FR2602798B1 - Procede de depot par pulverisation cathodique d'une couche de materiau sur des substrats et dispositif de mise en oeuvre d'un tel procede - Google Patents

Procede de depot par pulverisation cathodique d'une couche de materiau sur des substrats et dispositif de mise en oeuvre d'un tel procede

Info

Publication number
FR2602798B1
FR2602798B1 FR8611693A FR8611693A FR2602798B1 FR 2602798 B1 FR2602798 B1 FR 2602798B1 FR 8611693 A FR8611693 A FR 8611693A FR 8611693 A FR8611693 A FR 8611693A FR 2602798 B1 FR2602798 B1 FR 2602798B1
Authority
FR
France
Prior art keywords
substrates
deposition
carrying
material layer
cathode spraying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR8611693A
Other languages
English (en)
Other versions
FR2602798A1 (fr
Inventor
Regis Baron
Gerard Darnay
Gabriel Fayard
Richard Percevault
Yves Salort
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Thomson Faisceaux Hertziens SA
Original Assignee
Alcatel Thomson Faisceaux Hertziens SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Thomson Faisceaux Hertziens SA filed Critical Alcatel Thomson Faisceaux Hertziens SA
Priority to FR8611693A priority Critical patent/FR2602798B1/fr
Publication of FR2602798A1 publication Critical patent/FR2602798A1/fr
Application granted granted Critical
Publication of FR2602798B1 publication Critical patent/FR2602798B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
FR8611693A 1986-08-13 1986-08-13 Procede de depot par pulverisation cathodique d'une couche de materiau sur des substrats et dispositif de mise en oeuvre d'un tel procede Expired - Fee Related FR2602798B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8611693A FR2602798B1 (fr) 1986-08-13 1986-08-13 Procede de depot par pulverisation cathodique d'une couche de materiau sur des substrats et dispositif de mise en oeuvre d'un tel procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8611693A FR2602798B1 (fr) 1986-08-13 1986-08-13 Procede de depot par pulverisation cathodique d'une couche de materiau sur des substrats et dispositif de mise en oeuvre d'un tel procede

Publications (2)

Publication Number Publication Date
FR2602798A1 FR2602798A1 (fr) 1988-02-19
FR2602798B1 true FR2602798B1 (fr) 1992-10-23

Family

ID=9338273

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8611693A Expired - Fee Related FR2602798B1 (fr) 1986-08-13 1986-08-13 Procede de depot par pulverisation cathodique d'une couche de materiau sur des substrats et dispositif de mise en oeuvre d'un tel procede

Country Status (1)

Country Link
FR (1) FR2602798B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5240583A (en) * 1992-01-14 1993-08-31 Honeywell Inc. Apparatus to deposit multilayer films
SG47541A1 (en) 1992-06-26 1998-04-17 Materials Research Corp Transport system for wafer processing line
FR2701463B1 (fr) * 1993-02-15 1995-05-05 Alain Gentric Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement.
CN108998768B (zh) * 2018-08-29 2020-08-14 深圳市锦瑞新材料股份有限公司 一种基于pvd技术的表面镀膜装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3504433A (en) * 1964-11-24 1970-04-07 Gillette Co Suspension for a reciprocable blade of a shaver head
DE2053802A1 (en) * 1970-11-02 1972-05-10 Licentia Gmbh Uniform evaporated coatings prodn - esp metal layers for integrated semiconductor circuits etc
US4151059A (en) * 1977-12-27 1979-04-24 Coulter Stork U.S.A., Inc. Method and apparatus for sputtering multiple cylinders simultaneously
JPS5881970A (ja) * 1981-11-06 1983-05-17 Clarion Co Ltd スパツタ装置

Also Published As

Publication number Publication date
FR2602798A1 (fr) 1988-02-19

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Legal Events

Date Code Title Description
ST Notification of lapse