FR2500959B1 - - Google Patents
Info
- Publication number
- FR2500959B1 FR2500959B1 FR8103982A FR8103982A FR2500959B1 FR 2500959 B1 FR2500959 B1 FR 2500959B1 FR 8103982 A FR8103982 A FR 8103982A FR 8103982 A FR8103982 A FR 8103982A FR 2500959 B1 FR2500959 B1 FR 2500959B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8103982A FR2500959A1 (fr) | 1981-02-27 | 1981-02-27 | Boitier de dispositif electronique a forte dissipation thermique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8103982A FR2500959A1 (fr) | 1981-02-27 | 1981-02-27 | Boitier de dispositif electronique a forte dissipation thermique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2500959A1 FR2500959A1 (fr) | 1982-09-03 |
FR2500959B1 true FR2500959B1 (xx) | 1984-07-20 |
Family
ID=9255708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8103982A Granted FR2500959A1 (fr) | 1981-02-27 | 1981-02-27 | Boitier de dispositif electronique a forte dissipation thermique |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2500959A1 (xx) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102714193A (zh) * | 2009-12-10 | 2012-10-03 | 丹佛斯特伯克压缩机有限责任有限公司 | Igbt的冷却方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR8400122A (pt) * | 1983-01-12 | 1984-08-21 | Allen Bradley Co | Modulo semicondutor e embalagem de semicondutor aperfeicoada |
CA1230184A (en) * | 1983-11-29 | 1987-12-08 | Toshiyuki Saito | Liquid cooling type high frequency solid state device |
DE3504992A1 (de) * | 1985-02-14 | 1986-08-14 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit integriertem waermerohr |
CA2255441C (en) * | 1997-12-08 | 2003-08-05 | Hiroki Sekiya | Package for semiconductor power device and method for assembling the same |
US6483706B2 (en) * | 2000-12-22 | 2002-11-19 | Vlt Corporation | Heat dissipation for electronic components |
US20060209516A1 (en) * | 2005-03-17 | 2006-09-21 | Chengalva Suresh K | Electronic assembly with integral thermal transient suppression |
FR2895589B1 (fr) * | 2005-12-23 | 2008-03-14 | Valeo Equip Electr Moteur | Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne. |
DE102007062167A1 (de) * | 2007-12-21 | 2009-06-25 | Robert Bosch Gmbh | Leistungsschaltung |
FR2940521B1 (fr) | 2008-12-19 | 2011-11-11 | 3D Plus | Procede de fabrication collective de modules electroniques pour montage en surface |
SG10201504274SA (en) * | 2015-05-29 | 2016-12-29 | Delta Electronics Int’L Singapore Pte Ltd | Package assembly |
US20200045846A1 (en) * | 2015-06-30 | 2020-02-06 | CommScope Connectivity Belgium BVBA | System for compensation of expansion/contraction of a cooling medium inside a sealed closure |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1266244A (fr) * | 1960-08-29 | 1961-07-07 | Sony Corp | Dispositif de refroidissement pour semi-conducteurs |
CH448274A (de) * | 1964-05-28 | 1967-12-15 | Westinghouse Electric Corp | Halbleiterbauelement |
US3373322A (en) * | 1966-01-13 | 1968-03-12 | Mitronics Inc | Semiconductor envelope |
US3851221A (en) * | 1972-11-30 | 1974-11-26 | P Beaulieu | Integrated circuit package |
FR2327642A1 (fr) * | 1975-10-06 | 1977-05-06 | Alsthom Cgee | Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant |
-
1981
- 1981-02-27 FR FR8103982A patent/FR2500959A1/fr active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102714193A (zh) * | 2009-12-10 | 2012-10-03 | 丹佛斯特伯克压缩机有限责任有限公司 | Igbt的冷却方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2500959A1 (fr) | 1982-09-03 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |