FR2517475B1 - Circuit a micro-ondes - Google Patents

Circuit a micro-ondes

Info

Publication number
FR2517475B1
FR2517475B1 FR8219933A FR8219933A FR2517475B1 FR 2517475 B1 FR2517475 B1 FR 2517475B1 FR 8219933 A FR8219933 A FR 8219933A FR 8219933 A FR8219933 A FR 8219933A FR 2517475 B1 FR2517475 B1 FR 2517475B1
Authority
FR
France
Prior art keywords
microwave circuit
microwave
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8219933A
Other languages
English (en)
French (fr)
Other versions
FR2517475A1 (fr
Inventor
Osamu Ishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2517475A1 publication Critical patent/FR2517475A1/fr
Application granted granted Critical
Publication of FR2517475B1 publication Critical patent/FR2517475B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguide Connection Structure (AREA)
FR8219933A 1981-11-28 1982-11-26 Circuit a micro-ondes Expired FR2517475B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56193520A JPS5894202A (ja) 1981-11-28 1981-11-28 マイクロ波回路

Publications (2)

Publication Number Publication Date
FR2517475A1 FR2517475A1 (fr) 1983-06-03
FR2517475B1 true FR2517475B1 (fr) 1987-08-21

Family

ID=16309429

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8219933A Expired FR2517475B1 (fr) 1981-11-28 1982-11-26 Circuit a micro-ondes

Country Status (3)

Country Link
US (1) US4513266A (OSRAM)
JP (1) JPS5894202A (OSRAM)
FR (1) FR2517475B1 (OSRAM)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1261481A (en) * 1986-03-13 1989-09-26 Kazumasa Eguchi Printed circuit board capable of preventing electromagnetic interference
US4658334A (en) * 1986-03-19 1987-04-14 Rca Corporation RF signal shielding enclosure of electronic systems
JPH02260499A (ja) * 1989-03-30 1990-10-23 Sony Corp フィルタ装置
GB2232822A (en) * 1989-06-05 1990-12-19 Marconi Co Ltd Signal carrier support
DE69121549T2 (de) * 1990-09-10 1997-01-02 Tdk Corp Bandpassfilter
US5065123A (en) * 1990-10-01 1991-11-12 Harris Corporation Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies
FR2671232B1 (fr) * 1990-12-27 1993-07-30 Thomson Csf Charge pour ligne triplaque hyperfrequences a substrat dielectrique.
US5150088A (en) * 1991-03-27 1992-09-22 Hughes Aircraft Company Stripline shielding techniques in low temperature co-fired ceramic
US5473112A (en) * 1993-09-13 1995-12-05 Vlsi Technology, Inc. Security circuitry with select line and data line shielding
JPH0878940A (ja) * 1994-09-01 1996-03-22 Hitachi Ltd マイクロストリップ伝送線路基板およびその製造方法とそれを用いた回路モジュール
US5808529A (en) * 1996-07-12 1998-09-15 Storage Technology Corporation Printed circuit board layering configuration for very high bandwidth interconnect
US5815050A (en) * 1996-12-27 1998-09-29 Thin Film Technology Corp. Differential delay line
US6072375A (en) * 1998-05-12 2000-06-06 Harris Corporation Waveguide with edge grounding
US6131269A (en) * 1998-05-18 2000-10-17 Trw Inc. Circuit isolation technique for RF and millimeter-wave modules
US6163233A (en) * 1998-07-30 2000-12-19 Harris Corporation Waveguide with signal track cross-over and variable features
US7224249B2 (en) * 2005-09-08 2007-05-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Stripline structure with multiple ground vias separated by no more than 100 mil
US7609125B2 (en) * 2006-10-13 2009-10-27 Avago Technologies Enterprise IP (Singapore) Pte. Ltd. System, device and method for reducing cross-talk in differential signal conductor pairs
US8022861B2 (en) * 2008-04-04 2011-09-20 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for mm-wave imager and radar
US8378759B2 (en) * 2009-01-16 2013-02-19 Toyota Motor Engineering & Manufacturing North America, Inc. First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between
US8058954B2 (en) * 2009-03-05 2011-11-15 Apple Inc. Transmission line with a cross-hatched ground plane that is either filled with conductive paint or covered by a conductive foil
US8786496B2 (en) 2010-07-28 2014-07-22 Toyota Motor Engineering & Manufacturing North America, Inc. Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications
GB2546794B (en) * 2016-01-29 2020-01-08 Teraview Ltd A transmission line
JP2018074269A (ja) * 2016-10-26 2018-05-10 矢崎総業株式会社 伝送線路
US10939541B2 (en) * 2017-03-31 2021-03-02 Huawei Technologies Co., Ltd. Shield structure for a low crosstalk single ended clock distribution circuit
US20220240373A1 (en) * 2021-01-26 2022-07-28 Dell Products L.P. Inhomogeneous dielectric medium high-speed stripline trace system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2812501A (en) * 1954-03-04 1957-11-05 Sanders Associates Inc Transmission line
US3093805A (en) * 1957-07-26 1963-06-11 Osifchin Nicholas Coaxial transmission line
FR1385291A (fr) * 1964-03-16 1965-01-08 Sanders Associates Inc Mélangeur équilibré hyperfréquence
NL143103B (nl) * 1967-10-12 1974-08-15 Siemens Ag Microgolffilter in "triplate"-uitvoering.
BE792698A (fr) * 1971-12-21 1973-06-13 Illinois Tool Works Catheter-canule samenstel
US3895435A (en) * 1974-01-23 1975-07-22 Raytheon Co Method for electrically interconnecting multilevel stripline circuitry

Also Published As

Publication number Publication date
JPS5894202A (ja) 1983-06-04
US4513266A (en) 1985-04-23
FR2517475A1 (fr) 1983-06-03
JPS6228603B2 (OSRAM) 1987-06-22

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Legal Events

Date Code Title Description
D6 Patent endorsed licences of rights
ST Notification of lapse