FR2501907B1 - - Google Patents
Info
- Publication number
- FR2501907B1 FR2501907B1 FR8105134A FR8105134A FR2501907B1 FR 2501907 B1 FR2501907 B1 FR 2501907B1 FR 8105134 A FR8105134 A FR 8105134A FR 8105134 A FR8105134 A FR 8105134A FR 2501907 B1 FR2501907 B1 FR 2501907B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8105134A FR2501907A1 (fr) | 1981-03-13 | 1981-03-13 | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8105134A FR2501907A1 (fr) | 1981-03-13 | 1981-03-13 | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2501907A1 FR2501907A1 (fr) | 1982-09-17 |
| FR2501907B1 true FR2501907B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1984-05-04 |
Family
ID=9256246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8105134A Granted FR2501907A1 (fr) | 1981-03-13 | 1981-03-13 | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2501907A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2109996B (en) * | 1981-11-24 | 1985-08-07 | Varian Associates | Hydraulically actuated semiconductor wafer clamping and cooling apparatus |
| KR970003885B1 (ko) * | 1987-12-25 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 에칭 방법 및 그 장치 |
| FR2767604B1 (fr) * | 1997-08-19 | 2000-12-01 | Commissariat Energie Atomique | Procede de traitement pour le collage moleculaire et le decollage de deux structures |
| JP3772954B2 (ja) * | 1999-10-15 | 2006-05-10 | 株式会社村田製作所 | チップ状部品の取扱方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50122879A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1974-03-13 | 1975-09-26 | ||
| US4139051A (en) * | 1976-09-07 | 1979-02-13 | Rockwell International Corporation | Method and apparatus for thermally stabilizing workpieces |
-
1981
- 1981-03-13 FR FR8105134A patent/FR2501907A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2501907A1 (fr) | 1982-09-17 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |