FR2493602B1 - - Google Patents

Info

Publication number
FR2493602B1
FR2493602B1 FR8023381A FR8023381A FR2493602B1 FR 2493602 B1 FR2493602 B1 FR 2493602B1 FR 8023381 A FR8023381 A FR 8023381A FR 8023381 A FR8023381 A FR 8023381A FR 2493602 B1 FR2493602 B1 FR 2493602B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8023381A
Other languages
French (fr)
Other versions
FR2493602A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8023381A priority Critical patent/FR2493602A1/fr
Priority to US06/315,269 priority patent/US4425575A/en
Publication of FR2493602A1 publication Critical patent/FR2493602A1/fr
Application granted granted Critical
Publication of FR2493602B1 publication Critical patent/FR2493602B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W76/134—
    • H10W70/093—
    • H10W70/481—
    • H10W90/00—
FR8023381A 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule Granted FR2493602A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR8023381A FR2493602A1 (fr) 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule
US06/315,269 US4425575A (en) 1980-10-31 1981-10-26 Base for encapsulating components with coplanar electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8023381A FR2493602A1 (fr) 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule

Publications (2)

Publication Number Publication Date
FR2493602A1 FR2493602A1 (fr) 1982-05-07
FR2493602B1 true FR2493602B1 (cg-RX-API-DMAC10.html) 1982-12-03

Family

ID=9247562

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8023381A Granted FR2493602A1 (fr) 1980-10-31 1980-10-31 Embase de boitier d'encapsulation de composants, a electrodes coplanaires et dispositif semiconducteur ainsi encapsule

Country Status (2)

Country Link
US (1) US4425575A (cg-RX-API-DMAC10.html)
FR (1) FR2493602A1 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4783697A (en) * 1985-01-07 1988-11-08 Motorola, Inc. Leadless chip carrier for RF power transistors or the like
GB8701951D0 (en) * 1987-01-29 1987-03-04 M O Valve Co Ltd Integrated circuit package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3626259A (en) * 1970-07-15 1971-12-07 Trw Inc High-frequency semiconductor package
US3996603A (en) * 1974-10-18 1976-12-07 Motorola, Inc. RF power semiconductor package and method of manufacture
US4063993A (en) * 1975-07-07 1977-12-20 National Semiconductor Corporation Method of making gang bonding interconnect tape for semiconductive devices
DE2718267C2 (de) * 1977-04-25 1983-05-19 W.C. Heraeus Gmbh, 6450 Hanau Verfahren zum Herstellen von Leiterrahmen

Also Published As

Publication number Publication date
FR2493602A1 (fr) 1982-05-07
US4425575A (en) 1984-01-10

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