1989-09-25 1991-07-09 Olin Corporation Semiconductor bridge (SCB) packaging system
DE69422026T2 (de) * 1993-02-26 2000-05-25 Quantic Industries, Inc. Verbesserter halbleiter-brückenzünder
FR2720493B1 (fr) * 1994-05-31 1996-07-19 Giat Ind Sa Initiateur pyrotechnique.

Also Published As

Publication number Publication date
FR2726124A1 (fr) 1996-04-26
EP0756693A1 (en) 1997-02-05
WO1996012926A1 (en) 1996-05-02

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Legal Events

Date Code Title Description
ST Notification of lapse