FR2657803A1 - Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres. - Google Patents

Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres. Download PDF

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Publication number
FR2657803A1
FR2657803A1 FR9001226A FR9001226A FR2657803A1 FR 2657803 A1 FR2657803 A1 FR 2657803A1 FR 9001226 A FR9001226 A FR 9001226A FR 9001226 A FR9001226 A FR 9001226A FR 2657803 A1 FR2657803 A1 FR 2657803A1
Authority
FR
France
Prior art keywords
laser
machine according
approximately
thin
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9001226A
Other languages
English (en)
French (fr)
Other versions
FR2657803B1 (https=
Inventor
Girard Jean-Jacques
Pelous Gerard
Tonneau Didier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bertin Technologies SAS
Original Assignee
Bertin et Cie SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bertin et Cie SA filed Critical Bertin et Cie SA
Priority to FR9001226A priority Critical patent/FR2657803A1/fr
Priority to PCT/FR1991/000061 priority patent/WO1991011288A1/fr
Publication of FR2657803A1 publication Critical patent/FR2657803A1/fr
Application granted granted Critical
Publication of FR2657803B1 publication Critical patent/FR2657803B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/092—Adapting interconnections, e.g. making engineering charges, repairing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
FR9001226A 1990-02-02 1990-02-02 Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres. Granted FR2657803A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR9001226A FR2657803A1 (fr) 1990-02-02 1990-02-02 Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres.
PCT/FR1991/000061 WO1991011288A1 (fr) 1990-02-02 1991-01-31 Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9001226A FR2657803A1 (fr) 1990-02-02 1990-02-02 Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres.

Publications (2)

Publication Number Publication Date
FR2657803A1 true FR2657803A1 (fr) 1991-08-09
FR2657803B1 FR2657803B1 (https=) 1994-11-25

Family

ID=9393337

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9001226A Granted FR2657803A1 (fr) 1990-02-02 1990-02-02 Machine a micro-faisceau laser d'intervention sur des objets a couches minces, tels que des circuits integres.

Country Status (2)

Country Link
FR (1) FR2657803A1 (https=)
WO (1) WO1991011288A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2727780B1 (fr) * 1994-12-01 1997-01-10 Solaic Sa Procede et installation pour traiter en surface une bande de matiere plastique portant des modules pour cartes electroniques

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2608484A1 (fr) * 1986-12-23 1988-06-24 Bertin & Cie Machine a microfaisceau laser d'intervention sur des objets a couches minces de materiau
WO1989012525A1 (en) * 1988-06-17 1989-12-28 N.V. Philips' Gloeilampenfabrieken Method of micro-working the surface of a workpiece while using a laser beam

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2608484A1 (fr) * 1986-12-23 1988-06-24 Bertin & Cie Machine a microfaisceau laser d'intervention sur des objets a couches minces de materiau
WO1989012525A1 (en) * 1988-06-17 1989-12-28 N.V. Philips' Gloeilampenfabrieken Method of micro-working the surface of a workpiece while using a laser beam

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
OPTICAL ENGINEERING vol. 17, no. 3, mai/juin 1978, pages 217-224; M. OAKES: "An Introduction to Thick Film Resistor Trimming by Laser" *
THIRD IEEE/CHMT INTERNATIONLA ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM 12-14 octobre 1987, pages 137-142, Disneyland Hotel, Anaheim, CA, US; D. OLSON et al.: "Manufacturing Technology - Competitive Advantage" *

Also Published As

Publication number Publication date
WO1991011288A1 (fr) 1991-08-08
FR2657803B1 (https=) 1994-11-25

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