FR2724063B3 - Composite a film flexible pour interconnexions electriques - Google Patents

Composite a film flexible pour interconnexions electriques

Info

Publication number
FR2724063B3
FR2724063B3 FR9510229A FR9510229A FR2724063B3 FR 2724063 B3 FR2724063 B3 FR 2724063B3 FR 9510229 A FR9510229 A FR 9510229A FR 9510229 A FR9510229 A FR 9510229A FR 2724063 B3 FR2724063 B3 FR 2724063B3
Authority
FR
France
Prior art keywords
flexible film
film composite
electrical interconnections
interconnections
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9510229A
Other languages
English (en)
Other versions
FR2724063A1 (fr
Inventor
Dimitry G Grabbe
George Robert Schmedding
David Burr Wrisley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of FR2724063A1 publication Critical patent/FR2724063A1/fr
Application granted granted Critical
Publication of FR2724063B3 publication Critical patent/FR2724063B3/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0271Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/365Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/093Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/0455PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377Protective layers
    • H05K2203/1394Covering open PTHs, e.g. by dry film resist or by metal disc

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
FR9510229A 1994-08-31 1995-08-30 Composite a film flexible pour interconnexions electriques Expired - Fee Related FR2724063B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/299,221 US5575661A (en) 1994-08-31 1994-08-31 Flexible film with circuitry thereon having improved local compliance and force distribution

Publications (2)

Publication Number Publication Date
FR2724063A1 FR2724063A1 (fr) 1996-03-01
FR2724063B3 true FR2724063B3 (fr) 1996-11-15

Family

ID=23153846

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9510229A Expired - Fee Related FR2724063B3 (fr) 1994-08-31 1995-08-30 Composite a film flexible pour interconnexions electriques

Country Status (2)

Country Link
US (1) US5575661A (fr)
FR (1) FR2724063B3 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6796822B2 (en) * 2002-07-02 2004-09-28 Fujitsu Component Limited Contact module and connector having the same
JP2004039406A (ja) * 2002-07-02 2004-02-05 Fujitsu Component Ltd コネクタ
US20090039728A1 (en) * 2004-04-29 2009-02-12 Balsells Peter J Contact assembly
US7112877B2 (en) * 2004-06-28 2006-09-26 General Electric Company High density package with wrap around interconnect
US8673783B2 (en) 2010-07-02 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Metal conductor chemical mechanical polish

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4969824A (en) * 1989-07-28 1990-11-13 Amp Incorporated Electrical connector
US5007842A (en) * 1990-10-11 1991-04-16 Amp Incorporated Flexible area array connector
US5171154A (en) * 1991-11-06 1992-12-15 Amp Incorporated High density backplane connector

Also Published As

Publication number Publication date
FR2724063A1 (fr) 1996-03-01
US5575661A (en) 1996-11-19

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Legal Events

Date Code Title Description
ST Notification of lapse
RN Application for restoration
FC Favourable decision of inpi director general on an application for restauration.