FR2543394B1 - Carte imprimee a bas coefficient de dilatation et a conduction thermique elevee - Google Patents

Carte imprimee a bas coefficient de dilatation et a conduction thermique elevee

Info

Publication number
FR2543394B1
FR2543394B1 FR8304673A FR8304673A FR2543394B1 FR 2543394 B1 FR2543394 B1 FR 2543394B1 FR 8304673 A FR8304673 A FR 8304673A FR 8304673 A FR8304673 A FR 8304673A FR 2543394 B1 FR2543394 B1 FR 2543394B1
Authority
FR
France
Prior art keywords
expansion coefficient
high thermal
thermal conduction
low expansion
printed card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8304673A
Other languages
English (en)
Other versions
FR2543394A1 (fr
Inventor
Bernard Du-Puy Dutour
Christian Napierala
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8304673A priority Critical patent/FR2543394B1/fr
Publication of FR2543394A1 publication Critical patent/FR2543394A1/fr
Application granted granted Critical
Publication of FR2543394B1 publication Critical patent/FR2543394B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR8304673A 1983-03-22 1983-03-22 Carte imprimee a bas coefficient de dilatation et a conduction thermique elevee Expired FR2543394B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8304673A FR2543394B1 (fr) 1983-03-22 1983-03-22 Carte imprimee a bas coefficient de dilatation et a conduction thermique elevee

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8304673A FR2543394B1 (fr) 1983-03-22 1983-03-22 Carte imprimee a bas coefficient de dilatation et a conduction thermique elevee

Publications (2)

Publication Number Publication Date
FR2543394A1 FR2543394A1 (fr) 1984-09-28
FR2543394B1 true FR2543394B1 (fr) 1986-04-25

Family

ID=9287103

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8304673A Expired FR2543394B1 (fr) 1983-03-22 1983-03-22 Carte imprimee a bas coefficient de dilatation et a conduction thermique elevee

Country Status (1)

Country Link
FR (1) FR2543394B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60170287A (ja) * 1984-02-14 1985-09-03 信越化学工業株式会社 銅張積層基板
FR2694139B1 (fr) * 1992-07-21 1994-10-14 Aerospatiale Substrat d'interconnexion pour composants électroniques et son procédé de fabrication.
JP4365061B2 (ja) * 1999-06-21 2009-11-18 三菱電機株式会社 回路形成基板製造方法及び回路形成基板
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
DE102012202562A1 (de) * 2012-02-20 2013-08-22 Osram Gmbh Mehrschichtige leiterplatte

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3035749A1 (de) * 1980-09-22 1982-05-06 Siemens AG, 1000 Berlin und 8000 München Waermeableitende leiterplatten
US4318954A (en) * 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
GB2093847B (en) * 1981-03-04 1984-09-05 Du Pont Epoxy imide compositions

Also Published As

Publication number Publication date
FR2543394A1 (fr) 1984-09-28

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Legal Events

Date Code Title Description
ST Notification of lapse