FR2426334B1 - - Google Patents

Info

Publication number
FR2426334B1
FR2426334B1 FR7814918A FR7814918A FR2426334B1 FR 2426334 B1 FR2426334 B1 FR 2426334B1 FR 7814918 A FR7814918 A FR 7814918A FR 7814918 A FR7814918 A FR 7814918A FR 2426334 B1 FR2426334 B1 FR 2426334B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7814918A
Other versions
FR2426334A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to FR7814918A priority Critical patent/FR2426334A1/fr
Publication of FR2426334A1 publication Critical patent/FR2426334A1/fr
Application granted granted Critical
Publication of FR2426334B1 publication Critical patent/FR2426334B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528Geometry or layout of the interconnection structure
    • H01L23/5286Arrangements of power or ground buses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
FR7814918A 1978-05-19 1978-05-19 Dispositif de connexion de semi-conducteurs et son procede de fabrication Granted FR2426334A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7814918A FR2426334A1 (fr) 1978-05-19 1978-05-19 Dispositif de connexion de semi-conducteurs et son procede de fabrication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7814918A FR2426334A1 (fr) 1978-05-19 1978-05-19 Dispositif de connexion de semi-conducteurs et son procede de fabrication

Publications (2)

Publication Number Publication Date
FR2426334A1 FR2426334A1 (fr) 1979-12-14
FR2426334B1 true FR2426334B1 (fr) 1982-12-17

Family

ID=9208468

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7814918A Granted FR2426334A1 (fr) 1978-05-19 1978-05-19 Dispositif de connexion de semi-conducteurs et son procede de fabrication

Country Status (1)

Country Link
FR (1) FR2426334A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594050A (ja) * 1982-06-30 1984-01-10 Fujitsu Ltd 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2170846B1 (fr) * 1972-02-03 1975-10-24 Garyainov Stanislav
US3808475A (en) * 1972-07-10 1974-04-30 Amdahl Corp Lsi chip construction and method
US3861023A (en) * 1973-04-30 1975-01-21 Hughes Aircraft Co Fully repairable integrated circuit interconnections

Also Published As

Publication number Publication date
FR2426334A1 (fr) 1979-12-14

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Legal Events

Date Code Title Description
ST Notification of lapse