DE4190089T1 - - Google Patents
Info
- Publication number
- DE4190089T1 DE4190089T1 DE19914190089 DE4190089T DE4190089T1 DE 4190089 T1 DE4190089 T1 DE 4190089T1 DE 19914190089 DE19914190089 DE 19914190089 DE 4190089 T DE4190089 T DE 4190089T DE 4190089 T1 DE4190089 T1 DE 4190089T1
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/06—Planarisation of inorganic insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/092—Manufacture or treatment of dielectric parts thereof by smoothing the dielectric parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
- H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
- H10W20/48—Insulating materials thereof
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009163A JPH03212958A (ja) | 1990-01-18 | 1990-01-18 | 半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE4190089T1 true DE4190089T1 (enExample) | 1992-01-30 |
Family
ID=11712948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19914190089 Ceased DE4190089T1 (enExample) | 1990-01-18 | 1991-01-17 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPH03212958A (enExample) |
| DE (1) | DE4190089T1 (enExample) |
| WO (1) | WO1991011023A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2820187B2 (ja) * | 1992-04-16 | 1998-11-05 | 三星電子 株式会社 | 半導体装置の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6388829A (ja) * | 1986-10-01 | 1988-04-19 | Matsushita Electric Ind Co Ltd | 気相成長方法 |
| JPS63192239A (ja) * | 1987-02-05 | 1988-08-09 | Fujitsu Ltd | 半導体装置の製造方法 |
| JPS6476727A (en) * | 1987-09-17 | 1989-03-22 | Nec Corp | Manufacture of semiconductor device |
-
1990
- 1990-01-18 JP JP2009163A patent/JPH03212958A/ja active Pending
-
1991
- 1991-01-17 DE DE19914190089 patent/DE4190089T1/de not_active Ceased
- 1991-01-17 WO PCT/JP1991/000040 patent/WO1991011023A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03212958A (ja) | 1991-09-18 |
| WO1991011023A1 (fr) | 1991-07-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8131 | Rejection |