FR2666451B1 - - Google Patents
Info
- Publication number
- FR2666451B1 FR2666451B1 FR9010707A FR9010707A FR2666451B1 FR 2666451 B1 FR2666451 B1 FR 2666451B1 FR 9010707 A FR9010707 A FR 9010707A FR 9010707 A FR9010707 A FR 9010707A FR 2666451 B1 FR2666451 B1 FR 2666451B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W72/30—
-
- H10W72/071—
-
- H10W72/0711—
-
- H10W72/073—
-
- H10W72/07337—
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9010707A FR2666451A1 (fr) | 1990-08-28 | 1990-08-28 | Procede et dispositif pour le decollage selectif de plaquettes collees sur un substrat et leur application a la reparation de circuits hybrides. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9010707A FR2666451A1 (fr) | 1990-08-28 | 1990-08-28 | Procede et dispositif pour le decollage selectif de plaquettes collees sur un substrat et leur application a la reparation de circuits hybrides. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2666451A1 FR2666451A1 (fr) | 1992-03-06 |
| FR2666451B1 true FR2666451B1 (enExample) | 1997-02-07 |
Family
ID=9399884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9010707A Granted FR2666451A1 (fr) | 1990-08-28 | 1990-08-28 | Procede et dispositif pour le decollage selectif de plaquettes collees sur un substrat et leur application a la reparation de circuits hybrides. |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2666451A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110444487A (zh) * | 2019-06-28 | 2019-11-12 | 广东晶科电子股份有限公司 | 一种Mini LED模组的检修方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2707189B2 (ja) * | 1992-08-26 | 1998-01-28 | 株式会社日立製作所 | 電子部品の基板からの取外し方法及び装置 |
| KR0129119B1 (ko) * | 1992-11-27 | 1998-04-07 | 모리시다 요이찌 | 반도체칩의 제거방법 및 제거장치 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3735911A (en) * | 1971-04-30 | 1973-05-29 | Ibm | Integrated circuit chip repair tool |
| FR2458977A1 (fr) * | 1979-06-13 | 1981-01-02 | Cii Honeywell Bull | Dispositif de demontage non destructif d'un composant electronique modulaire soude par une pluralite de cosses de raccordement sur un substrat |
-
1990
- 1990-08-28 FR FR9010707A patent/FR2666451A1/fr active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110444487A (zh) * | 2019-06-28 | 2019-11-12 | 广东晶科电子股份有限公司 | 一种Mini LED模组的检修方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2666451A1 (fr) | 1992-03-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ER | Errata listed in the french official journal (bopi) |
Free format text: 10/92 |
|
| ST | Notification of lapse |