FR2495837A1 - Embase de microboitier d'encapsulation et microboitier comportant une telle embase - Google Patents

Embase de microboitier d'encapsulation et microboitier comportant une telle embase Download PDF

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Publication number
FR2495837A1
FR2495837A1 FR8026076A FR8026076A FR2495837A1 FR 2495837 A1 FR2495837 A1 FR 2495837A1 FR 8026076 A FR8026076 A FR 8026076A FR 8026076 A FR8026076 A FR 8026076A FR 2495837 A1 FR2495837 A1 FR 2495837A1
Authority
FR
France
Prior art keywords
capacitor
base
micro
deposited
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8026076A
Other languages
English (en)
French (fr)
Other versions
FR2495837B1 (enrdf_load_stackoverflow
Inventor
Christian Val
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8026076A priority Critical patent/FR2495837A1/fr
Publication of FR2495837A1 publication Critical patent/FR2495837A1/fr
Application granted granted Critical
Publication of FR2495837B1 publication Critical patent/FR2495837B1/fr
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556—Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
FR8026076A 1980-12-09 1980-12-09 Embase de microboitier d'encapsulation et microboitier comportant une telle embase Granted FR2495837A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8026076A FR2495837A1 (fr) 1980-12-09 1980-12-09 Embase de microboitier d'encapsulation et microboitier comportant une telle embase

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8026076A FR2495837A1 (fr) 1980-12-09 1980-12-09 Embase de microboitier d'encapsulation et microboitier comportant une telle embase

Publications (2)

Publication Number Publication Date
FR2495837A1 true FR2495837A1 (fr) 1982-06-11
FR2495837B1 FR2495837B1 (enrdf_load_stackoverflow) 1984-09-14

Family

ID=9248827

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8026076A Granted FR2495837A1 (fr) 1980-12-09 1980-12-09 Embase de microboitier d'encapsulation et microboitier comportant une telle embase

Country Status (1)

Country Link
FR (1) FR2495837A1 (enrdf_load_stackoverflow)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518811A1 (fr) * 1981-12-22 1983-06-24 Avx Corp Dispositif a circuit integre en conteneur de ceramique
FR2529386A1 (fr) * 1982-06-29 1983-12-30 Inf Milit Spatiale Aeronaut Boitier de circuit electronique comportant un condensateur
FR2547113A1 (fr) * 1983-06-03 1984-12-07 Inf Milit Spatiale Aeronaut Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations
EP0162521A3 (en) * 1984-05-23 1986-10-08 American Microsystems, Incorporated Package for semiconductor devices
EP0180219A3 (en) * 1984-11-01 1986-12-17 Nec Corporation Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
FR2584863A1 (fr) * 1985-07-12 1987-01-16 Inf Milit Spatiale Aeronaut Composant electronique durci vis-a-vis des radiations
FR2622346A1 (fr) * 1987-10-23 1989-04-28 Eurofarad Condensateur pour micro-circuit electronique et montage incorporant un tel condensateur
EP0359513A3 (en) * 1988-09-14 1990-12-19 Hitachi, Ltd. Semiconductor chip carrier and method of making it
WO1996017386A1 (en) * 1994-11-28 1996-06-06 Northern Telecom Limited A capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2158037A1 (enrdf_load_stackoverflow) * 1971-10-27 1973-06-08 Westinghouse Electric Corp
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2158037A1 (enrdf_load_stackoverflow) * 1971-10-27 1973-06-08 Westinghouse Electric Corp
US3838443A (en) * 1971-10-27 1974-09-24 Westinghouse Electric Corp Microwave power transistor chip carrier
FR2456388A1 (fr) * 1979-05-10 1980-12-05 Thomson Brandt Microboitier de circuit electronique, et circuit hybride comportant un tel microboitier

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/78 *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518811A1 (fr) * 1981-12-22 1983-06-24 Avx Corp Dispositif a circuit integre en conteneur de ceramique
FR2529386A1 (fr) * 1982-06-29 1983-12-30 Inf Milit Spatiale Aeronaut Boitier de circuit electronique comportant un condensateur
FR2547113A1 (fr) * 1983-06-03 1984-12-07 Inf Milit Spatiale Aeronaut Boitier d'encapsulation de composant electronique, durci vis-a-vis des radiations
EP0128079A3 (en) * 1983-06-03 1985-01-09 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electronic component encapsulating housing protected against radiations
US4639826A (en) * 1983-06-03 1987-01-27 Compagnie D'informatique Militaire, Spatiale Et Aeronautique Radiation-hardened casing for an electronic component
EP0162521A3 (en) * 1984-05-23 1986-10-08 American Microsystems, Incorporated Package for semiconductor devices
US4714952A (en) * 1984-11-01 1987-12-22 Nec Corporation Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
EP0180219A3 (en) * 1984-11-01 1986-12-17 Nec Corporation Capacitor built-in integrated circuit packaged unit and process of fabrication thereof
FR2584863A1 (fr) * 1985-07-12 1987-01-16 Inf Milit Spatiale Aeronaut Composant electronique durci vis-a-vis des radiations
FR2622346A1 (fr) * 1987-10-23 1989-04-28 Eurofarad Condensateur pour micro-circuit electronique et montage incorporant un tel condensateur
EP0359513A3 (en) * 1988-09-14 1990-12-19 Hitachi, Ltd. Semiconductor chip carrier and method of making it
WO1996017386A1 (en) * 1994-11-28 1996-06-06 Northern Telecom Limited A capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
US5563762A (en) * 1994-11-28 1996-10-08 Northern Telecom Limited Capacitor for an integrated circuit and method of formation thereof, and a method of adding on-chip capacitors to an integrated circuit
US8359740B2 (en) 2008-12-19 2013-01-29 3D Plus Process for the wafer-scale fabrication of electronic modules for surface mounting

Also Published As

Publication number Publication date
FR2495837B1 (enrdf_load_stackoverflow) 1984-09-14

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