FR2480034B1 - - Google Patents

Info

Publication number
FR2480034B1
FR2480034B1 FR8007648A FR8007648A FR2480034B1 FR 2480034 B1 FR2480034 B1 FR 2480034B1 FR 8007648 A FR8007648 A FR 8007648A FR 8007648 A FR8007648 A FR 8007648A FR 2480034 B1 FR2480034 B1 FR 2480034B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8007648A
Other languages
French (fr)
Other versions
FR2480034A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR8007648A priority Critical patent/FR2480034A1/fr
Publication of FR2480034A1 publication Critical patent/FR2480034A1/fr
Application granted granted Critical
Publication of FR2480034B1 publication Critical patent/FR2480034B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07553—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
FR8007648A 1980-04-04 1980-04-04 Procede de fabrication et de montage d'une pastille semi-conductrice et structure obtenue Granted FR2480034A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8007648A FR2480034A1 (fr) 1980-04-04 1980-04-04 Procede de fabrication et de montage d'une pastille semi-conductrice et structure obtenue

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8007648A FR2480034A1 (fr) 1980-04-04 1980-04-04 Procede de fabrication et de montage d'une pastille semi-conductrice et structure obtenue

Publications (2)

Publication Number Publication Date
FR2480034A1 FR2480034A1 (fr) 1981-10-09
FR2480034B1 true FR2480034B1 (enExample) 1984-05-25

Family

ID=9240547

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8007648A Granted FR2480034A1 (fr) 1980-04-04 1980-04-04 Procede de fabrication et de montage d'une pastille semi-conductrice et structure obtenue

Country Status (1)

Country Link
FR (1) FR2480034A1 (enExample)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1954135A1 (de) * 1969-10-28 1971-05-06 Licentia Gmbh Verfahren zum Herstellen einer Halbleiteranordnung
DE2522346C3 (de) * 1975-05-20 1978-10-26 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von Halbleiterbauelementen
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices

Also Published As

Publication number Publication date
FR2480034A1 (fr) 1981-10-09

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Legal Events

Date Code Title Description
ST Notification of lapse