FR2469259B1 - - Google Patents
Info
- Publication number
- FR2469259B1 FR2469259B1 FR7920292A FR7920292A FR2469259B1 FR 2469259 B1 FR2469259 B1 FR 2469259B1 FR 7920292 A FR7920292 A FR 7920292A FR 7920292 A FR7920292 A FR 7920292A FR 2469259 B1 FR2469259 B1 FR 2469259B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/003—Multipurpose machines; Equipment therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7920292A FR2469259A1 (en) | 1979-08-08 | 1979-08-08 | Silicone waver prodn. system - combines cutting and grinding stages into single operation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7920292A FR2469259A1 (en) | 1979-08-08 | 1979-08-08 | Silicone waver prodn. system - combines cutting and grinding stages into single operation |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2469259A1 FR2469259A1 (en) | 1981-05-22 |
FR2469259B1 true FR2469259B1 (en) | 1981-10-30 |
Family
ID=9228720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7920292A Granted FR2469259A1 (en) | 1979-08-08 | 1979-08-08 | Silicone waver prodn. system - combines cutting and grinding stages into single operation |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2469259A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667650A (en) * | 1985-11-21 | 1987-05-26 | Pq Corporation | Mounting beam for preparing wafers |
DD250892B1 (en) * | 1986-07-10 | 1988-12-14 | Pieck W Wohnbauk Veb | DEVICE FOR REMOVING SURFACES OF WORKPIECES |
US4852304A (en) * | 1987-10-29 | 1989-08-01 | Tokyo Seimtsu Co., Ltd. | Apparatus and method for slicing a wafer |
DE3737540C1 (en) * | 1987-11-05 | 1989-06-22 | Mueller Georg Nuernberg | Method and machine for producing round blanks with at least one flat surface |
US5111622A (en) * | 1989-05-18 | 1992-05-12 | Silicon Technology Corporation | Slicing and grinding system for a wafer slicing machine |
JPH0767692B2 (en) * | 1989-09-07 | 1995-07-26 | 株式会社東京精密 | Cutting method of slicing machine |
US5185956A (en) * | 1990-05-18 | 1993-02-16 | Silicon Technology Corporation | Wafer slicing and grinding system |
DE4134110A1 (en) * | 1991-10-15 | 1993-04-22 | Wacker Chemitronic | Slicing of hard, brittle materials, esp. semiconductor rods - by rotary sawing process avoiding centre damage |
JP3060445B2 (en) * | 1992-07-16 | 2000-07-10 | 株式会社東京精密 | Semiconductor wafer slicing method and apparatus |
JP3174484B2 (en) * | 1995-06-30 | 2001-06-11 | 株式会社東京精密 | Surface grinding inner peripheral blade cutting compound machine |
-
1979
- 1979-08-08 FR FR7920292A patent/FR2469259A1/en active Granted
Also Published As
Publication number | Publication date |
---|---|
FR2469259A1 (en) | 1981-05-22 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |