FR2590008B3 - Procede et appareil de fermeture de porte de four de traitement de dispositifs microelectroniques - Google Patents

Procede et appareil de fermeture de porte de four de traitement de dispositifs microelectroniques

Info

Publication number
FR2590008B3
FR2590008B3 FR8612335A FR8612335A FR2590008B3 FR 2590008 B3 FR2590008 B3 FR 2590008B3 FR 8612335 A FR8612335 A FR 8612335A FR 8612335 A FR8612335 A FR 8612335A FR 2590008 B3 FR2590008 B3 FR 2590008B3
Authority
FR
France
Prior art keywords
closing
oven door
microelectronic devices
processing microelectronic
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8612335A
Other languages
English (en)
Other versions
FR2590008A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YATES CLEON RAY
Original Assignee
YATES CLEON RAY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YATES CLEON RAY filed Critical YATES CLEON RAY
Publication of FR2590008A1 publication Critical patent/FR2590008A1/fr
Application granted granted Critical
Publication of FR2590008B3 publication Critical patent/FR2590008B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Sealing Or Ventilating Devices For Doors And Windows (AREA)
  • Pressure Vessels And Lids Thereof (AREA)
FR8612335A 1985-09-03 1986-09-02 Procede et appareil de fermeture de porte de four de traitement de dispositifs microelectroniques Expired FR2590008B3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/771,807 US4751895A (en) 1985-09-03 1985-09-03 Door closure apparatus for encapsulating a wafer paddle

Publications (2)

Publication Number Publication Date
FR2590008A1 FR2590008A1 (fr) 1987-05-15
FR2590008B3 true FR2590008B3 (fr) 1988-09-16

Family

ID=25093019

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8612335A Expired FR2590008B3 (fr) 1985-09-03 1986-09-02 Procede et appareil de fermeture de porte de four de traitement de dispositifs microelectroniques

Country Status (6)

Country Link
US (1) US4751895A (fr)
DE (1) DE3630014A1 (fr)
FR (1) FR2590008B3 (fr)
GB (1) GB2184175B (fr)
IT (1) IT1197441B (fr)
NL (1) NL8602218A (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909185A (en) * 1988-02-03 1990-03-20 Weiss Scientific Glass Blowing Co. Cantilever and cold zone assembly for loading and unloading an oven
US5105762A (en) * 1988-12-20 1992-04-21 Texas Instruments Incorporated Support and seal structure for CCVD reactor
DE8902607U1 (fr) * 1989-03-04 1989-06-22 Owis Gmbh, 7813 Staufen, De
US5050534A (en) * 1989-08-03 1991-09-24 Cryco Twenty-Two, Inc. Mobile injector system
US5225375A (en) * 1991-05-20 1993-07-06 Process Technology (1988) Limited Plasma enhanced chemical vapor processing of semiconductor substrates
JPH06163423A (ja) * 1992-11-18 1994-06-10 Fujitsu Ltd 半導体製造装置
DE19745185A1 (de) * 1997-10-13 1999-04-15 Leybold Ag Vorrichtung zum vakuumdichten Verbinden von zwei Körpern aus unterschiedlichen Materialien
CN103363808B (zh) * 2013-07-24 2015-07-01 江苏能华微电子科技发展有限公司 一种扩散炉的炉门密封装置
JP6366515B2 (ja) * 2015-01-23 2018-08-01 東京エレクトロン株式会社 連結構造及びこれを用いた磁気アニール装置、並びに連結方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4137865A (en) * 1976-12-30 1979-02-06 Bell Telephone Laboratories, Incorporated Molecular beam apparatus for processing a plurality of substrates
JPS5664441A (en) * 1979-10-30 1981-06-01 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device

Also Published As

Publication number Publication date
GB2184175B (en) 1988-08-03
NL8602218A (nl) 1987-04-01
DE3630014C2 (fr) 1990-10-31
US4751895A (en) 1988-06-21
IT1197441B (it) 1988-11-30
DE3630014A1 (de) 1987-03-12
IT8648414A0 (it) 1986-09-02
GB2184175A (en) 1987-06-17
FR2590008A1 (fr) 1987-05-15
GB8621158D0 (en) 1986-10-08

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