FR2507017B1 - - Google Patents
Info
- Publication number
- FR2507017B1 FR2507017B1 FR8110572A FR8110572A FR2507017B1 FR 2507017 B1 FR2507017 B1 FR 2507017B1 FR 8110572 A FR8110572 A FR 8110572A FR 8110572 A FR8110572 A FR 8110572A FR 2507017 B1 FR2507017 B1 FR 2507017B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/654—Top-view layouts
- H10W70/655—Fan-out layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8110572A FR2507017A1 (fr) | 1981-05-27 | 1981-05-27 | Microassemblage utilisable en hyperfrequences |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8110572A FR2507017A1 (fr) | 1981-05-27 | 1981-05-27 | Microassemblage utilisable en hyperfrequences |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2507017A1 FR2507017A1 (fr) | 1982-12-03 |
| FR2507017B1 true FR2507017B1 (show.php) | 1985-02-01 |
Family
ID=9258951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8110572A Granted FR2507017A1 (fr) | 1981-05-27 | 1981-05-27 | Microassemblage utilisable en hyperfrequences |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2507017A1 (show.php) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2608318B1 (fr) * | 1986-12-16 | 1989-06-16 | Thomson Semiconducteurs | Dispositif semi-conducteur a faible bruit en hyperfrequence, monte dans un boitier |
| FR2710192B1 (fr) * | 1991-07-29 | 1996-01-26 | Gen Electric | Composant micro-onde ayant des caractéristiques fonctionnelles ajustées et procédé d'ajustement. |
| JPH0583017A (ja) * | 1991-09-24 | 1993-04-02 | Mitsubishi Electric Corp | マイクロ波集積回路装置 |
| FR2787635B1 (fr) * | 1998-12-17 | 2001-03-16 | St Microelectronics Sa | Dispositif semi-conducteur avec substrat sur isolant a decouplage de bruit |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3671793A (en) * | 1969-09-16 | 1972-06-20 | Itt | High frequency transistor structure having an impedance transforming network incorporated on the semiconductor chip |
| US4196508A (en) * | 1977-09-01 | 1980-04-08 | Honeywell Inc. | Durable insulating protective layer for hybrid CCD/mosaic IR detector array |
| JPS55140251A (en) * | 1979-04-12 | 1980-11-01 | Fujitsu Ltd | Semiconductor device |
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1981
- 1981-05-27 FR FR8110572A patent/FR2507017A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2507017A1 (fr) | 1982-12-03 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| CA | Change of address | ||
| CD | Change of name or company name | ||
| ST | Notification of lapse |