FR2473801B1 - - Google Patents
Info
- Publication number
- FR2473801B1 FR2473801B1 FR8025201A FR8025201A FR2473801B1 FR 2473801 B1 FR2473801 B1 FR 2473801B1 FR 8025201 A FR8025201 A FR 8025201A FR 8025201 A FR8025201 A FR 8025201A FR 2473801 B1 FR2473801 B1 FR 2473801B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/14—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from dynamo-electric generators driven at varying speed, e.g. on vehicle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/049—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being perpendicular to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/074—Stacked arrangements of non-apertured devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
- H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Rectifiers (AREA)
- Power Conversion In General (AREA)
- Synchronous Machinery (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792950073 DE2950073A1 (de) | 1977-12-13 | 1979-12-13 | Diodenbaugruppe |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2473801A1 FR2473801A1 (fr) | 1981-07-17 |
FR2473801B1 true FR2473801B1 (fr) | 1985-03-22 |
Family
ID=6088319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8025201A Granted FR2473801A1 (fr) | 1979-12-13 | 1980-11-27 | Bloc de diodes |
Country Status (3)
Country | Link |
---|---|
US (1) | US4347543A (fr) |
JP (1) | JPS5698370A (fr) |
FR (1) | FR2473801A1 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4599636A (en) * | 1984-03-08 | 1986-07-08 | General Semiconductor Industries, Inc. | Two terminal axial lead suppressor and diode bridge device |
US4628219A (en) * | 1985-09-13 | 1986-12-09 | Sundstrand Corporation | Rectifier assembly for mounting in a rotor |
JPH02133070A (ja) * | 1988-11-12 | 1990-05-22 | Toshiba Corp | 多相全波整流回路 |
JPH07230733A (ja) * | 1994-02-16 | 1995-08-29 | Shinko Electric Ind Co Ltd | 半導体アレスタ |
US5659212A (en) * | 1994-12-16 | 1997-08-19 | Electro-Dyn Choke Corporation | Rectifier assembly for automotive alternator |
FR2748888B1 (fr) * | 1996-05-14 | 1998-06-19 | Gec Alsthom Transport Sa | Dispositif a elements semi-conducteurs de puissance |
US5673186A (en) * | 1996-07-01 | 1997-09-30 | Dsc Telecom L.P. | Apparatus for protecting multiple output rectifiers in a current-fed DC-to DC converter |
US6327128B1 (en) * | 1998-10-07 | 2001-12-04 | Electro-Dyn Electronics Corporation | Automotive bridge rectifier assembly with thermal protection |
US6621703B2 (en) | 1998-10-07 | 2003-09-16 | Electro-Dyn Electronics Corporation | Automotive bridge rectifier assembly with thermal protection |
DE10154870A1 (de) * | 2001-11-08 | 2003-06-26 | Bosch Gmbh Robert | Elektrische Maschine, vorzugsweise Drehstromgenerator für Kraftfahrzeuge |
GB0301833D0 (en) * | 2003-01-27 | 2003-02-26 | Switched Reluctance Drives Ltd | A variable reluctance generator |
US8202248B2 (en) | 2004-08-18 | 2012-06-19 | Sequana Medical Ag | Dialysis implant and methods of use |
US20070077738A1 (en) * | 2005-10-03 | 2007-04-05 | Aram Tanielian | Fabrication of small scale matched bi-polar TVS devices having reduced parasitic losses |
US7982332B2 (en) * | 2006-12-08 | 2011-07-19 | Chrysler Group Llc | Power device for a vehicle |
US8585635B2 (en) | 2012-02-15 | 2013-11-19 | Sequana Medical Ag | Systems and methods for treating chronic liver failure based on peritoneal dialysis |
FR2996694B1 (fr) * | 2012-10-04 | 2015-09-18 | Commissariat Energie Atomique | Circuit de gestion de la charge d'une batterie |
US9577459B2 (en) * | 2013-03-15 | 2017-02-21 | Sequana Medical Ag | Systems and methods for regulating inductive energy transfer to an implantable system |
CN110249389A (zh) | 2016-08-26 | 2019-09-17 | 塞奎阿纳医疗股份公司 | 用于管理和分析由可植入设备生成的数据的系统和方法 |
EP3612246B1 (fr) | 2017-05-24 | 2020-12-30 | Sequana Medical NV | Procédé, solution et appareil d'élimination directe de sodium permettant de réduire une surcharge de fluide chez des patients atteints d'insuffisance cardiaque |
US11559618B2 (en) | 2017-05-24 | 2023-01-24 | Sequana Medical Nv | Formulations and methods for direct sodium removal in patients having severe renal dysfunction |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3689826A (en) * | 1971-05-24 | 1972-09-05 | Motorola Inc | Motor vehicle power supply system |
JPS50149815U (fr) * | 1974-05-29 | 1975-12-12 | ||
US3980931A (en) * | 1975-05-30 | 1976-09-14 | Mclellan Norvel Jeff | Over voltage protector |
US4303935A (en) * | 1977-12-13 | 1981-12-01 | Robert Bosch Gmbh | Semiconductor apparatus with electrically insulated heat sink |
-
1980
- 1980-11-27 FR FR8025201A patent/FR2473801A1/fr active Granted
- 1980-12-09 US US06/214,516 patent/US4347543A/en not_active Expired - Lifetime
- 1980-12-10 JP JP17331180A patent/JPS5698370A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6327949B2 (fr) | 1988-06-06 |
JPS5698370A (en) | 1981-08-07 |
FR2473801A1 (fr) | 1981-07-17 |
US4347543A (en) | 1982-08-31 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |