FR2471724A1 - ELECTRONIC DEVICE HOUSING DEFINING AUXILIARY COMPONENTS AND METHOD FOR MANUFACTURING THE SAME - Google Patents

Abstract

THE INVENTION CONCERNS ELECTRONIC COMPONENTS. AN INTEGRATED CIRCUIT BOX, CONSTITUTED BY A DIELECTRIC MATERIAL 200, INCLUDES FOR EXAMPLE TWO CONDUCTIVE MATERIAL REGIONS 201, 203 WHICH ARE IN THE FORM OF PARALLEL PLATES SEPARATED BY A REGION OF THE DIELECTRIC MATERIAL. THIS CONFIGURATION FORM A CONDENSER 103 WHICH CONSTITUTES AN AUXILIARY DEVICE FOR AN INTEGRATED CIRCUIT 101 LODGE IN THE CASE. THE ELECTRICAL PROPERTIES OF THE BOX ITSELF ARE THUS USED TO MAKE AN AUXILIARY DEVICE ASSOCIATED WITH THE INTEGRATED CIRCUIT. APPLICATION TO THE MANUFACTURING OF INTEGRATED CIRCUITS.

Description

i

  The present invention relates to the configura-

  housings for electronic devices

  and it relates more particularly to a

  circuit which is constituted by various auxiliary devices

res.

  There is in the prior art many

  figurations for assembling an electronic device box

  all these configurations are for the sole purpose of

  sea or support an integrated circuit chip (IC). In

  certain situations, these bolt-mounting configurations

  of the prior art also perform an ancillary but similar function> which consists in serving as a structure of

  support for auxiliary devices such as

  connected to the power source or condensa-

  filters. In these cases, the auxiliary devices are reported in the existing box-mount configuration and then interconnected to the IC chip by means of

independent drivers.

  The invention relates to the realization of devices

  auxiliaries in a circuit-board format, these

  Auxiliary devices completing the circuit which is enclosed in the box. These devices may consist for example of any number of capacitors, resistors or inductors. The circuit cabinet can be constituted by the enclosure used to protect a circuit chip

  (CI) of an environment susceptible to deterioration

  rer, or it can be constituted by the support structure

  on which is mounted the IC chip.

  Ceramic is traditionally chosen for

  this application and the following description is made in

  considering ceramics as a model. However, it is possible to use another material for this application

such as glass or a polymer.

  U.S. Patent No. 3,845,365 discloses the state of the art with respect to ceramics and describes

  an improved method for producing a multi-capacitor

  discrete and economical layer using a material of the type

  vitreous ceramic for the dielectric and

  of noble metals for the electrodes, these two

  groups of substances which can be simul-

  tane to realize the discrete capacitor in a single operation. The aforementioned patent thus shows that using known methods, conductive materials,

  resistive, etc., may be subjected to cooking, inde-

  pendently or simultaneously, in a ceramic matrix

  and according to configurations that provide the characteristics

  desired electric ticks. The invention differs from

  the prior art, considering that the devices

  The resulting res can then take the form of an integrated circuit cabinet. In this way, the electrical properties of the cabinet itself are used, so that instead of simply enclosing the integrated circuit, the cabinet

  becomes a functional element of this circuit. The provisions

  auxiliaries can be made side by side, as

  shown in Figure 1, or they can be made in

  as shown by other figures. They can also

  can be formed in any part of a bot-

  although all the figures show them in the neck.

  vercle. The invention will be better understood when reading

  the following description of embodiments, and in

  Referring to the accompanying drawings in which: Fig. 1 is a cutaway representation of a double-row pin (DIP) type PCB casing having incorporated circuit elements; FIG. 2 shows the box mounting configuration for electronic devices corresponding to the invention, in which a capacitor is formed inside the box enclosing devices. FIG. 3 shows the same box as FIG.

  2, cleared of the materials that obscure the structure of the

  capacitor; FIG. 4 shows the situation in which two capacitors connected to a common conductor are made in the casing; Figure 5 shows the situation in which an inductor is made in the casing; and FIG. 6 shows the casing of FIG. 2 in which a resistor is made in the form of a layer on

the unique capacitor.

  To simplify the description of the invention,

  will not mention the exact composition of the materials or the processing times used to make the casing,

  because these factors can vary significantly depending on

  exact characteristics and component values.

  desired health. The prior art, like the aforementioned patent, offers various combinations of materials that can be used to produce the desired auxiliary device, which it

  it is a conductor, a dielectric, a condensate

  or a resistance, and a technical examination of these subjects would constitute a digression outside the scope of the invention. It should also, at this point in the

  description, to define the terminology used. Name-

  Many terms have vague meanings and are

  often and we will therefore consider, within the framework of

  description, that the adjective "driver" qualifies an element

  which conducts the electric current, such an element including the conductors as the resistive elements. The term dielectric refers to a material that transmits a field

  electric but does not conduct electricity.

  FIG. 1 shows an IC type box

  double row of pins (DIP), 100, the lower part of which

  The upper part is torn off to show the integrated circuit 101 which is enclosed in this box. The integrated circuit 101 is connected by wires 102 to circuit elements 103 and

  104 that were made in the upper part of the bowl-

  FIG. 2 shows the cross-section of the circuit element 103 (a capacitor) shown in FIG. 1, this element being incorporated into the casing which encloses an integrated circuit. As in Figure 1,

  the circuit element 103 is shown in the upper section

  of the DIPi100 cabinet. The integrated circuit 101 is fixed in a conventional manner to the casing 100 which is constituted by a dielectric material 200. The casing 100 comprises two conductive material regions 201, 203, which are in the form of two parallel plates separated by a region of the dielectric material 200. This configuration of materials thus constitutes an auxiliary device 103 which has the characteristics of a capacitor. Wires 202 and 204 connect the capacitor plates

  201 and 203 to the integrated circuit 101, through

  terminals 205 and 206. The casing 200 thus constitutes both an auxiliary device 103 and a

  casing enclosing the integrated circuit 101.

  FIG. 3 shows the same shoemaker as in FIGS. 1 and 2, cleared of the materials which mask the

  capacitor structure. Conductive materials incor-

  porées au bottier form the frames 201, 203 of the conden-

  103. The dielectric required is constituted by the insulating material of the casing 100. The integrated circuit 101 is * connected to the armatures 201, 203 of the capacitor 103 by means of

  terminals 205 and 206 which are connected to the wires

  202, 204. Although the drawing shows conductors and insulation as separate elements,

  mind that conductors and insulation form a structural

  monolithic ture which is a part of the complete package of

  the chip. It should be noted here that the auxiliary devices

  can be directly connected to the integrated circuit.

  101, instead of through terminals 205, 206 and

  202, 204. In particular, in FIG.

  The capacitor 201 can be directly connected to the underside of the integrated circuit 101 by simply removing a portion of the dielectric material 200 which

  separates these elements in Figure 2.-

  Several layers of capacitor plates can be made in a single box. Figure 4 shows two capacitors connected to a common wire. On the right side of the drawing, there is the common terminal 401 which establishes a conductive path between the common armatures 402 and the wire 403 which starts from the integrated circuit 101. Other wires 404, 405 of the IC connect the integrated circuit 101 to the terminals 406 , 407 which

  serve the remaining reinforcement 408 and 409. It is possible to use

2471724 1

  For example, the capacitors shown to filter several power supplies. Capacitors may have common reinforcements, as shown, or they may

  can be made separately.

  Capacitors are commonly used as resistors with integrated circuits. Figure 6 shows an example of a means by which these two can be incorporated.

  types of components in an IC chip package, in accordance with

  to the invention. In Fig. 6, a resistive material layer 601 is incorporated in the housing (as well as a capacitor) and is connected to an integrated circuit chip 101, as was the conductive material in the previous examples. In particular, the resistive material forms terminals 610, 611 which connect the resistor 601 to the integrated circuit 101 via respective wires 603 and

  602. The underlying capacitor, consisting of armatures

  606 and 608, is connected to the integrated circuit 101 in the manner described above, via terminals

  607, 609 and wires 604, 605, respectively.

  Any material that may be incor-

  pored into the substance of the housing can be used to form part of a circuit element. FIG. 5 shows a magnetic material 501 which increases the inductance

  of the driver 502 surrounding him. Figure 5 shows a cir-

  inductance cooker wherein wires 503 and 504 from the integrated circuit 101 are connected to the ends (on the right side and the left side of the drawing) of the inductor,

level of terminals 505 and 506.

  The housing structure that is described above can be realized in many ways. A preferred method is to provide a dielectric material layer, in the uncured state, with the basic shape of a device housing.

  electronic device, and then to train the auxiliary device (s)

  at the top of this base case. Thus, in the case of a capacitor, one would apply to the surface of the housing of

  basic electronic device a region of matter con-

  ductuator, in the uncured state, giving it the shape and size of a capacitor armature. This conductive region would be recovered by a region of dielectric material at

  uncooked state, then by another region of material con-

  uncooked conductor having the size and shape of the second capacitor armature. The resulting combination would then be covered by another layer of uncooked dielectric material to protect the auxiliary device from the surrounding environment and to complete the structure.

  electronic device boot. We would then submit

  te this complete structure to a heat treatment

  appropriate, to form a virtually monolithic

than.

  The precise details of this manufacturing procedure

  This would depend on the materials chosen to manufacture the casing as well as the precise characteristics desired for the casing and the auxiliary device. This manufacturing process may include drying or cooking of

  each layer of uncooked material, after its application

  cation, using a high temperature, under pressure or under vacuum, as well as various methods of

  to the dielectric material the shape of a box of

  tif and apply to the electronic device housing

  that basic auxiliary device structure, in the state

uncooked.

  It goes without saying that many modifications can be made to the described method and device.

  and represented without departing from the scope of the invention.

2471724 3

Claims (9)

  An electronic device cabinet comprising a monolithic structure of dielectric material in the form of an electronic device housing, characterized in that it comprises one or more conductive elements (201, 203) incorporated in the dielectric material (200), and in that each conductive element (201, 203) comprises   an electrical terminal (205, 206) which is intended to inter-   connect the conductive elements (201, 203) to obtain   various impedance characteristics.   2. Electronic device bottier according to the   claim 1, characterized in that the conductive elements   are formed by a resistive material (601) comprising   two or more electrical terminals (610, 611) in order to have resistance characteristics between the two   electrical terminals (610, 611), or more.   An electronic device housing according to claim 2, characterized in that a second dielectric material (600) is applied to the exposed surfaces of the resistive material (601) to enclose the resistive material in a substantially monolithic material structure. dielectric. 4. Electronic device housing according to   any one of claims 1 to 37 characterized in   the conductive elements comprise a plurality of flat conductive regions (201, 203) whose surfaces   are mutually parallel and are separated by a   a small amount of dielectric material (200), so as to pre-empt   experience capacitance characteristics at the electrical terminals   (205, 206) which are associated with the conductive elements (201, 203).   5. Electronic device case according to   any of claims 1 to 4, characterized in that   it comprises a magnetic material element (501) which is incorporated in the dielectric material (500); and in that one or more conductive elements are formed of conductive material (502), each element 2471724 1   conductor having two or more electrical terminals (505, 506) and surrounding the magnetic material element so as to have inductance characteristics between the electrical terminals (505, 506) which are associated with the conductive elements (502) which surround the element magnetic material (501).   6. A method of manufacturing a packaging box   electronic tif making auxiliary device function   according to any one of claims 1 to 5,   characterized in that: a dielectric material (200) in the uncured state is formed into an electronic device casing; several conductive regions are incorporated   (201, 203) in the dielectric material, according to a configuration   predetermined ration; and subjecting the dielectric material / conductive material combination to heat treatment,   to form a virtually monolithic ensemble.   7. Process according to claim 6, characterized in that the heat treatment operation is carried out by subjecting the combination to a high temperature to agglomerate it, and applying a heat treatment to the combination to form a vitreous ceramic from   of the dielectric material and to sinter the con ductrices.   8. Process according to any one of the claims   6 or 7, characterized in that the operations   following conditions: the dielectric material (200) is   in the uncured state in the form of an electrical device casing.   tronics; one or more times the operations   to apply one or more films   the conductors (201, 203) on the dielectric material, in a predetermined pattern, and applying a layer of uncooked dielectric material (200), in a predetermined pattern, on the conductive films; and thermally treating the dielectric material / conductive film combination,   to form a virtually monolithic ensemble.   9. Electronic device bottier according to the   claim 1, characterized in that the conductive elements 2471724;   (201, 203) are constituted by a conductive film trice.