FR2495837B1 - - Google Patents

Info

Publication number
FR2495837B1
FR2495837B1 FR8026076A FR8026076A FR2495837B1 FR 2495837 B1 FR2495837 B1 FR 2495837B1 FR 8026076 A FR8026076 A FR 8026076A FR 8026076 A FR8026076 A FR 8026076A FR 2495837 B1 FR2495837 B1 FR 2495837B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8026076A
Other languages
French (fr)
Other versions
FR2495837A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8026076A priority Critical patent/FR2495837A1/en
Publication of FR2495837A1 publication Critical patent/FR2495837A1/en
Application granted granted Critical
Publication of FR2495837B1 publication Critical patent/FR2495837B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
FR8026076A 1980-12-09 1980-12-09 Miniature packing for hybrid integrated circuit - provides capacitative coupling for certain connections using deposited electrode plates Granted FR2495837A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8026076A FR2495837A1 (en) 1980-12-09 1980-12-09 Miniature packing for hybrid integrated circuit - provides capacitative coupling for certain connections using deposited electrode plates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8026076A FR2495837A1 (en) 1980-12-09 1980-12-09 Miniature packing for hybrid integrated circuit - provides capacitative coupling for certain connections using deposited electrode plates

Publications (2)

Publication Number Publication Date
FR2495837A1 FR2495837A1 (en) 1982-06-11
FR2495837B1 true FR2495837B1 (en) 1984-09-14

Family

ID=9248827

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8026076A Granted FR2495837A1 (en) 1980-12-09 1980-12-09 Miniature packing for hybrid integrated circuit - provides capacitative coupling for certain connections using deposited electrode plates

Country Status (1)

Country Link
FR (1) FR2495837A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451845A (en) * 1981-12-22 1984-05-29 Avx Corporation Lead frame device including ceramic encapsulated capacitor and IC chip
FR2529386B1 (en) * 1982-06-29 1985-12-13 Inf Milit Spatiale Aeronaut ELECTRONIC CIRCUIT BOX HAVING A CAPACITOR
FR2547113B1 (en) * 1983-06-03 1986-11-07 Inf Milit Spatiale Aeronaut ELECTRONIC COMPONENT ENCAPSULATION BOX, RADIATION HARDENED
EP0162521A3 (en) * 1984-05-23 1986-10-08 American Microsystems, Incorporated Package for semiconductor devices
JPS61108160A (en) * 1984-11-01 1986-05-26 Nec Corp Semiconductor device with built-in capacitor and manufacture thereof
FR2584863B1 (en) * 1985-07-12 1988-10-21 Inf Milit Spatiale Aeronaut ELECTRONIC COMPONENT HARDENED WITH RESPECT TO RADIATION
FR2622346B1 (en) * 1987-10-23 1993-05-28 Eurofarad CAPACITOR FOR ELECTRONIC MICRO-CIRCUIT AND MOUNTING INCORPORATING SUCH A CAPACITOR
EP0359513A3 (en) * 1988-09-14 1990-12-19 Hitachi, Ltd. Semiconductor chip carrier and method of making it
US5563762A (en) * 1994-11-28 1996-10-08 Northern Telecom Limited Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
FR2940521B1 (en) 2008-12-19 2011-11-11 3D Plus COLLECTIVE MANUFACTURING METHOD OF ELECTRONIC MODULES FOR SURFACE MOUNTING

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2250918C2 (en) * 1971-10-27 1982-02-04 Westinghouse Electric Corp., 15222 Pittsburgh, Pa. Chip carrier for microwave power transistors and process for their manufacture
FR2456388A1 (en) * 1979-05-10 1980-12-05 Thomson Brandt ELECTRONIC CIRCUIT MICROBOX, AND HYBRID CIRCUIT HAVING SUCH A MICROBOX

Also Published As

Publication number Publication date
FR2495837A1 (en) 1982-06-11

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Legal Events

Date Code Title Description
ST Notification of lapse