FR2493602B1 - - Google Patents
Info
- Publication number
- FR2493602B1 FR2493602B1 FR8023381A FR8023381A FR2493602B1 FR 2493602 B1 FR2493602 B1 FR 2493602B1 FR 8023381 A FR8023381 A FR 8023381A FR 8023381 A FR8023381 A FR 8023381A FR 2493602 B1 FR2493602 B1 FR 2493602B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8023381A FR2493602A1 (fr) | 1980-10-31 | 1980-10-31 | Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule |
| US06/315,269 US4425575A (en) | 1980-10-31 | 1981-10-26 | Base for encapsulating components with coplanar electrodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8023381A FR2493602A1 (fr) | 1980-10-31 | 1980-10-31 | Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2493602A1 FR2493602A1 (fr) | 1982-05-07 |
| FR2493602B1 true FR2493602B1 (enExample) | 1982-12-03 |
Family
ID=9247562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8023381A Granted FR2493602A1 (fr) | 1980-10-31 | 1980-10-31 | Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4425575A (enExample) |
| FR (1) | FR2493602A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4783697A (en) * | 1985-01-07 | 1988-11-08 | Motorola, Inc. | Leadless chip carrier for RF power transistors or the like |
| GB8701951D0 (en) * | 1987-01-29 | 1987-03-04 | M O Valve Co Ltd | Integrated circuit package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3626259A (en) * | 1970-07-15 | 1971-12-07 | Trw Inc | High-frequency semiconductor package |
| US3996603A (en) * | 1974-10-18 | 1976-12-07 | Motorola, Inc. | RF power semiconductor package and method of manufacture |
| US4063993A (en) * | 1975-07-07 | 1977-12-20 | National Semiconductor Corporation | Method of making gang bonding interconnect tape for semiconductive devices |
| DE2718267C2 (de) * | 1977-04-25 | 1983-05-19 | W.C. Heraeus Gmbh, 6450 Hanau | Verfahren zum Herstellen von Leiterrahmen |
-
1980
- 1980-10-31 FR FR8023381A patent/FR2493602A1/fr active Granted
-
1981
- 1981-10-26 US US06/315,269 patent/US4425575A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| FR2493602A1 (fr) | 1982-05-07 |
| US4425575A (en) | 1984-01-10 |