FR2469259A1 - Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede - Google Patents

Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede Download PDF

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Publication number
FR2469259A1
FR2469259A1 FR7920292A FR7920292A FR2469259A1 FR 2469259 A1 FR2469259 A1 FR 2469259A1 FR 7920292 A FR7920292 A FR 7920292A FR 7920292 A FR7920292 A FR 7920292A FR 2469259 A1 FR2469259 A1 FR 2469259A1
Authority
FR
France
Prior art keywords
ingot
saw
grinding wheel
axis
sawing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7920292A
Other languages
English (en)
French (fr)
Other versions
FR2469259B1 (enExample
Inventor
Pierre Leger
Hubert Lauvray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7920292A priority Critical patent/FR2469259A1/fr
Publication of FR2469259A1 publication Critical patent/FR2469259A1/fr
Application granted granted Critical
Publication of FR2469259B1 publication Critical patent/FR2469259B1/fr
Granted legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
FR7920292A 1979-08-08 1979-08-08 Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede Granted FR2469259A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7920292A FR2469259A1 (fr) 1979-08-08 1979-08-08 Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7920292A FR2469259A1 (fr) 1979-08-08 1979-08-08 Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede

Publications (2)

Publication Number Publication Date
FR2469259A1 true FR2469259A1 (fr) 1981-05-22
FR2469259B1 FR2469259B1 (enExample) 1981-10-30

Family

ID=9228720

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7920292A Granted FR2469259A1 (fr) 1979-08-08 1979-08-08 Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede

Country Status (1)

Country Link
FR (1) FR2469259A1 (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0313714A1 (en) * 1987-10-29 1989-05-03 Tokyo Seimitsu Co.,Ltd. Apparatus and method for slicing a wafer
FR2622820A1 (fr) * 1987-11-05 1989-05-12 Mueller Georg Nuernberg Procede et dispositif de fabrication de pastilles presentant au moins une surface plane
EP0223249A3 (en) * 1985-11-21 1989-08-09 Pq Corporation Mounting beam for preparing wafers
EP0253194A3 (de) * 1986-07-10 1990-01-31 VE Wohnungsbaukombinat "Wilhelm Pieck" Karl-Marx-Stadt Vorrichtung zum Fräsen der Sichtflächen von Werkstücken
EP0398467A3 (en) * 1989-05-18 1992-01-02 Silicon Technology Corporation A slicing and grinding system for a wafer slicing machine
EP0417644A3 (en) * 1989-09-07 1992-05-27 Tokyo Seimitsu Co.,Ltd. Method of slicing cylindrical material into wafers
US5185956A (en) * 1990-05-18 1993-02-16 Silicon Technology Corporation Wafer slicing and grinding system
EP0579227A1 (en) * 1992-07-16 1994-01-19 Tokyo Seimitsu Co.,Ltd. Method and apparatus for slicing semiconductor wafer
US5351446A (en) * 1991-10-15 1994-10-04 Wacker-Chemtronic Gesellschaft fur Elecktronik-Grundstoffe mbH Method and apparatus for the rotary sawing of brittle and hard materials
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0223249A3 (en) * 1985-11-21 1989-08-09 Pq Corporation Mounting beam for preparing wafers
EP0253194A3 (de) * 1986-07-10 1990-01-31 VE Wohnungsbaukombinat "Wilhelm Pieck" Karl-Marx-Stadt Vorrichtung zum Fräsen der Sichtflächen von Werkstücken
EP0313714A1 (en) * 1987-10-29 1989-05-03 Tokyo Seimitsu Co.,Ltd. Apparatus and method for slicing a wafer
FR2622820A1 (fr) * 1987-11-05 1989-05-12 Mueller Georg Nuernberg Procede et dispositif de fabrication de pastilles presentant au moins une surface plane
EP0398467A3 (en) * 1989-05-18 1992-01-02 Silicon Technology Corporation A slicing and grinding system for a wafer slicing machine
EP0417644A3 (en) * 1989-09-07 1992-05-27 Tokyo Seimitsu Co.,Ltd. Method of slicing cylindrical material into wafers
US5185956A (en) * 1990-05-18 1993-02-16 Silicon Technology Corporation Wafer slicing and grinding system
US5351446A (en) * 1991-10-15 1994-10-04 Wacker-Chemtronic Gesellschaft fur Elecktronik-Grundstoffe mbH Method and apparatus for the rotary sawing of brittle and hard materials
EP0579227A1 (en) * 1992-07-16 1994-01-19 Tokyo Seimitsu Co.,Ltd. Method and apparatus for slicing semiconductor wafer
US5524604A (en) * 1992-07-16 1996-06-11 Tokyo Seimitsu Co., Ltd. Method and apparatus for slicing semiconductor wafers
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder
US5836808A (en) * 1995-06-30 1998-11-17 Tokyo Seimitsu Co., Ltd. Slicing machine with built-in grinder

Also Published As

Publication number Publication date
FR2469259B1 (enExample) 1981-10-30

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