FR2500959B1 - - Google Patents

Info

Publication number
FR2500959B1
FR2500959B1 FR8103982A FR8103982A FR2500959B1 FR 2500959 B1 FR2500959 B1 FR 2500959B1 FR 8103982 A FR8103982 A FR 8103982A FR 8103982 A FR8103982 A FR 8103982A FR 2500959 B1 FR2500959 B1 FR 2500959B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8103982A
Other languages
French (fr)
Other versions
FR2500959A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8103982A priority Critical patent/FR2500959A1/fr
Publication of FR2500959A1 publication Critical patent/FR2500959A1/fr
Application granted granted Critical
Publication of FR2500959B1 publication Critical patent/FR2500959B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H01L2924/13033—TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8103982A 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique Granted FR2500959A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8103982A FR2500959A1 (fr) 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8103982A FR2500959A1 (fr) 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique

Publications (2)

Publication Number Publication Date
FR2500959A1 FR2500959A1 (fr) 1982-09-03
FR2500959B1 true FR2500959B1 (xx) 1984-07-20

Family

ID=9255708

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8103982A Granted FR2500959A1 (fr) 1981-02-27 1981-02-27 Boitier de dispositif electronique a forte dissipation thermique

Country Status (1)

Country Link
FR (1) FR2500959A1 (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714193A (zh) * 2009-12-10 2012-10-03 丹佛斯特伯克压缩机有限责任有限公司 Igbt的冷却方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8400122A (pt) * 1983-01-12 1984-08-21 Allen Bradley Co Modulo semicondutor e embalagem de semicondutor aperfeicoada
CA1230184A (en) * 1983-11-29 1987-12-08 Toshiyuki Saito Liquid cooling type high frequency solid state device
DE3504992A1 (de) * 1985-02-14 1986-08-14 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit integriertem waermerohr
CA2255441C (en) * 1997-12-08 2003-08-05 Hiroki Sekiya Package for semiconductor power device and method for assembling the same
US6483706B2 (en) * 2000-12-22 2002-11-19 Vlt Corporation Heat dissipation for electronic components
US20060209516A1 (en) * 2005-03-17 2006-09-21 Chengalva Suresh K Electronic assembly with integral thermal transient suppression
FR2895589B1 (fr) * 2005-12-23 2008-03-14 Valeo Equip Electr Moteur Dispositif de borne de connexion electrique notamment de machine electrique tournante et procede de realisation d'un tel dispositif de borne.
DE102007062167A1 (de) * 2007-12-21 2009-06-25 Robert Bosch Gmbh Leistungsschaltung
FR2940521B1 (fr) 2008-12-19 2011-11-11 3D Plus Procede de fabrication collective de modules electroniques pour montage en surface
SG10201504274SA (en) * 2015-05-29 2016-12-29 Delta Electronics Int’L Singapore Pte Ltd Package assembly
US20200045846A1 (en) * 2015-06-30 2020-02-06 CommScope Connectivity Belgium BVBA System for compensation of expansion/contraction of a cooling medium inside a sealed closure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1266244A (fr) * 1960-08-29 1961-07-07 Sony Corp Dispositif de refroidissement pour semi-conducteurs
CH448274A (de) * 1964-05-28 1967-12-15 Westinghouse Electric Corp Halbleiterbauelement
US3373322A (en) * 1966-01-13 1968-03-12 Mitronics Inc Semiconductor envelope
US3851221A (en) * 1972-11-30 1974-11-26 P Beaulieu Integrated circuit package
FR2327642A1 (fr) * 1975-10-06 1977-05-06 Alsthom Cgee Montage de semi-conducteurs de puissance refroidis par un fluide refrigerant

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714193A (zh) * 2009-12-10 2012-10-03 丹佛斯特伯克压缩机有限责任有限公司 Igbt的冷却方法

Also Published As

Publication number Publication date
FR2500959A1 (fr) 1982-09-03

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Legal Events

Date Code Title Description
ST Notification of lapse