FR2549292B1 - DIODE MOUNTING PROCESS - Google Patents

DIODE MOUNTING PROCESS

Info

Publication number
FR2549292B1
FR2549292B1 FR8311615A FR8311615A FR2549292B1 FR 2549292 B1 FR2549292 B1 FR 2549292B1 FR 8311615 A FR8311615 A FR 8311615A FR 8311615 A FR8311615 A FR 8311615A FR 2549292 B1 FR2549292 B1 FR 2549292B1
Authority
FR
France
Prior art keywords
mounting process
diode mounting
diode
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8311615A
Other languages
French (fr)
Other versions
FR2549292A1 (en
Inventor
Jean-Pierre Noguier
Patrick Robin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SILICIUM SEMICONDUCTEUR SSC
Original Assignee
SILICIUM SEMICONDUCTEUR SSC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SILICIUM SEMICONDUCTEUR SSC filed Critical SILICIUM SEMICONDUCTEUR SSC
Priority to FR8311615A priority Critical patent/FR2549292B1/en
Publication of FR2549292A1 publication Critical patent/FR2549292A1/en
Application granted granted Critical
Publication of FR2549292B1 publication Critical patent/FR2549292B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
FR8311615A 1983-07-12 1983-07-12 DIODE MOUNTING PROCESS Expired FR2549292B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8311615A FR2549292B1 (en) 1983-07-12 1983-07-12 DIODE MOUNTING PROCESS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8311615A FR2549292B1 (en) 1983-07-12 1983-07-12 DIODE MOUNTING PROCESS

Publications (2)

Publication Number Publication Date
FR2549292A1 FR2549292A1 (en) 1985-01-18
FR2549292B1 true FR2549292B1 (en) 1986-10-10

Family

ID=9290765

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8311615A Expired FR2549292B1 (en) 1983-07-12 1983-07-12 DIODE MOUNTING PROCESS

Country Status (1)

Country Link
FR (1) FR2549292B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106252388B (en) * 2016-04-08 2019-07-09 苏州能讯高能半导体有限公司 Semiconductor crystal wafer and its manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3369290A (en) * 1964-08-07 1968-02-20 Rca Corp Method of making passivated semiconductor devices
US3972113A (en) * 1973-05-14 1976-08-03 Mitsubishi Denki Kabushiki Kaisha Process of producing semiconductor devices
US3930306A (en) * 1974-04-24 1976-01-06 General Instrument Corporation Process for attaching a lead member to a semiconductor device
DE2611059A1 (en) * 1976-03-16 1977-09-29 Siemens Ag ENCLOSURE SEMI-CONDUCTOR COMPONENT WITH DOUBLE HEAT SINK
DE3048019A1 (en) * 1980-12-19 1982-07-01 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Also Published As

Publication number Publication date
FR2549292A1 (en) 1985-01-18

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Legal Events

Date Code Title Description
ST Notification of lapse