FR2498951A1 - Formation of thin films by spray pyrolysis - from solns. contg. film element salts and a reducer in large excess and at high concn. - Google Patents
Formation of thin films by spray pyrolysis - from solns. contg. film element salts and a reducer in large excess and at high concn. Download PDFInfo
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- FR2498951A1 FR2498951A1 FR8201672A FR8201672A FR2498951A1 FR 2498951 A1 FR2498951 A1 FR 2498951A1 FR 8201672 A FR8201672 A FR 8201672A FR 8201672 A FR8201672 A FR 8201672A FR 2498951 A1 FR2498951 A1 FR 2498951A1
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- Prior art keywords
- layer
- dissolved
- substrate
- constituent element
- doping agent
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- 239000003638 chemical reducing agent Substances 0.000 title claims abstract description 19
- 150000003839 salts Chemical class 0.000 title claims abstract description 14
- 230000015572 biosynthetic process Effects 0.000 title abstract description 7
- 238000005118 spray pyrolysis Methods 0.000 title description 4
- 239000010408 film Substances 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000005507 spraying Methods 0.000 claims abstract description 22
- 239000000470 constituent Substances 0.000 claims abstract description 20
- 229910004613 CdTe Inorganic materials 0.000 claims abstract description 7
- -1 GaAlAs Chemical compound 0.000 claims abstract description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract description 4
- UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 claims abstract description 4
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 38
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 28
- 239000002019 doping agent Substances 0.000 claims description 22
- 230000003647 oxidation Effects 0.000 claims description 21
- 238000007254 oxidation reaction Methods 0.000 claims description 21
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 14
- 235000019253 formic acid Nutrition 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 11
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 229910052714 tellurium Inorganic materials 0.000 claims description 6
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052793 cadmium Inorganic materials 0.000 claims description 5
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical group [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000007795 chemical reaction product Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 239000000725 suspension Substances 0.000 claims description 5
- 229910002899 Bi2Te3 Inorganic materials 0.000 claims description 3
- 229910007709 ZnTe Inorganic materials 0.000 claims description 3
- 150000007524 organic acids Chemical group 0.000 claims description 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims description 2
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims 2
- 150000002484 inorganic compounds Chemical class 0.000 claims 2
- 229910010272 inorganic material Inorganic materials 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000008021 deposition Effects 0.000 abstract description 4
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 9
- 239000010949 copper Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 238000006722 reduction reaction Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 239000004615 ingredient Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 4
- 239000003973 paint Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011195 cermet Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical class [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- PLLZRTNVEXYBNA-UHFFFAOYSA-L cadmium hydroxide Chemical compound [OH-].[OH-].[Cd+2] PLLZRTNVEXYBNA-UHFFFAOYSA-L 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 1
- UQMZPFKLYHOJDL-UHFFFAOYSA-N zinc;cadmium(2+);disulfide Chemical compound [S-2].[S-2].[Zn+2].[Cd+2] UQMZPFKLYHOJDL-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/1678—Heating of the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
- C03C2217/283—Borides, phosphides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
- C03C2217/287—Chalcogenides
- C03C2217/288—Sulfides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/28—Other inorganic materials
- C03C2217/287—Chalcogenides
- C03C2217/289—Selenides, tellurides
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/11—Deposition methods from solutions or suspensions
- C03C2218/112—Deposition methods from solutions or suspensions by spraying
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
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- Photovoltaic Devices (AREA)
- Chemically Coating (AREA)
Abstract
Description
Procédé de fabrication d'une couche mince
La présente invention concerne la pyrolyse par pulvérisation, qui consiste a former une couche mince en pulvérisant sur un substrat chauffé une solution atomisée contenant les sels appropriés des éléments constitutifs (par exemple Te) du composé de la couche. La réaction chimique se produit du fait de la pulvérisation sur le substrat chauffé, et les éléments des sels qui ne sont pas des constitu-ants de la couche sont enlevés par évaporation en compagnie du solvant, qui est de façon caractéristique de l'eau.Par exemple, le brevet US 3 148 084 décrit, entre autres exemples, la formation de CdS au moyen de la pyrolyse par pulvérisation, conformément à l'équation suivante CdC12 + H2NC (=S) NH2 +# CdS avec Cu en dispersion +
Cu++ > produits volatils
On abaisse ensuite la résistivité de la couche par une opération de recuit après dépit.Method for manufacturing a thin layer
The present invention relates to spray pyrolysis, which consists in forming a thin layer by spraying onto a heated substrate an atomized solution containing the appropriate salts of the constituent elements (for example Te) of the layer compound. The chemical reaction occurs due to spraying on the heated substrate, and the elements of the salts which are not constituents of the layer are removed by evaporation together with the solvent, which is typically water. For example, US Pat. No. 3,148,084 describes, among other examples, the formation of CdS by means of spray pyrolysis, in accordance with the following equation CdC12 + H2NC (= S) NH2 + # CdS with Cu in dispersion +
Cu ++> volatile products
The resistivity of the layer is then lowered by an annealing operation after spite.
Antérieurement a la conception de l'invention, Steven
A. Lis et Harvey B. Serreze ont proposé d'utiliser 82 dans le gaz ambiant et/ou le gaz de pulvérisation pour agir en tant qu'agent réducteur, afin de convertir les impuretés sous une forme volatile, et également pour permettre l'utilisation de Te dans un état d'oxydation différent dans la matière de départ et dans la couche. Les tentatives faites par les inventeurs pour mettre en oeuvre une telle suggestion ont été infructueuses.Prior to the conception of the invention, Steven
A. Lis and Harvey B. Serreze proposed using 82 in ambient gas and / or spray gas to act as a reducing agent, to convert the impurities to a volatile form, and also to allow the use of Te in a different oxidation state in the starting material and in the layer. The attempts made by the inventors to implement such a suggestion have been unsuccessful.
Les inventeurs ont couvert qu'en ajoutant un agent directement à la solution de pulvérisation, on pouvait provoquer diverses réactions d'oxydation/réduction souhaitables, au moment où la solution de pulvérisation vient en contact avec le substrat chauffé. En conséquence, une caractéristique de l'invention consiste en ce que la solution contient également un agent en quantité suffisante pour changer l'état d'oxydation de l'un au moins des éléments dissous, après contact avec le substrat chauffé. The inventors have covered that by adding an agent directly to the spray solution, various desirable oxidation / reduction reactions could be caused when the spray solution comes into contact with the heated substrate. Consequently, a characteristic of the invention consists in that the solution also contains an agent in an amount sufficient to change the oxidation state of at least one of the dissolved elements, after contact with the heated substrate.
Des modes de réalisation avantageux présentent les caractéristiques suivantes : la réaction d'oxydation réduction fait intervenir la réduction d'un élément constitutif de la couche ; cet élément constitutif est le tellure, et la couche consiste en tellurure de cadmium; les sels utilisés dans la solution de pulvérisation sont par exemple (NH4) 2TeO4 et Cd (OH)2 ; le substrat est maintenu à une température comprise entre 325 et 5500C (de préférence entre 370 et 4250C) ; on utilise des gaz inertes pour le gaz de pulvérisation et le gaz ambiant on introduit également dans la solution de pulvérisation un agent de dopage (on utilise ici l'expression "agent de dopage" dans le sens qui est défini à la page 372 de l'ouvrage de Kittel intitulé Introduction to
Solide State Physics, 4ème Edition, John Wiley & Sons"), et cet agent de dopage change d'état d'oxydation après autre venu en contact avec le substrat chauffé ; et l'agent de dopage est du cuivre. Dans un autre mode de réalisation, la couche consiste en ZnCdS avec un agent de dopage constitué par de l'indium, et l'agent de dopage est également ajouté a la solution de pulvérisation et il change d'état d'oxydation après'entre venu en contact avec le substrat chauffé.Dans d'autres modes de réalisation encore, la réaction d'oxydation/réduction fait intervenir la conversion d'une impureté sous une forme volatile, et dans encore un autre mode de réalisation, on utilise une quantité d'un élément constitutif d'une couche qui est supérieure a la quantité nécessaire pour régir avec un autre élément constitutif de la couche, et la quantité en excès produit une modification de la conduc tivité de la couche.De plus, dans des modes de réalisa- tion, l'agent réducteur est un acide organique (de préférence de l'acide formique ou de l'acide acétique) fortement soluble (c'est-à-dire avec une solubilité supérieure à 1 M) ; et la solubilité de ces acides dans le solvant permet d'augmenter la force de l'agent réducteur jusqu'3 des niveaux qui permettent la formation de produits de pureté accrue. En outre, dans des modes de réalisation préférés, la concentration de l'agent réducteur est très supérieure à 10 fois et de préférence supérieure à 900 fois la quantité stoechiométrique), ce qui conduit de façon inattendue à la formation d'une couche de grande pureté.Advantageous embodiments have the following characteristics: the reduction oxidation reaction involves the reduction of a component of the layer; this constituent element is tellurium, and the layer consists of cadmium telluride; the salts used in the spray solution are for example (NH4) 2TeO4 and Cd (OH) 2; the substrate is maintained at a temperature between 325 and 5500C (preferably between 370 and 4250C); inert gases are used for the spraying gas and the ambient gas a doping agent is also introduced into the spraying solution (the expression "doping agent" is used here in the sense which is defined on page 372 of the Kittel's work entitled Introduction to
Solid State Physics, 4th Edition, John Wiley & Sons "), and this doping agent changes its oxidation state after other contact with the heated substrate; and the doping agent is copper. In another mode embodiment, the layer consists of ZnCdS with a doping agent constituted by indium, and the doping agent is also added to the spraying solution and it changes oxidation state after coming into contact with the heated substrate. In still other embodiments, the oxidation / reduction reaction involves the conversion of an impurity to a volatile form, and in yet another embodiment, an amount of an element is used. constitutive of a layer which is greater than the amount necessary to govern with another constituent element of the layer, and the excess amount produces a modification of the conductivity of the layer. In addition, in embodiments, the reducing agent is an organic acid (preferably of formic acid or acetic acid) highly soluble (that is to say with a solubility greater than 1 M); and the solubility of these acids in the solvent makes it possible to increase the strength of the reducing agent up to levels which allow the formation of products of increased purity. Furthermore, in preferred embodiments, the concentration of the reducing agent is much more than 10 times and preferably more than 900 times the stoichiometric amount), which unexpectedly leads to the formation of a large layer. purity.
Une application avantageuse des couches fabriquées conformément à l'invention consiste dans l'utilisation dans des dispositifs photovoltalques, et une utilisation particulièrement avantageuse concerne un dispositif multicouche comportant une couche de CdTe couverte de graphite, sur une couche de CdZnS place a elle-même sur un substrat revêtu d'oxyde d'étain-indium. Une autre application très avanta- geuse est relative à un panneau d'absorption de la chaleur solaire qui comporte une couche de A1203-Ag, la réaction d'oxydation/réduction consistant dans la réduction de l'argent à l'état métallique, dans lequel il absorbe la chaleur. An advantageous application of the layers manufactured in accordance with the invention consists in the use in photovoltaic devices, and a particularly advantageous use relates to a multilayer device comprising a layer of CdTe covered with graphite, on a layer of CdZnS placed in itself on a substrate coated with tin-indium oxide. Another very advantageous application relates to a solar heat absorption panel which comprises a layer of A1203-Ag, the oxidation / reduction reaction consisting in the reduction of silver to the metallic state, in which it absorbs heat.
L'invention permet également d'utiliser une matière de départ dans un état d'oxydation différent de l'état d'oxydation dans la couche, et ceci est particulièrement avantageux lorsqu'on désire avoir dans la couchevun Oldmeut dans un état qui est fortement insoluble dans la solution de pulvérisation. Il devient également possible de produire des couches de grande pureté en convertissant des impuretés sous forme volatile, afin qu'elles ne soient pas incorporées dans la couche.On peut aisément inclure des agents de dopage dans la couche pour modifier sa conductivité électrique, sans nécessiter une opération de recuit après dépôt, et on peut également modifier les caractéristiques électriques de la couche en utilisant une quantité d'un éLément constitutlf s'ipérI## à la quantité nécessaire pour réagir avec l'autre élément constitutif. Enfin, l'invention permet d'utiliser la pyrolyse par pulvérisation pour produire une grande variété de couches, comprenant la préparation de couches des matières suivantes :
CdTe, CdZnS, Ag, Cr, Bi2Te3, ZnTe, HgxCd1~xTe, Zn#Cdî#1S,
CdS, CdSe, ZnS, ZnSe, GaAs, GaxAll~x As, InP, BN, alliages
Ni-Co-Cr, Zn3P2, et ZnSnP2.The invention also makes it possible to use a starting material in an oxidation state different from the oxidation state in the layer, and this is particularly advantageous when it is desired to have in the layer an Oldmeut in a state which is strongly insoluble in spray solution. It also becomes possible to produce high purity layers by converting impurities into volatile form, so that they are not incorporated into the layer. It is easy to include doping agents in the layer to modify its electrical conductivity, without requiring an annealing operation after deposition, and it is also possible to modify the electrical characteristics of the layer by using an amount of a constituent element which is spiked to the amount necessary to react with the other constituent element. Finally, the invention allows spray pyrolysis to be used to produce a wide variety of layers, including the preparation of layers of the following materials:
CdTe, CdZnS, Ag, Cr, Bi2Te3, ZnTe, HgxCd1 ~ xTe, Zn # Cdî # 1S,
CdS, CdSe, ZnS, ZnSe, GaAs, GaxAll ~ x As, InP, BN, alloys
Ni-Co-Cr, Zn3P2, and ZnSnP2.
L'invention sera mieux comprise à la lecture de la description qui va suivre de modes de réalisation, donnés à titre non limitatif. La suite de la description se réfère aux dessins annexés sur lesquels
La figure 1 est une représentation en élévation d'un dispositif photovoltaïque fabriqué conformément à l'invention.The invention will be better understood on reading the following description of embodiments, given without limitation. The following description refers to the accompanying drawings in which
Figure 1 is an elevational representation of a photovoltaic device manufactured in accordance with the invention.
La figure 2 est une coupe schématique verticale et partielle d'un panneau d'absorption de la chaleur solaire fabriqué conformément à l'invention. Figure 2 is a schematic vertical and partial section of a solar heat absorption panel manufactured in accordance with the invention.
La figure 3 est une représentation schématique d'un appareil de pulvérisation et de moyens de chauffage utili sables pour fabriquer les dispositifs des figures 1 et 2, conformément à l'invention. Figure 3 is a schematic representation of a spraying apparatus and heating means usable for manufacturing the devices of Figures 1 and 2, in accordance with the invention.
Structure et appareil
On va maintenant considérer le mode de réalisation de la figure 1 sur laquelle on voit un dispositif photovoltai- que 10 qui comprend un substrat de verre 12, une couche d'oxyde d'étain-indium 14 (d'une épaisseur d'environ 100 nm) sur le substrat, une couche 16 de sulfure de zinc-cadmium pulvérisé (100 à 200 nm d'épaisseur) sur la couche 12, une couche 17 de tellurure de cadmium pulvérisé (250 à 500 nm d'épaisseur) sur la couche 16, une couche 18.d'Aquadag (suspension séchée de graphite dans de l'eau) sur la couche 17, un fil métallique 20 fixé à la couche d'o.vvde d'étainsindium 14 et un fil métallique 24 connecté à l'Aquadag par une couche de peinture à l'argent 22.Structure and device
We will now consider the embodiment of FIG. 1 in which we see a photovoltaic device 10 which comprises a glass substrate 12, a layer of tin-indium oxide 14 (with a thickness of approximately 100 nm) on the substrate, a layer 16 of pulverized zinc-cadmium sulfide (100 to 200 nm thick) on the layer 12, a layer 17 of pulverized cadmium telluride (250 to 500 nm thick) on the layer 16, a layer 18 of Aquadag (dried suspension of graphite in water) on the layer 17, a metal wire 20 fixed to the layer of tinindium o.vvde 14 and a metal wire 24 connected to the 'Aquadag with a coat of silver paint 22.
Dans le mode de réalisation qui est représenté sur la figure 2, on voit un panneau d'absorption de la chaleur solaire, 25, qui comprend un substrat de verre 26 sur lequel se trouve une couche 28 (100 à 200 nm d'épaisseur) en un cermet A1203-Ag. Les points 29 représentent des régions d'argent métallique dispersées dans tout le volume de Au203. In the embodiment which is represented in FIG. 2, there is seen a solar heat absorption panel, 25, which comprises a glass substrate 26 on which is a layer 28 (100 to 200 nm thick) into an A1203-Ag cermet. Dots 29 represent regions of metallic silver dispersed throughout the volume of Au203.
On va maintenant considérer la figure 3 sur laquelle on voit un appareil de pulvérisation et de chauffage 30 qui comporte une enceinte hermétique 32. Une buse de pulvérisation 34 (1/4 J avec un capuchon pour fluide 1050 SS de la firme
Spraying Systems Company) est alimentée par une bouteille de solution 36 et par une source de gaz de pulvérisation 38, consistant en azote. Le débit de gaz est régulé par une valve 40 et la pression est contrôlée par un manomètre 42. Les substrats 44 (par exemple le substrat 12 et la couche 14 ou le substrat 26) sont chauffés par un élément chauffant 46, par l'intermédiaire d'un bain d'étain 48. La buse 34 se trouve à 30 cm audessus des substrats 44. les moyens externes commandent la température de l'élément chauffant 46 et ce dernier est monté dans l'enceinte 32 sur un bloc isolant 50.L'accès à l'élément chauffant est assuré par un passage 52 (représenté schématiquement), et une valve 54 régule l'alimentation en gaz de purge, consistant en azote, qui circule à l'intérieur de l'encein te 32. On utilise des écrans thermiques 56 pour protéger la solution, l'appareillage de commande et la buse, 34, 36, 40, contre les températures élevées et les vapeurs provenant de l'appareil de chauffage qui se trouve au-dessous.We will now consider FIG. 3 in which we see a spraying and heating device 30 which includes a sealed enclosure 32. A spraying nozzle 34 (1/4 J with a cap for fluid 1050 SS from the firm
Spraying Systems Company) is supplied by a bottle of solution 36 and by a source of spray gas 38, consisting of nitrogen. The gas flow is regulated by a valve 40 and the pressure is controlled by a pressure gauge 42. The substrates 44 (for example the substrate 12 and the layer 14 or the substrate 26) are heated by a heating element 46, via of a tin bath 48. The nozzle 34 is located 30 cm above the substrates 44. the external means control the temperature of the heating element 46 and the latter is mounted in the enclosure 32 on an insulating block 50. Access to the heating element is provided by a passage 52 (shown diagrammatically), and a valve 54 regulates the supply of purge gas, consisting of nitrogen, which circulates inside the enclosure 32. uses heat shields 56 to protect the solution, the control gear and the nozzle, 34, 36, 40, from high temperatures and vapors from the heater below.
Fabrication
Pour fabriquer le dispositif photovoltaïque de la figure 1, on pulvérise les couches 16 et 17 sur le verre revêtu d'oxyde d'étain-indium (le substrat 12 et la couche 14 du dispositif de la figure 1, qui peuvent être fournis par la firme Pittsburg Plate Glass-Inc.) en de la figure 3. On prépare tout d'abord une solution de pulvérisation I pour la couche 16 et une solution de pulvérisation Il pour la couche 17, en réalisant des solutions aqueuses comprenant les ingrédients indiqués dans le tableau suivant, avec les concentrations indiquées.Manufacturing
To manufacture the photovoltaic device of FIG. 1, the layers 16 and 17 are sprayed on the glass coated with tin-indium oxide (the substrate 12 and the layer 14 of the device of FIG. 1, which can be supplied by the Pittsburg Plate Glass-Inc.) in of Figure 3. A spray solution I is first prepared for layer 16 and a spray solution II for layer 17, by making aqueous solutions comprising the ingredients indicated in the following table, with the concentrations indicated.
TABLEAU 1
Solution I
Ingrédient Concentration dans la
solution solution tM)
CdCl2.2,5 H20 0,0167
ZnC12 0,0083
Thio-urée 0,025
In (OH)3 0,00025
Acide formique 9,62
Solution II
Ingrédient Concentration dans la
solution solution (M)
Cd(OH)2 0,021
(NH4)2Te 4 0,085
Cu++ 0,00064
Acide formique 9,62
On prépare l'hydroxyde de cadmium en dissolvant 20 g de Cd (NO3)2 de qualité réactif dans 100 cm3 d'eau dis- tillée et- en titrant cette solution avec une solution de
NaOH saturée, jusqu' 1 précipitation complète de Cd(OH)2. On filtre le précipité, on le lave plusieurs fois avec de l'eau et on le sèche à 8000 pendant 16 heures.TABLE 1
Solution I
Ingredient Concentration in
solution solution tM)
CdCl2.2.5 H20 0.0167
ZnC12 0.0083
Thio-urea 0.025
In (OH) 3 0,00025
Formic acid 9.62
Solution II
Ingredient Concentration in
solution solution (M)
Cd (OH) 2 0.021
(NH4) 2Te 4 0.085
Cu ++ 0,00064
Formic acid 9.62
Cadmium hydroxide is prepared by dissolving 20 g of Cd (NO3) 2 of reactive quality in 100 cm3 of distilled water and- by titrating this solution with a solution of
Saturated NaOH, up to 1 complete precipitation of Cd (OH) 2. The precipitate is filtered, washed several times with water and dried at 8000 for 16 hours.
On prépare la solution de départ pour le cuivre en attaquant de la grenaille de cuivre (d'une pureté de 99 %, fournie par la firme Fisher Scientific Co.), en dissolvant le produit obtenu dans un léger excès d'acide nitrique concentré, et en le diluant jusqu'à O,G5 M. The starting solution for copper is prepared by attacking copper shot (99% purity, supplied by the company Fisher Scientific Co.), by dissolving the product obtained in a slight excess of concentrated nitric acid, and diluting it to O, G5 M.
Tous les produits chimiques sont de qualité réactif et sont fournis par la firme Fisher Scientific Comparu, à l'ex- ception de In(OH)3, qui est ultra-pur et est fourni par la firme Ventron Corp., Alpha Division, Danvers, MA, E.U.A.,et de (NH4)2TeO4 qui est fourni sous forme de poudre par la firme Ventron. All chemicals are reactive grade and are supplied by Fisher Scientific Comparu, with the exception of In (OH) 3, which is ultra-pure and is supplied by Ventron Corp., Alpha Division, Danvers , MA, EUA, and (NH4) 2TeO4 which is supplied in powder form by the firm Ventron.
En dépit du fait qu'on utilise une grande quantité d'agent réducteur, le Te dans la solution Il demeure dans l'état d'oxydation +6, ce qui autorise une concentration de
Te plus élevée que ce qui serait possible si le Te était dans l'état ~2,très insoluble.Despite the fact that a large amount of reducing agent is used, the Te in the solution It remains in the +6 oxidation state, which allows a concentration of
Te higher than would be possible if the Te was in the ~ 2 state, very insoluble.
On purge la chambre de pulvérisation à l'intérieur de l'enceinte 32 en utilisant de l'azote . On évacue trois fois le volume de la chambre avec de l'azote, puis on purge continuellement pendant cinq minutes supplémentaires. On nettoie les substrats de verre re-sr8tus d'oxyde d'étain-indium par dégraissage par vapeur en utilisant du trichlor4thylène de qualité réactif, on les place sur le bain d'étain chauffé et en fusion, 48, et on les amène à une température comprise entre 325 et 55000 (de préférence entre 370 et 4250C, la température de 40000 étant avantageuse).On pulvérise 35 cm3 de la solution I sur les substrats chauffés, avec la buse 34, le gaz de pulvérisation circulant à 2,0 cm3/mn sous une pression de 0,70 à 0,84 bar, et le liquide étant pompé à partir de la bouteille 36 par siphonnement. On arrête la pulvérisation en arr8tant la circulation du fluide à partir de la bouteille 36.Ceci conduit à la formation de la couche 16 en ZnCdS sur la couche 14, et la réaction qui se produit sur le substrat chauffé est la suivante CdC12 + ZnCl2 + ZnCdS dopé avec In +
H2NC < =S)NH2 + > produits de réaction (1)
In(OH)3 + Agent réducteur volatils
L'indium est apparemment réduit de l'état +3 en indium métallique lorsqu'il est pulvérisé sur le substrat, et cet agent de dopage métallique rend la couche plus conductrice, sans qu'il soit nécessaire d'effectuer une opération de recuit après dépôt.The spray chamber is purged inside the enclosure 32 using nitrogen. The volume of the chamber is evacuated three times with nitrogen, then purged continuously for five more minutes. The glass substrates re-sr8tus of indium tin oxide are cleaned by vapor degreasing using reagent grade trichlor4thylene, they are placed on the heated and molten tin bath, 48, and they are brought to a temperature between 325 and 55000 (preferably between 370 and 4250C, the temperature of 40,000 being advantageous). 35 cm3 of solution I is sprayed on the heated substrates, with the nozzle 34, the spray gas circulating at 2.0 cm3 / min under a pressure of 0.70 to 0.84 bar, and the liquid being pumped from the bottle 36 by siphoning. The spraying is stopped by stopping the circulation of the fluid from the bottle 36. This leads to the formation of the layer 16 in ZnCdS on the layer 14, and the reaction which occurs on the heated substrate is as follows CdC12 + ZnCl2 + ZnCdS doped with In +
H2NC <= S) NH2 +> reaction products (1)
In (OH) 3 + Volatile reducing agent
Indium is apparently reduced from the +3 state to metallic indium when it is sprayed onto the substrate, and this metallic doping agent makes the layer more conductive, without it being necessary to carry out an annealing operation after deposit.
Immédiatement à la suite de la pulvêrisation de la solution I, on pulvérise 200 cm3 de la solution Il sur les substrats 44, dans les mêmes conditions de pulvérisation et de température, et la réaction suivante se produit sur les substrats chauffés Cd (OH)2 + (NH4)2TeO4 CdTe dopé avec Cu + + Ou + > produits de réaction (2) agent réducteur volatils
Le tellure est réduit à l'état -2, ce qui permet ++ le combiner avec le cadmium. le Ou est apparemment réduit en cuivre métallique, ce qui rend la couche plus conductrice.Immediately following the spraying of solution I, 200 cm3 of solution II are sprayed on the substrates 44, under the same spraying and temperature conditions, and the following reaction occurs on the heated substrates Cd (OH) 2 + (NH4) 2TeO4 CdTe doped with Cu + + Or +> reaction products (2) volatile reducing agent
Tellurium is reduced to the -2 state, which allows ++ to combine it with cadmium. the Ou is apparently reduced to metallic copper, which makes the layer more conductive.
Ici encore, une opération de recuit après dépôt n'est pas nécessaire. Here again, an annealing operation after deposition is not necessary.
La présence de l'agent réducteur en concentration élevée dans les deux solutions I et Il entrasse également un enlèvement des impuretés, en les convertissant en produits de réaction volatils, et on utilise l'azote, c'est-àdire un élément inerte, à la fois en tant que gaz de pulvérisation et en tant que gaz ambiant, pour éviter l'introduction parasite d'impuretés provenant de l'atmosphère. The presence of the reducing agent in high concentration in the two solutions I and II also collects a removal of the impurities, converting them into volatile reaction products, and nitrogen, that is to say an inert element, is used. both as a spray gas and as an ambient gas, to avoid the parasitic introduction of impurities from the atmosphere.
On enlève les substrats de l'élément chauffant au bout d'une durée ne dépassant pas trois minutes après la pulvérisation de la solution Il. On refroidit les substrats dans l'atmosphère purgée pendant cinq minutes, puis on les extrait de la chambre par le passage 52. The substrates are removed from the heating element after a period not exceeding three minutes after spraying solution II. The substrates are cooled in the purged atmosphere for five minutes, then extracted from the chamber through passage 52.
On applique sur la surface supérieure des substrats soumis à la pulvérisation une suspension d'Aquadag-E (25 % de graphite dans de l'eau ; fournie par la firme Acheson Colloids
Company), en utilisant un applicateur en bois, et on la fait sécher à la température ambiante. On applique la peinture à l'argent 22 sur la surface de la couche d'Aquadag-E, 18, et on fixe le fil de cuivre 24 sur la peinture 22 pour établir une connexion électrique externe. La peinture à l'argent doit etre séchée pendant plusieurs heures à la température ambiante. On connecte directement un second conducteur en cuivre 20 à l'oxyde d'étain-indium 14, en utilisant une soudure à l'indium, après avoir décapé une partie des couches 16 et 17.La concentration de cadmium dans la solution Il est supérieure à ce qui est nécessaire pour réagir avec le tellure, du fait qu'on a trouvé que le cadmium était plus volatil que le tellure pendant la pulvérisation sur le substrat chauffé.A suspension of Aquadag-E (25% graphite in water; applied by the firm Acheson Colloids) is applied to the upper surface of the substrates subjected to the spraying.
Company), using a wooden applicator, and dried at room temperature. The silver paint 22 is applied to the surface of the Aquadag-E layer 18, and the copper wire 24 is fixed to the paint 22 to establish an external electrical connection. The silver paint should be dried for several hours at room temperature. A second copper conductor 20 is directly connected to the tin-indium oxide 14, using an indium solder, after having stripped part of the layers 16 and 17. The concentration of cadmium in the solution It is higher to what is necessary to react with tellurium, since it has been found that cadmium is more volatile than tellurium during spraying on the heated substrate.
L'acide formique est un agent réducteur particulièrement utile du fait qu'il est fortement soluble dans des solutions aqueuses, et ceci permet d'augmenter la concentration de l'agent réducteur, jusqu'aux concentrations élevées qui se- sont avérées nécessaires pour obtenir les réactions d'oxydation/réduction désirées, pratiquement complètes, sur la surface du substrat chauffé. L'acide acétique constitue une alternative très avantageuse. En général, il est préférable que l'agent réducteur soit un acide organique fortement soluble dans l'eau. Formic acid is a particularly useful reducing agent since it is highly soluble in aqueous solutions, and this makes it possible to increase the concentration of the reducing agent, up to the high concentrations which have been found necessary to obtain the desired substantially complete oxidation / reduction reactions on the surface of the heated substrate. Acetic acid is a very advantageous alternative. In general, it is preferable that the reducing agent is an organic acid highly soluble in water.
La concentration d'acide formique doit être supérieure à 1 M et elle doit également être supérieure à dix fois la quantité stoechiométrique pour que les réactions d'oxydation/réduction désirées se produisent au moment du contact avec le substrat chauffé. The concentration of formic acid must be greater than 1 M and it must also be greater than ten times the stoichiometric amount for the desired oxidation / reduction reactions to occur upon contact with the heated substrate.
Le cermet Al203-Ag de la figure 2 est fabriqué par la même procédure que pour le dispositif de la figure 1, en pulvérisant une solution III (tableau 2) sur le substrat de verre 26, en utilisant les mêmes conditions de pulvérisation et de température et les mêmes caractéristiques de la buse que dans la description précédente. The Al203-Ag cermet of FIG. 2 is manufactured by the same procedure as for the device of FIG. 1, by spraying a solution III (table 2) on the glass substrate 26, using the same spraying and temperature conditions. and the same characteristics of the nozzle as in the previous description.
TABLEAU 2
Solution III
Ingrédients Concentration dans
la solution (M) Al (NO3) 3.9H20 0,003 AgNO3 0,0015
Acide formique 9,62
Ici encore, tous les produits chimiques sont de qualité réactif et sont fournis par la firme Fisher
Scientific Company.TABLE 2
Solution III
Ingredients Concentration in
solution (M) Al (NO3) 3.9H20 0.003 AgNO3 0.0015
Formic acid 9.62
Here again, all the chemicals are of reactive quality and are supplied by the firm Fisher
Scientific Company.
Le tableau suivant présente des exemples d'autres solutions qu'on peut pulvériser avec l'appareil de la figure 3:
TABLEAU 3
Solution Ingrédients Concentration dans la solution (M)
IV Bi(C2H302)3 0,01
(NH4)2TeO4 0,0150
Acide formique 9,62
V Zn(N3)2 0,21
(NH4)2Te04 0,21
Acide formique 9,62
VI AgNO3 0,1
Acide formique 9,62
VIII Cr(N03)3 0,1
Acide formique 9,62
Les réactions paraissent être les suivantes 2 Bi(C2H302)3 + Bi2Te3 + produits 3 (NH4)2TeO4 + > de réaction volatils (4)
Agent réducteur Zn(N3)2 + (NH4)2Te04 4 ZnTe + produits de (5) + acide formique réaction volatils
AgNO3 + acide formique > AgO + produits de
réaction volatils (6) Cr(NO3) + acide formique o CrO + produits de
réaction volatils (7)
On peut utiliser un élément constitutif lui-meme en tant que source d'agent de dopage métallique, en utilisant un excès de cet élément dans la pulvérisation. Par exemple, on peut augmenter la partie Cd de CdTe, de la manière décrite par l'équation suivante :
Excès de Cd(OH)2 + Cd1,01Te + (NH4)2Te04 --* produits de réaction (8)
volatils
Dans la réaction ci-dessus, pour maintenir un excès de Cd dans la couche, on doit utiliser un excès beaucoup plus grand de sel de Cd dans la solution de pulvérisation.The following table shows examples of other solutions that can be sprayed with the device in Figure 3:
TABLE 3
Solution Ingredients Concentration in solution (M)
IV Bi (C2H302) 3 0.01
(NH4) 2TeO4 0.0150
Formic acid 9.62
V Zn (N3) 2 0.21
(NH4) 2Te04 0.21
Formic acid 9.62
VI AgNO3 0.1
Formic acid 9.62
VIII Cr (N03) 3 0.1
Formic acid 9.62
The reactions appear to be as follows 2 Bi (C2H302) 3 + Bi2Te3 + products 3 (NH4) 2TeO4 +> volatile reaction (4)
Reducing agent Zn (N3) 2 + (NH4) 2Te04 4 ZnTe + products of (5) + formic acid volatile reactions
AgNO3 + formic acid> AgO + products of
volatile reaction (6) Cr (NO3) + formic acid o CrO + products
volatile reactions (7)
A constituent element itself can be used as a source of metallic doping agent, using an excess of this element in the spray. For example, we can increase the Cd part of CdTe, as described by the following equation:
Excess Cd (OH) 2 + Cd1,01Te + (NH4) 2Te04 - * reaction products (8)
volatile
In the above reaction, to maintain an excess of Cd in the layer, a much larger excess of Cd salt must be used in the spray solution.
Dans tous les exemples ci-dessus, la présence d'un agent réducteur avec une concentration élevée a également pour fonction de convertir les impuretés sous une forme volatile. In all of the above examples, the presence of a reducing agent with a high concentration also has the function of converting the impurities into a volatile form.
Autres modes de réalisation
Autres modes de réalisation entrent dans le cadre de l'invention. Par exemple, les principes exposés ci-dessus peuvent être appliqués à l'utilisation d'un agent oxydant, lorsqu'on désire qu'un élément de la couche soit dans un état d'oxydation plus élevé dans la couche que dans la matière de départ. De plus, on peut utiliser d'autres agents de dopage.Other embodiments
Other embodiments fall within the scope of the invention. For example, the principles set out above can be applied to the use of an oxidizing agent, when it is desired that an element of the layer is in a higher oxidation state in the layer than in the material departure. In addition, other doping agents can be used.
Il n'est pas nécessaire que le solvant soit de l'eau ; le méthanol constitue une alternative intéressante. The solvent need not be water; methanol is an interesting alternative.
Enfin, les principes exposés ci-dessus s'appliquent à la fabrication d'un grand nombre d'autres couches, comme par exemple HgxCd1~xTe, ZnxCdi#xS, CdS, CdSe, ZnS, ZnSe, GaAs, GaxAl1 xAs, InP, BN, alliages Ni-Co-Cr, 2n3P2 et ZnSnP2. Finally, the principles set out above apply to the manufacture of a large number of other layers, such as for example HgxCd1 ~ xTe, ZnxCdi # xS, CdS, CdSe, ZnS, ZnSe, GaAs, GaxAl1 xAs, InP, BN, Ni-Co-Cr alloys, 2n3P2 and ZnSnP2.
Il va de soi que de nombreuses autres modifications peuvent être apportées au procédé et au dispositif décrits et représentés, sans sortir du cadre de l'invention. It goes without saying that many other modifications can be made to the method and to the device described and shown, without departing from the scope of the invention.
Claims (35)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/231,128 US4336285A (en) | 1981-02-03 | 1981-02-03 | Method to synthesize and produce thin films by spray pyrolysis |
US06/231,127 US4327119A (en) | 1981-02-03 | 1981-02-03 | Method to synthesize and produce thin films by spray pyrolysis |
US06/231,138 US4338362A (en) | 1981-02-03 | 1981-02-03 | Method to synthesize and produce thin films by spray pyrolysis |
Publications (2)
Publication Number | Publication Date |
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FR2498951A1 true FR2498951A1 (en) | 1982-08-06 |
FR2498951B1 FR2498951B1 (en) | 1986-03-28 |
Family
ID=27398157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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FR8201672A Expired FR2498951B1 (en) | 1981-02-03 | 1982-02-02 | PROCESS FOR PRODUCING A THIN FILM |
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CA (1) | CA1160515A (en) |
FR (1) | FR2498951B1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0905278A1 (en) * | 1997-09-30 | 1999-03-31 | Siemens Aktiengesellschaft | Method of manufacturing a ceramic coating |
WO2006064059A1 (en) * | 2004-12-16 | 2006-06-22 | Glaverbel | Substrate with antimicrobial properties |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101098834B (en) * | 2004-12-16 | 2011-08-24 | 旭硝子欧洲玻璃公司 | Substrate with antimicrobial properties |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3148084A (en) * | 1961-08-30 | 1964-09-08 | Ncr Co | Process for making conductive film |
US3598657A (en) * | 1968-04-30 | 1971-08-10 | American Cyanamid Co | Method of platinization of a fuel cell electrode |
-
1982
- 1982-02-02 FR FR8201672A patent/FR2498951B1/en not_active Expired
- 1982-02-02 CA CA000395405A patent/CA1160515A/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3148084A (en) * | 1961-08-30 | 1964-09-08 | Ncr Co | Process for making conductive film |
US3598657A (en) * | 1968-04-30 | 1971-08-10 | American Cyanamid Co | Method of platinization of a fuel cell electrode |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0905278A1 (en) * | 1997-09-30 | 1999-03-31 | Siemens Aktiengesellschaft | Method of manufacturing a ceramic coating |
WO2006064059A1 (en) * | 2004-12-16 | 2006-06-22 | Glaverbel | Substrate with antimicrobial properties |
Also Published As
Publication number | Publication date |
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CA1160515A (en) | 1984-01-17 |
FR2498951B1 (en) | 1986-03-28 |
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