FR2501907A1 - Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede - Google Patents
Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede Download PDFInfo
- Publication number
- FR2501907A1 FR2501907A1 FR8105134A FR8105134A FR2501907A1 FR 2501907 A1 FR2501907 A1 FR 2501907A1 FR 8105134 A FR8105134 A FR 8105134A FR 8105134 A FR8105134 A FR 8105134A FR 2501907 A1 FR2501907 A1 FR 2501907A1
- Authority
- FR
- France
- Prior art keywords
- substrate
- channels
- plate
- substrate holder
- elastomeric material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 164
- 239000012530 fluid Substances 0.000 title claims abstract description 24
- 229920001971 elastomer Polymers 0.000 title claims abstract description 23
- 239000000806 elastomer Substances 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 title abstract description 4
- 239000011347 resin Substances 0.000 title abstract description 4
- 229920001577 copolymer Polymers 0.000 title 1
- 230000010070 molecular adhesion Effects 0.000 title 1
- 239000002344 surface layer Substances 0.000 claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims abstract description 4
- 238000005553 drilling Methods 0.000 claims abstract 3
- 238000005086 pumping Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 29
- 239000013536 elastomeric material Substances 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 238000004891 communication Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000035515 penetration Effects 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 238000007664 blowing Methods 0.000 claims 1
- 210000000988 bone and bone Anatomy 0.000 claims 1
- 230000002441 reversible effect Effects 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 abstract description 3
- 229920002223 polystyrene Polymers 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract description 2
- 150000003505 terpenes Chemical class 0.000 abstract description 2
- 235000007586 terpenes Nutrition 0.000 abstract description 2
- 238000002039 particle-beam lithography Methods 0.000 abstract 1
- 229920001195 polyisoprene Polymers 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000001459 lithography Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000013459 approach Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8105134A FR2501907A1 (fr) | 1981-03-13 | 1981-03-13 | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8105134A FR2501907A1 (fr) | 1981-03-13 | 1981-03-13 | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2501907A1 true FR2501907A1 (fr) | 1982-09-17 |
| FR2501907B1 FR2501907B1 (enExample) | 1984-05-04 |
Family
ID=9256246
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8105134A Granted FR2501907A1 (fr) | 1981-03-13 | 1981-03-13 | Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2501907A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2517124A1 (fr) * | 1981-11-24 | 1983-05-27 | Varian Associates | Appareil de serrage de tranches de semi-conducteur actionne de facon hydraulique |
| EP0323620A3 (en) * | 1987-12-25 | 1990-04-11 | Tokyo Electron Limited | Etching method and etching apparatus |
| EP0898307A1 (fr) * | 1997-08-19 | 1999-02-24 | Commissariat A L'energie Atomique | Procédé de traitement pour le collage moléculaire et le décollage de deux structures |
| SG92743A1 (en) * | 1999-10-15 | 2002-11-19 | Murata Manufacturing Co | Chip element holder and method of handling chip elements |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2511071A1 (de) * | 1974-03-13 | 1975-09-25 | Canon Kk | Vorrichtung zum automatischen ausrichten von halbleiterscheiben |
| US4139051A (en) * | 1976-09-07 | 1979-02-13 | Rockwell International Corporation | Method and apparatus for thermally stabilizing workpieces |
-
1981
- 1981-03-13 FR FR8105134A patent/FR2501907A1/fr active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2511071A1 (de) * | 1974-03-13 | 1975-09-25 | Canon Kk | Vorrichtung zum automatischen ausrichten von halbleiterscheiben |
| US4139051A (en) * | 1976-09-07 | 1979-02-13 | Rockwell International Corporation | Method and apparatus for thermally stabilizing workpieces |
Non-Patent Citations (1)
| Title |
|---|
| EXBK/77 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2517124A1 (fr) * | 1981-11-24 | 1983-05-27 | Varian Associates | Appareil de serrage de tranches de semi-conducteur actionne de facon hydraulique |
| EP0323620A3 (en) * | 1987-12-25 | 1990-04-11 | Tokyo Electron Limited | Etching method and etching apparatus |
| EP0898307A1 (fr) * | 1997-08-19 | 1999-02-24 | Commissariat A L'energie Atomique | Procédé de traitement pour le collage moléculaire et le décollage de deux structures |
| FR2767604A1 (fr) * | 1997-08-19 | 1999-02-26 | Commissariat Energie Atomique | Procede de traitement pour le collage moleculaire et le decollage de deux structures |
| US6429094B1 (en) | 1997-08-19 | 2002-08-06 | Commissariat A L'energie Atomique | Treatment process for molecular bonding and unbonding of two structures |
| SG92743A1 (en) * | 1999-10-15 | 2002-11-19 | Murata Manufacturing Co | Chip element holder and method of handling chip elements |
| US6503356B1 (en) | 1999-10-15 | 2003-01-07 | Murata Manufacturing Co., Ltd. | Chip element holder and method of handling chip elements |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2501907B1 (enExample) | 1984-05-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |