FR2673017B1 - - Google Patents
Info
- Publication number
- FR2673017B1 FR2673017B1 FR9101904A FR9101904A FR2673017B1 FR 2673017 B1 FR2673017 B1 FR 2673017B1 FR 9101904 A FR9101904 A FR 9101904A FR 9101904 A FR9101904 A FR 9101904A FR 2673017 B1 FR2673017 B1 FR 2673017B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9101904A FR2673017A1 (fr) | 1991-02-18 | 1991-02-18 | Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu. |
| EP92200373A EP0500168A1 (fr) | 1991-02-18 | 1992-02-08 | Procédé de fabrication d'un module électronique pour carte à mémoire et module électronique ainsi obtenu |
| US07/835,246 US5365655A (en) | 1991-02-18 | 1992-02-13 | Method of making an electronic module for a memory card and an electronic module thus obtained |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9101904A FR2673017A1 (fr) | 1991-02-18 | 1991-02-18 | Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2673017A1 FR2673017A1 (fr) | 1992-08-21 |
| FR2673017B1 true FR2673017B1 (US20090192370A1-20090730-C00001.png) | 1995-03-17 |
Family
ID=9409827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9101904A Granted FR2673017A1 (fr) | 1991-02-18 | 1991-02-18 | Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu. |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US5365655A (US20090192370A1-20090730-C00001.png) |
| EP (1) | EP0500168A1 (US20090192370A1-20090730-C00001.png) |
| FR (1) | FR2673017A1 (US20090192370A1-20090730-C00001.png) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2079964C (en) * | 1992-01-22 | 1997-12-16 | Mitsutoshi Kamakura | Apparatus and method for manufacturing optical module |
| DE4336501A1 (de) * | 1993-10-26 | 1995-04-27 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten mit elektronischen Modulen |
| DE4427309C2 (de) * | 1994-08-02 | 1999-12-02 | Ibm | Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten |
| FR2741191B1 (fr) * | 1995-11-14 | 1998-01-09 | Sgs Thomson Microelectronics | Procede de fabrication d'un micromodule, notamment pour cartes a puces |
| US5787569A (en) * | 1996-02-21 | 1998-08-04 | Lucent Technologies Inc. | Encapsulated package for power magnetic devices and method of manufacture therefor |
| US5956601A (en) * | 1996-04-25 | 1999-09-21 | Kabushiki Kaisha Toshiba | Method of mounting a plurality of semiconductor devices in corresponding supporters |
| JPH09327990A (ja) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | カード型記憶装置 |
| KR100216840B1 (ko) * | 1996-12-06 | 1999-09-01 | 김규현 | 반도체 패키지용 인쇄회로기판 스트립 |
| US5932865A (en) * | 1996-12-09 | 1999-08-03 | Drexler Technology Corporation | Anti-counterfeit validation method for electronic cash cards employing an optical memory stripe |
| US6199761B1 (en) | 1996-12-09 | 2001-03-13 | Drexler Technology Corporation | Validation method for electronic cash cards and digital identity cards utilizing optical data storage |
| US5888849A (en) * | 1997-04-07 | 1999-03-30 | International Business Machines Corporation | Method for fabricating an electronic package |
| DE19721281C2 (de) * | 1997-05-21 | 1999-04-01 | Ods Landis & Gyr Gmbh & Co Kg | Chipmodul für eine Chipkarte |
| US5766535A (en) * | 1997-06-04 | 1998-06-16 | Integrated Packaging Assembly Corporation | Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits |
| EP1111540A1 (de) * | 1999-12-23 | 2001-06-27 | Esec SA | Verfahren zur Herstellung eines Kunststoffobjektes, insbesondere einer Multimediakarte |
| US6589820B1 (en) | 2000-06-16 | 2003-07-08 | Micron Technology, Inc. | Method and apparatus for packaging a microelectronic die |
| US6483044B1 (en) | 2000-08-23 | 2002-11-19 | Micron Technology, Inc. | Interconnecting substrates for electrical coupling of microelectronic components |
| US6979595B1 (en) | 2000-08-24 | 2005-12-27 | Micron Technology, Inc. | Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices |
| US6838760B1 (en) | 2000-08-28 | 2005-01-04 | Micron Technology, Inc. | Packaged microelectronic devices with interconnecting units |
| US6732590B1 (en) * | 2002-11-20 | 2004-05-11 | Infineon Technologies Ag | Pressure sensor and process for producing the pressure sensor |
| KR100585163B1 (ko) * | 2004-11-27 | 2006-06-01 | 삼성전자주식회사 | 메모리 카드 및 그 제조방법 |
| US7225537B2 (en) * | 2005-01-27 | 2007-06-05 | Cardxx, Inc. | Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces |
| AU2005329469B2 (en) * | 2005-03-23 | 2012-02-16 | Cardxx, Inc. | Method for making Advanced Smart Cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces |
| DE602005013807D1 (de) * | 2005-12-30 | 2009-05-20 | Incard Sa | IC Karte mit verbesserter Leiterplatine |
| DE102006053922A1 (de) * | 2006-11-15 | 2008-05-29 | Infineon Technologies Ag | Modul mit Trägerelement |
| DE102006055576A1 (de) * | 2006-11-21 | 2008-05-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Herstellen eines dehnbaren Schaltungsträgers und dehnbarer Schaltungsträger |
| US7833456B2 (en) | 2007-02-23 | 2010-11-16 | Micron Technology, Inc. | Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece |
| WO2010056212A2 (en) * | 2008-11-17 | 2010-05-20 | Pyxis Systems Integration Pte Ltd | Method for encapsulating semiconductor dies |
| US8105063B1 (en) * | 2010-08-26 | 2012-01-31 | National Semiconductor Corporation | Three piece mold cavity design for packaging integrated circuits |
| US10182880B2 (en) | 2013-12-11 | 2019-01-22 | Caretag Surgical Aps | Attachment and cover for an electronic identification tag |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2439438A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux |
| DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
| DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
| US4641418A (en) * | 1982-08-30 | 1987-02-10 | International Rectifier Corporation | Molding process for semiconductor devices and lead frame structure therefor |
| US4996411A (en) * | 1986-07-24 | 1991-02-26 | Schlumberger Industries | Method of manufacturing a card having electronic memory and a card obtained by performing said method |
| JPH0783036B2 (ja) * | 1987-12-11 | 1995-09-06 | 三菱電機株式会社 | キヤリアテープ |
| US5030407A (en) * | 1988-04-28 | 1991-07-09 | Schlumberger Industries | Method of making cards having graphics elements thereon |
| US5018003A (en) * | 1988-10-20 | 1991-05-21 | Mitsubishi Denki Kabushiki Kaisha | Lead frame and semiconductor device |
| FR2659157B2 (fr) * | 1989-05-26 | 1994-09-30 | Lemaire Gerard | Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede. |
| US5139969A (en) * | 1990-05-30 | 1992-08-18 | Mitsubishi Denki Kabushiki Kaisha | Method of making resin molded semiconductor device |
| US5197183A (en) * | 1991-11-05 | 1993-03-30 | Lsi Logic Corporation | Modified lead frame for reducing wire wash in transfer molding of IC packages |
-
1991
- 1991-02-18 FR FR9101904A patent/FR2673017A1/fr active Granted
-
1992
- 1992-02-08 EP EP92200373A patent/EP0500168A1/fr not_active Ceased
- 1992-02-13 US US07/835,246 patent/US5365655A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0500168A1 (fr) | 1992-08-26 |
| FR2673017A1 (fr) | 1992-08-21 |
| US5365655A (en) | 1994-11-22 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CA | Change of address | ||
| CD | Change of name or company name | ||
| TP | Transmission of property | ||
| ST | Notification of lapse |
Effective date: 20091030 |