FR2520965B1 - OTHER FLEXIBLE CIRCUIT WAFER - Google Patents

OTHER FLEXIBLE CIRCUIT WAFER

Info

Publication number
FR2520965B1
FR2520965B1 FR8301326A FR8301326A FR2520965B1 FR 2520965 B1 FR2520965 B1 FR 2520965B1 FR 8301326 A FR8301326 A FR 8301326A FR 8301326 A FR8301326 A FR 8301326A FR 2520965 B1 FR2520965 B1 FR 2520965B1
Authority
FR
France
Prior art keywords
flexible circuit
circuit wafer
wafer
flexible
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8301326A
Other languages
French (fr)
Other versions
FR2520965A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Publication of FR2520965A1 publication Critical patent/FR2520965A1/en
Application granted granted Critical
Publication of FR2520965B1 publication Critical patent/FR2520965B1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
FR8301326A 1982-01-30 1983-01-28 OTHER FLEXIBLE CIRCUIT WAFER Expired FR2520965B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1226982U JPS58116272U (en) 1982-01-30 1982-01-30 flexible circuit board

Publications (2)

Publication Number Publication Date
FR2520965A1 FR2520965A1 (en) 1983-08-05
FR2520965B1 true FR2520965B1 (en) 1985-07-19

Family

ID=11800645

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8301326A Expired FR2520965B1 (en) 1982-01-30 1983-01-28 OTHER FLEXIBLE CIRCUIT WAFER

Country Status (4)

Country Link
JP (1) JPS58116272U (en)
DE (1) DE3302993A1 (en)
FR (1) FR2520965B1 (en)
GB (1) GB2116370B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59144968A (en) * 1983-02-08 1984-08-20 Sharp Corp Thin type electronic instrument
DE3447202A1 (en) * 1984-12-22 1986-07-10 CYTOMED Medizintechnik GmbH, 8750 Aschaffenburg Implantable, intravascular catheter for long-term pharmaceutical medication
JPS63158711A (en) * 1986-12-22 1988-07-01 帝国通信工業株式会社 Terminal construction for flexible printed circuit board
GB8719076D0 (en) * 1987-08-12 1987-09-16 Bicc Plc Circuit board
FR2634095A1 (en) * 1988-07-05 1990-01-12 Bull Cp8 Flexible printed circuit, especially for a card having electronic microcircuits, and card incorporating such a circuit
DE4232119A1 (en) * 1992-09-25 1994-03-31 Mes Und Regeltechnik Geraeteba Double shaft vacuum roots pump - has two rotors forming working and control pistons and housing having overflow valve in discharge aperture with excess pressure valves in side parts on pressure socket
DE69331873T2 (en) * 1992-12-26 2002-11-14 Canon Kk liquid crystal apparatus
DE4423893C2 (en) * 1994-07-07 1996-09-05 Freudenberg Carl Fa Flat gasket with flexible circuit board
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
KR100733877B1 (en) * 2000-07-06 2007-07-02 엘지.필립스 엘시디 주식회사 Flexable Printed Circuit Film
GB2421358B (en) * 2004-12-16 2007-02-21 Sendo Int Ltd Wireless communication unit and flexible printed circuit board therefor
CN111465171A (en) * 2020-04-02 2020-07-28 安捷利电子科技（苏州）有限公司 Flexible circuit board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1241169A (en) * 1967-09-21 1971-07-28 Elliott Brothers London Ltd Improvements relating to printed circuits
US3772776A (en) * 1969-12-03 1973-11-20 Thomas & Betts Corp Method of interconnecting memory plane boards
US3716846A (en) * 1970-01-24 1973-02-13 R Hafner Connector sheet with contacts on opposite sides
DE2423144A1 (en) * 1974-05-13 1975-11-20 Siemens Ag Flexible electronic circuit carrier with conventional wiring - which can be folded up has slits through which wires may be pushed
DE2835961A1 (en) * 1978-08-17 1980-02-28 Siemens Ag Multipole contacting of circuit foil by rigid contact support - uses foil with conducting traces of zigzag or meandering shape

Also Published As

Publication number Publication date
GB2116370B (en) 1985-04-17
DE3302993A1 (en) 1983-08-11
DE3302993C2 (en) 1987-03-05
FR2520965A1 (en) 1983-08-05
GB8302378D0 (en) 1983-03-02
GB2116370A (en) 1983-09-21
JPS58116272U (en) 1983-08-08

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Legal Events

Date Code Title Description
ST Notification of lapse