FR2495879A1 - Procede de fabrication d'un circuit imprime et circuit imprime obtenu par ce procede - Google Patents
Procede de fabrication d'un circuit imprime et circuit imprime obtenu par ce procede Download PDFInfo
- Publication number
- FR2495879A1 FR2495879A1 FR8025915A FR8025915A FR2495879A1 FR 2495879 A1 FR2495879 A1 FR 2495879A1 FR 8025915 A FR8025915 A FR 8025915A FR 8025915 A FR8025915 A FR 8025915A FR 2495879 A1 FR2495879 A1 FR 2495879A1
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- layer
- infrared
- infrared radiation
- tracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 9
- 230000002745 absorbent Effects 0.000 title claims description 11
- 239000002250 absorbent Substances 0.000 title claims description 11
- 238000010438 heat treatment Methods 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 title description 3
- 238000000576 coating method Methods 0.000 title description 3
- 239000000843 powder Substances 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 27
- 230000005855 radiation Effects 0.000 claims abstract description 23
- 238000000151 deposition Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000004781 supercooling Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000011214 refractory ceramic Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910001174 tin-lead alloy Inorganic materials 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000002386 leaching Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 230000009993 protective function Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8025915A FR2495879A1 (fr) | 1980-12-05 | 1980-12-05 | Procede de fabrication d'un circuit imprime et circuit imprime obtenu par ce procede |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8025915A FR2495879A1 (fr) | 1980-12-05 | 1980-12-05 | Procede de fabrication d'un circuit imprime et circuit imprime obtenu par ce procede |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2495879A1 true FR2495879A1 (fr) | 1982-06-11 |
| FR2495879B1 FR2495879B1 (OSRAM) | 1984-05-18 |
Family
ID=9248751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8025915A Granted FR2495879A1 (fr) | 1980-12-05 | 1980-12-05 | Procede de fabrication d'un circuit imprime et circuit imprime obtenu par ce procede |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2495879A1 (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5180611A (en) * | 1990-07-18 | 1993-01-19 | Argus International | Method for irradiation of printed wiring boards and the like |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3509317A (en) * | 1967-08-01 | 1970-04-28 | North American Rockwell | Indirect radiant heat soldering apparatus |
| FR2088990A5 (OSRAM) * | 1970-03-27 | 1972-01-07 | Owens Illinois Inc | |
| US3717742A (en) * | 1970-06-26 | 1973-02-20 | Circa Tran Inc | Method and apparatus for forming printed circuit boards with infrared radiation |
| US3836745A (en) * | 1969-03-13 | 1974-09-17 | Argus Eng Co | Soldering method |
| DE2548915A1 (de) * | 1975-10-31 | 1977-05-12 | Allg Electricitaets Ges Aeg Te | Verfahren zum aufloeten von schaltelementen auf traegerplatten |
| GB2021027A (en) * | 1978-03-23 | 1979-11-28 | Gen Electric Co Ltd | Making solder joints on printed wiring beards |
-
1980
- 1980-12-05 FR FR8025915A patent/FR2495879A1/fr active Granted
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3509317A (en) * | 1967-08-01 | 1970-04-28 | North American Rockwell | Indirect radiant heat soldering apparatus |
| US3836745A (en) * | 1969-03-13 | 1974-09-17 | Argus Eng Co | Soldering method |
| FR2088990A5 (OSRAM) * | 1970-03-27 | 1972-01-07 | Owens Illinois Inc | |
| US3717742A (en) * | 1970-06-26 | 1973-02-20 | Circa Tran Inc | Method and apparatus for forming printed circuit boards with infrared radiation |
| DE2548915A1 (de) * | 1975-10-31 | 1977-05-12 | Allg Electricitaets Ges Aeg Te | Verfahren zum aufloeten von schaltelementen auf traegerplatten |
| GB2021027A (en) * | 1978-03-23 | 1979-11-28 | Gen Electric Co Ltd | Making solder joints on printed wiring beards |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5180611A (en) * | 1990-07-18 | 1993-01-19 | Argus International | Method for irradiation of printed wiring boards and the like |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2495879B1 (OSRAM) | 1984-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TP | Transmission of property | ||
| ST | Notification of lapse |